A cell cutting device and a cell cutting method are disclosed. The cell cutting device includes a loading stage configured to load a display sheet including a plurality of display cells, a rotation driving unit connected to the loading stage and configured to rotate the loading stage and to separate the display sheet into the plurality of display cells, and a position change unit connected to the loading stage and configured to change a position of the loading stage.

A system and a method include breaking a sheet of frozen pizza into individual pieces for packaging. In an embodiment, the frozen pizza sheet includes five individual pieces separated by frangible lines. The breaking process includes a first step, wherein two end pieces are broken off by a first breaking mechanism, and a second step, wherein two additional end pieces are broken off a remainder of the frozen pizza sheet by a second breaking mechanism arranged downstream of the first breaking mechanism. In preferred embodiments, each breaking mechanism includes multiple holding wheels and multiple camming wheel rotatably mounted on a common driven axle.

A cutter edge is caused to slide to generate a plastic deformation on a first surface of a brittle substrate, thus forming a trench line. The trench line is formed so as to obtain a crack-free state in which the brittle substrate seamlessly continues in a direction intersecting the trench line directly below the trench line. The crack-free state is then maintained. A crack of the brittle substrate in its thickness direction is extended along the trench line to form a crack line. The brittle substrate is divided along the crack line.

A dividing device divides a wafer from an ingot by slicing the ingot by using a dividing layer which is formed by relatively moving a laser beam to a predetermined depth of the ingot from one of both end faces of the ingot. The dividing device for a wafer includes: first fixing part that fixes the other of the both end faces of the ingot; second fixing part that is arranged on a first central axis line of the ingot so as to face the first fixing part and fixes the one of the both end faces of the ingot; and tension part that apply a tensile force to the ingot via the first and second fixing parts. The tension part rotates one end of the dividing layer with another end as a fulcrum so as to generate moments for slicing the ingot with the dividing layer as a boundary.

A device and method for cleaving a sample includes: creating an indentation on a top surface of the sample by applying a downward force along a vertical axis, the axis arranging perpendicularly to the top surface of the sample; providing a breaking pin and arranging the breaking pin under the sample to touch the bottom surface of the sample at a position that is directly opposite from the indentation; and, applying a downward force on the sample by providing a left side and right side breaker pin wherein the downward force comprises a left-side downward force extended through the left-side breaker pin and right-side downward force through the right side breaker pin, further the pins that provide the left-side and right-side downward force are disposed on a breaker bar and arranged to be on opposite sides of a vertical axis that extends through the indentation on the top surface.

A method for forming a hole in a glass or glass-ceramic sheets includes scoring a major surface of a glass or glass-ceramic sheet to define the hole, placing the sheet on receiving surface of a mount where a cavity is formed in the receiving surface such that a peripheral edge of the cavity is positioned external to the area bounded by the first score, and fracturing the sheet along the first score to break away the portion of the sheet defined by the first score, wherein the broken away portion of the sheet is contained within the cavity.

The disclosure provides a method for forming a hole in a glass or glass-ceramic sheets. The method includes scoring a major surface of a glass or glass-ceramic sheet to define the hole, placing the sheet on a cavity-containing receiving surface such that a peripheral edge of the cavity is positioned external to the area bounded by the first score, and fracturing the sheet along the score to break away the portion of the sheet defined by the first score. The method allows for the formation of large openings in thin glass sheets where the mother sheet is not broken or damaged by the formation of the opening.

A system and method for breaking a sheet of frozen pizza into individual pieces for packaging is disclosed. In an embodiment, the frozen pizza sheet includes five individual pieces separated by frangible lines. The breaking process includes a first step, wherein two end pieces are broken off by a first breaking mechanism, and a second step, wherein two additional end pieces are broken off a remainder of the frozen pizza sheet by a second breaking mechanism arranged downstream of the first breaking mechanism. In preferred embodiments, each breaking mechanism includes multiple holding wheels and multiple camming wheel rotatably mounted on a common driven axle.

A cutter edge is caused to slide to generate a plastic deformation on a first surface of a brittle substrate, thus forming a trench line. The trench line is formed so as to obtain a crack-free state in which the brittle substrate seamlessly continues in a direction intersecting the trench line directly below the trench line. The crack-free state is then maintained. A crack of the brittle substrate in its thickness direction is extended along the trench line to form a crack line. The brittle substrate is divided along the crack line.

A device and method for cleaving a sample includes: creating an indentation on a top surface of the sample by applying a downward force along a vertical axis, the axis arranging perpendicularly to the top surface of the sample; providing a breaking pin and arranging the breaking pin under the sample to touch the bottom surface of the sample at a position that is directly opposite from the indentation; and, applying a downward force on the sample by providing a left side and right side breaker pin wherein the downward force comprises a left-side downward force extended through the left-side breaker pin and right-side downward force through the right side breaker pin, further the pins that provide the left-side and right-side downward force are disposed on a breaker bar and arranged to be on opposite sides of a vertical axis that extends through the indentation on the top surface.