A system and method concurrently processes multiple wafers. A cassette structure includes multiple chucks and a drive spool for supporting and rotating the chucks. Each chuck holds a wafer in position while rotating. The cassette structure is loaded into a process chamber. Each chuck includes a self-locking mechanism that is activated by the centrifugal force generated from the rotation of the chuck. The self-locking mechanism centers and holds a wafer in position with respect to the chuck. A drive motor drives the drive spool, which causes the chucks to rotate. As the chucks are being rotated, a dispensing assembly delivers a processing chemical to the wafers.

The described embodiments relate generally to methods of assembly of electronic devices. In particular, a rotationally induced pressure is used to activate a securing mechanism positioned between a component and an enclosure. The component and the securing mechanism may be located in an inaccessible region of the enclosure such that traditional, direct, assembly processes may not be feasible. The securing mechanism may take the form of a layer of pressure sensitive adhesive or a fastener between the component and an interior surface of the enclosure.