An electrostatic chuck of an embodiment includes a base, a dielectric layer, and a chuck main body. The dielectric layer is provided on the base, and is fixed to the base. The chuck main body is mounted on the dielectric layer. The chuck main body has a ceramic main body, a first electrode, a second electrode, and a third electrode. The ceramic main body has a substrate mounting region. The first electrode is provided in the substrate mounting region. The second electrode and the third electrode form a bipolar electrode. The second electrode and the third electrode are provided in the ceramic main body, and are provided between the first electrode and the dielectric layer.

A tool gripping mechanism includes a tool holder and a shaft to which the tool holder is attached. The shaft is fixed to a rotary shaft of a spindle device. A plurality of magnets are disposed in pairs on concentric circles on surfaces of the tool holder and the shaft which face each other. When the tool holder is in a specific phase with respect to the shaft, the magnets of the tool holder and the magnets of the shaft attract each other, and the tool holder is aligned with respect to the shaft in that phase.

A wafer support device includes a susceptor, at least one lift pin, at least one lift pin support base and at least one pad. The susceptor has a bottom surface and a top surface configured to support a wafer. The susceptor has at least one through hole extending between the bottom surface and the top surface. The lift pin is at least partially telescopically received in the through hole of the susceptor. The lift pin support base has at least one coupling feature thereon. The pad is detachably coupled with the coupling feature and supports the lift pin.

A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.

Methods and apparatus for bonding an electrostatic chuck to a component of a substrate support are provided herein. In some embodiments, an adhesive for bonding components of a substrate support may include a matrix of silicon-based polymeric material having a filler dispersed therein. The silicon based polymeric material may be a polydimethylsiloxane (PDMS) structure having a molecular weight with a low molecular weight (LMW) content Σ D3-D10 of less than about 500 ppm. In some embodiments, the filler may comprise between about 50 to about 70 percent by volume of the adhesive layer. In some embodiments, the filler may comprise particles of aluminum oxide (Al.sub.2O.sub.3), aluminum nitride (AlN), yttrium oxide (Y.sub.2O.sub.3), or combinations thereof. In some embodiments, the filler may comprise particles having a diameter of about 10 nanometers to about 10 microns.

An electrostatic chuck is disclosed. In one aspect, the electrostatic chuck includes a top plate, wherein first and second regions adjacent to each other are formed at a surface of the top plate. The electrostatic chuck also includes a first absorption plate positioned at the first region and a second absorption plate positioned at the second region to be separated from the first absorption plate. The first and second absorption plates are configured to support the absorption target.

An electrically-adjustable tool holder precisely movable in a straight line within a magnetic field under electrical stimulation includes a handle body, a connecting member, and a driving member. The connecting member has a first end securely coupled to an end of the handle body, a second end opposite to the first end, and defines a through hole passing through the first end and the second end. The driving member includes a magnet securely received in the through hole, and an electrical electric coil movably received in the magnet. The electric coil is configured to be securely coupled to the tool, and moves the tool up or down along the central axis of the handle body.

A multiple tool for a punching device, in particular for a turret punch press has a housing and a tool head interacting with the punching device. A thread cutter magazine including a plurality of thread cutters is connected to the tool head. A selection device is provided to select an active thread cutter which interacts with a workpiece for thread cutting. A thread cutter drive device is provided to drive the active thread cutter. As a result, a multiple tool is obtained which expands the range of applications of a punching device.

A tool connector generally includes a tool receiving portion configured for reciprocating between first and second work tool seating positions, wherein the tool receiving portion is normally biased to the first work tool seating position, and actuatable to the second work tool seating position. The tool connector further includes a magnetic mechanism in the tool receiving portion for providing magnetic force to engage a work tool in either of the first and second work tool seating positions, and a locking mechanism for lockingly engaging a work tool in the second work tool seating position.

Disclosed are: an electrostatic chuck having a high volume resistivity so as to reduce a leakage current, thereby improving the adsorption and desorption response characteristics of a semiconductor wafer; and a manufacturing method therefor. The electrostatic chuck is a sintered body in which an electrode is impregnated so as to fix a semiconductor wafer by electrostatic force, and comprises alumina, a sintering aid, and a rare earth composite oxide comprising two to five different rare earth metals, has adsorption and desorption response characteristics of a semiconductor wafer of two seconds or less, and has a volume resistivity at room temperature of 1.0E+16 Ω.Math.cm to 1.0E+17 Ω.Math.cm.