Methods and apparatus for bonding an electrostatic chuck to a component of a substrate support are provided herein. In some embodiments, an adhesive for bonding components of a substrate support may include a matrix of silicon-based polymeric material having a filler dispersed therein. The silicon based polymeric material may be a polydimethylsiloxane (PDMS) structure having a molecular weight with a low molecular weight (LMW) content Σ D3-D10 of less than about 500 ppm. In some embodiments, the filler may comprise between about 50 to about 70 percent by volume of the adhesive layer. In some embodiments, the filler may comprise particles of aluminum oxide (Al.sub.2O.sub.3), aluminum nitride (AlN), yttrium oxide (Y.sub.2O.sub.3), or combinations thereof. In some embodiments, the filler may comprise particles having a diameter of about 10 nanometers to about 10 microns.

The present disclosure relates to a tool holder to receive and lock a tool taper on a tool magazine, an unlocking device to unlock a tool taper that is received and is locked in a tool holder of this type, and a tool magazine for a machine tool comprising one or more tool holders of this type and an unlocking device of this type.

An apparatus for processing wafer-shaped articles comprises a spin chuck adapted to hold and spin a wafer-shaped article of a predetermined diameter during a processing operation. A liquid collector surrounds the spin chuck, and comprises a first inner surface. The first inner surface comprises a first conductive material. The collector further comprises a first conductive pathway for grounding the first conductive material.

A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

Electronic device fabrication processes, apparatuses and systems for flowable gap fill or flowable deposition techniques are described. In some implementations, a semiconductor fabrication chamber is described which is configured to maintain a semiconductor wafer at a temperature near 0° C. while maintaining most other components within the fabrication chamber at temperatures on the order of 5-10° C. or higher than the wafer temperature.

A heat exchanger within an insulated enclosure receives primary refrigerant at a high pressure and cools the primary refrigerant using a secondary refrigerant from a secondary refrigeration system. An expansion unit within the insulated enclosure receives the primary refrigerant at the high pressure from the heat exchanger and discharges the primary refrigerant at a low pressure. A supply line delivers the primary refrigerant at the low pressure to the load and a return line returns the primary refrigerant from the load to the primary refrigeration system. A system control unit controls operation of at least one of the primary refrigeration system and the secondary refrigeration system to provide a variable refrigeration capacity to the load based on at least one of: a pressure of the primary refrigerant delivered to the load, and at least one temperature of the load.

A power tool is provided and includes a housing, a motor, a gear case, a bearing assembly, and a chuck assembly. The motor is disposed in the housing and defines an axis of rotation. The gear case is coupled to the motor and includes a proximal end and a distal end. The proximal end of the gear case is coupled to the housing. The bearing assembly extends from the distal end of the gear case along the axis of rotation and supports a driveshaft for rotation about the axis of rotation. The chuck assembly is rotatably coupled to the driveshaft and includes a chuck sleeve annularly surrounding the bearing assembly about the axis of rotation.

A heat exchanger within an insulated enclosure receives primary refrigerant at a high pressure and cools the primary refrigerant using a secondary refrigerant from a secondary refrigeration system. An expansion unit within the insulated enclosure receives the primary refrigerant at the high pressure from the heat exchanger and discharges the primary refrigerant at a low pressure. A supply line delivers the primary refrigerant at the low pressure to the load and a return line returns the primary refrigerant from the load to the primary refrigeration system. A system control unit controls operation of at least one of the primary refrigeration system and the secondary refrigeration system to provide a variable refrigeration capacity to the load based on at least one of: a pressure of the primary refrigerant delivered to the load, and at least one temperature of the load.

In accordance with an embodiment of the invention, there is provided a system for cooling a load. The system comprises a closed loop primary refrigeration system comprising: a primary compressor taking in a primary refrigerant at a low pressure and discharging the primary refrigerant at a high pressure; an insulated enclosure comprising an inlet receiving the primary refrigerant at the high pressure from the primary compressor and an outlet returning the primary refrigerant at the low pressure to the primary compressor; at least one heat exchanger within the insulated enclosure receiving the primary refrigerant at the high pressure and cooling the primary refrigerant using a secondary refrigerant from a secondary refrigeration system, the secondary refrigerant being in heat exchange relationship with the primary refrigerant in the at least one heat exchanger; an expansion unit within the insulated enclosure receiving the primary refrigerant at the high pressure from the at least one heat exchanger and discharging the primary refrigerant at the low pressure; and a supply line delivering the primary refrigerant at the low pressure to the load and a return line returning the primary refrigerant from the load to the primary refrigeration system. The system further comprises the secondary refrigeration system, wherein the secondary refrigeration system comprises at least one secondary cryogenic refrigerator. A system control unit controls operation of at least one of the primary refrigeration system and the secondary refrigeration system to provide a variable refrigeration capacity to the load based on at least one of: a pressure of the primary refrigerant delivered to the load, and at least one temperature of the load.

A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.