A separating fluid, method and use for separating multilayer systems, especially photovoltaic modules, for the purpose of recycling, which allow the separation of multilayer systems. Especially photovoltaic modules, in comparatively simple manner in terms of the processes used, in as environmentally friendly a manner as possible, at high recycling rates. For this purpose, the separating fluid is a nanoscale dispersion or a precursor thereof.

A peeling apparatus includes an ingot holding unit holding an ingot in a hanging state where a portion of the ingot to be peeled off as the wafer is directed downwardly, a water container containing water therein, an ultrasonic unit immersed in the water in the water container, a moving unit moving the ingot holding unit vertically into a position where the ingot holding unit faces the ultrasonic unit and at least the portion of the ingot to be peeled off as the wafer is immersed in the water in the water container, and a nozzle ejecting water to the portion of the ingot to be peeled off as the wafer thereby to promote the peeling of the wafer from the ingot.

The present disclosure provides a method for separation of an organic film from a solar cell module, the separation method including the following steps: treating the solar cell module by a heat treatment in combination with a ultrasonic treatment; and performing separation of the treated solar cell module by buoyancy, thereby achieving the separation of the organic film from the module. The present disclosure uses the heat treatment in combination with the ultrasonic treatment to separate the organic film of the solar cell module, so that a stripping rate of the solar cell module reaches 97% or more, and the organic film after detachment does not adhere to the active material, the active material layer remains intact, the surface is clean and has no gelatin spots, and a loss rate is 1% or less, and thus the method is efficient, convenient, and easy to industrialize.

An extractor system for extracting an object secured to another object or a base surface is disclosed, which may include an oscillator, an attachment base, and an oscillation control mechanism to limit the transmission of oscillation forces after the object has become unsecured, and preserve the target object in good condition. The attachment base may be a vacuum suction cup or temporary adhesive. The control system may be a mechanical lifting system or an electronic control adapted to cease or minimize application of vibrational force when the object becomes unsecured. Methods of extracting an object or separating two objects secured to each other are also disclosed, including identification or creation of partial unbonded areas beneath the target object to initiate the de-bonding process prior to application of vibrational forces.

A method for separating and recovering a layered film laminated and adhered with a reactive adhesive, the method including a step 1 of immersing the layered film in an alkaline solution while stirring the layered film with heating at 20? C. to 90? C. or ultrasonically vibrating the layered film and a step 2 of recovering separated single-layered films that constitute the respective layers of the layered film. The reactive adhesive is preferably a reactive adhesive containing a polyisocyanate composition and a polyol composition and more preferably a reactive adhesive containing a polyisocyanate composition, a polyol composition, and a compound having an acidic group.

A peeling apparatus includes an ingot holding unit holding an ingot in a hanging state where a portion of the ingot to be peeled off as the wafer is directed downwardly, a water container containing water therein, an ultrasonic unit immersed in the water in the water container, a moving unit moving the ingot holding unit vertically into a position where the ingot holding unit faces the ultrasonic unit and at least the portion of the ingot to be peeled off as the wafer is immersed in the water in the water container, and a nozzle ejecting water to the portion of the ingot to be peeled off as the wafer thereby to promote the peeling of the wafer from the ingot.

An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.

An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.

A system according to the principles of the present disclosure includes at least one bracket and at least one vibrator. The at least one bracket is configured to be mounted to a pallet adjacent to a stack of panels disposed on the pallet. The at least one vibrator is attached to the at least one bracket and configured to induce vibration on the stack of panels to disrupt an adhesive bond between adjacent panels in the stack of panels.

An extractor system for extracting an object secured to another object or a base surface is disclosed, which may include an oscillator, an attachment base, and an oscillation control mechanism to limit the transmission of oscillation forces after the object has become unsecured, and preserve the target object in good condition. The attachment base may be a vacuum suction cup or temporary adhesive. The control system may be a mechanical lifting system or an electronic control adapted to cease or minimize application of vibrational force when the object becomes unsecured. Methods of extracting an object or separating two objects secured to each other are also disclosed, including identification or creation of partial unbonded areas beneath the target object to initiate the de-bonding process prior to application of vibrational forces.