A precast hole scab removing device is provided. The precast hole scab removing device is composed of a stand, floating columns, ejector pins, an air cylinder, clamp cylinders, supporting poles and the like. In use, a hole I and a hole II in a workpiece respectively match with a tapered part of a left floating column and a tapered part of a right floating column; by pressing down the workpiece, locating parts of the workpiece simultaneously match with the top end of a supporting pole I, the top end of a supporting pole II and the top end of a supporting pole III, a clamp cylinder I, a clamp cylinder II and a clamp cylinder III press the workpiece tightly, and at the moment, the workpiece is completely located; the air cylinder lifts down a lifting plate and the ejector pins through two guide pillars, the ejector pins are pressed into holes, in which scabs need to be removed, of the workpiece; and therefore, the scabs can be ejected out of the workpiece. The precast hole scab removing device can remove the scabs of precast holes of casting workpieces in use, the removing efficiency is high, the scabs are removed cleanly, and additionally, the precast hole scab removing device has the characteristics of high automation degree, simple structure, low manufacturing costs and the like.

A device capable of separating a remnant from a product part irrespective of a shape of the remnant. The device includes a first attraction part which attracts a first part and is moved downward; a second attraction part provided movable relative to the first attraction part to attract a second part; a jig which comes into contact with a back surface of the second part to prevent the second part from moving downward; and further a position maintaining part which maintains a position of the second attraction part relative to the first attraction part when the first attraction part is moved downward to separate the first part from the second part.

A method for forming an electronic device includes providing a wafer having a plurality of die formed as part of the wafer and separated from each other by spaces. A layer of material is disposed atop a major surface of the wafer and the layer of material is placed adjacent to first carrier substrate comprising a first adhesive layer. The wafer is singulated through the spaces to form singulation lines. A second carrier substrate comprising a second adhesive layer is placed onto an opposite major surface of the wafer. The method includes moving a mechanical device adjacent to and in a direction generally parallel to one of the first carrier substrate or the second carrier substrate to separate the layer of material in the singulation lines. In one example, the second adhesive layer has an adhesive strength that is less than that of the first adhesive layer.

A method for forming an electronic device includes providing a wafer having a plurality of die formed as part of the wafer and separated from each other by spaces. A layer of material is disposed atop a major surface of the wafer and the layer of material is placed adjacent to first carrier substrate comprising a first adhesive layer. The wafer is singulated through the spaces to form singulation lines. A second carrier substrate comprising a second adhesive layer is placed onto an opposite major surface of the wafer. The method includes moving a mechanical device adjacent to and in a direction generally parallel to one of the first carrier substrate or the second carrier substrate to separate the layer of material in the singulation lines. In one example, the second adhesive layer has an adhesive strength that is less than that of the first adhesive layer.

A field-pole magnet manufacturing apparatus fractures a magnet fixed on a die serving as a lower tool by causing a punch of an upper tool to press the magnet while in contact with the magnet. At least one projection is formed in the punch of the upper tool symmetrically with respect to the central position of the magnet in the width direction of the magnet.

A method for forming an electronic device includes providing a wafer having a plurality of die formed as part of the wafer and separated from each other by spaces. A layer of material is disposed atop a major surface of the wafer and the layer of material is placed adjacent to first carrier substrate comprising a first adhesive layer. The wafer is singulated through the spaces to form singulation lines. A second carrier substrate comprising a second adhesive layer is placed onto an opposite major surface of the wafer. The method includes moving a mechanical device adjacent to and in a direction generally parallel to one of the first carrier substrate or the second carrier substrate to separate the layer of material in the singulation lines. In one example, the second adhesive layer has an adhesive strength that is less than that of the first adhesive layer.

A precast hole scab removing device is provided. The precast hole scab removing device is composed of a stand, floating columns, ejector pins, an air cylinder, clamp cylinders, supporting poles and the like. In use, a hole I and a hole II in a workpiece respectively match with a tapered part of a left floating column and a tapered part of a right floating column; by pressing down the workpiece, locating parts of the workpiece simultaneously match with the top end of a supporting pole I, the top end of a supporting pole II and the top end of a supporting pole III, a clamp cylinder I, a clamp cylinder II and a clamp cylinder III press the workpiece tightly, and at the moment, the workpiece is completely located; the air cylinder lifts down a lifting plate and the ejector pins through two guide pillars, the ejector pins are pressed into holes, in which scabs need to be removed, of the workpiece; and therefore, the scabs can be ejected out of the workpiece. The precast hole scab removing device can remove the scabs of precast holes of casting workpieces in use, the removing efficiency is high, the scabs are removed cleanly, and additionally, the precast hole scab removing device has the characteristics of high automation degree, simple structure, low manufacturing costs and the like.

A method for forming an electronic device includes providing a wafer having a plurality of die formed as part of the wafer and separated from each other by spaces. A layer of material is disposed atop a major surface of the wafer and the layer of material is placed adjacent to first carrier substrate comprising a first adhesive layer. The wafer is singulated through the spaces to form singulation lines. A second carrier substrate comprising a second adhesive layer is placed onto an opposite major surface of the wafer. The method includes moving a mechanical device adjacent to and in a direction generally parallel to one of the first carrier substrate or the second carrier substrate to separate the layer of material in the singulation lines. In one example, the second adhesive layer has an adhesive strength that is less than that of the first adhesive layer.

Die are singulated from a wafer having a back layer by placing the wafer onto a first carrier substrate with the back layer adjacent the carrier substrate, forming singulation lines through the wafer to expose the back layer within the singulation lines, and using a plate structure to apply a pressure to the wafer to separate the back layer in the singulation lines. The pressure can be applied through the first carrier substrate proximate to the back layer, or can be applied through a second carrier substrate attached to a front side of the wafer opposite to the back layer.

Die are singulated from a wafer having a back layer by placing the wafer onto a first carrier substrate with the back layer adjacent the carrier substrate, forming singulation lines through the wafer to expose the back layer within the singulation lines, and using a plate structure to apply a pressure to the wafer to separate the back layer in the singulation lines. The pressure can be applied through the first carrier substrate proximate to the back layer, or can be applied through a second carrier substrate attached to a front side of the wafer opposite to the back layer.