An embodiment modular light-emitting diode (LED) display panel includes attachment points for use in attachment as part of a multi-panel modular LED display, a printed circuit board including a first side and an opposite second side, and a plastic casing attached to the opposite second side of the printed circuit board. A perimeter of the plastic casing is substantially rectangular and has a height and a width. The modular LED display panel further includes a display surface including a plurality of LEDs arranged as pixels and attached to the first side of the printed circuit board. The pixels are arranged in a rectangular array including at least fifty pixels. Each of the pixels of the rectangular array is spaced from each respective adjacent pixel of the rectangular array by a pitch. The pitch is a predetermined constant number. The pitch does not depend on the height and the width.

A method configured to produce a pressure-sensitive sensor composed of a cylindrical-shape body including therein a hollow portion along a longitudinal direction of that sensor, and being made of an elastic electrical insulating member, and a plurality of electrode wires arranged helically along an inner peripheral surface of the cylindrical-shape body and arranged in such a manner as to have no contact with each other. The method includes, with an extruder with a head, extrusion-molding the cylindrical-shape body while running the plurality of electrode wires into that head in such a manner that a periphery of the plurality of electrode wires is coated with the cylindrical-shape body, and taking up the cylindrical-shape body and the plurality of electrode wires ejected from the extruder while rotating the cylindrical-shape body and the plurality of electrode wires in a circumferential direction of the sensor, to thereby helically arrange the plurality of electrode wires.

A touch screen panel includes first and second sense cells on a same layer and coupling patterns that couple adjacent ones of the first sense cells and adjacent ones of the second sense cells to each other, respectively. The coupling patterns do not cross with each other, thereby improving the ability of the coupling patterns to withstand static electricity. A dummy line formed of a same material as the sense cells may be formed between the first and second sense cells, and the dummy line is electrically coupled to a guard ring located in an area outside of a display area of the touch screen panel, making it possible to overcome the effects of static electricity applied to the front surface of the touch screen panel as well as the side surface thereof.

One example includes a method for making a switch. The method includes forming an insulating layer over a substrate. The method also includes forming a resistive heating material over the insulating layer. The method also includes depositing a thermally conductive electrically insulating barrier layer over the heating material. The method also includes forming a phase-change material (PCM) component over the barrier layer spaced apart and proximal to the resistive heating material. The method also includes forming a quench layer proximal to at least one of the resistive heating material and the PCM component. The method further includes forming conductive lines from ends of the PCM component and control lines from ends of the resistive heating material.

A method for producing a film composite for electrical connection inside a power electronic switching device has the steps: A) forming a film composite having an electrically insulating insulant film with a first and a second main face. A first electrically conductive metal film, forms conductor tracks insulated from one another on the first main face, and having a second electrically conductive metal film forming conductor tracks arranged insulated from one another on the second main face of the insulant film; B) folding the film composite on a fold line, so that a first contact face of a first conductor track lies on a first contact face of a second conductor track of the first main face, and a second contact face of this first conductor track of the first main face lies on a second contact face of the second conductor track of the first main.

A protection device comprises a resin base, PTC component, bimetal component, arm and upper plate which are housed in a resin housing wherein the base includes a terminal integrated with the base by insert molding. A resin cover is formed by insert molding to cover the PTC component, bimetal component, arm and upper plate which are superposed in this order over the terminal within a space in the base. The space in the resin base is substantially closed by the upper plate, the base and the cover are integrally bonded to define the resin housing, the terminal and the arm are electrically connected in series in a normal state, and in an abnormal state where the bimetal component is activated, the terminal and the arm are electrically cut off, while the terminal, PTC component, bimetal component, and arm are electrically connected in series in this order.

A touch panel includes: a wire substrate and a cover substrate joined to each other, wherein the wire substrate includes a sensor electrode; a plurality of signal wires that are electrically connected to the sensor electrode and extend along a circumference of the sensor electrode; and a first light blocking layer that covers at least a signal wire disposed closest to the sensor electrode of the plurality of signal wires, and wherein the cover substrate includes a second light blocking layer that faces a continuous region including an outer edge region of the first light blocking layer and a signal wire disposed so as to be the most distant from the sensor electrode.

An electronic device comprising a first substrate, a second substrate, a first semiconductor chip comprising a transistor, comprising a first mounting surface bonded to the first substrate and comprising a second mounting surface bonded to the second substrate, and a second semiconductor chip comprising a first mounting surface bonded to the first substrate and comprising a second mounting surface bonded to the second substrate, wherein the first semiconductor chip comprises a via electrically coupling a first transistor terminal at its first mounting surface with a second transistor terminal at its second mounting surface.

Fabric enclosure backlighting techniques are described. In one or more implementations, one or more translucent portions are formed within a plurality of layers of a fabric enclosure assembly. In one approach, regions within one or multiple layers are laser etched to form the translucent portions within the fabric enclosure assembly. A light source is then arranged to selectively transmit light through the layers via the translucent portions to provide backlight for one or more elements integrated with fabric enclosure assembly. The one or more elements may include representations of input keys and/or graphics associated with the fabric enclosure assembly. The backlight may be used to view the one or more elements in low light and/or provide backlight effects such as borders, side lighting, labels, and so forth.

Systems and methods for providing input component assemblies for dome switches are provided. In some embodiments, an input component assembly may include a first conductive contact pad coupled to a first board of a switch, a second conductive contact pad coupled to a second board of the switch, and a layer of conductive adhesive between the first conductive pad and the second conductive pad, where the layer is operative to provide a seal for the switch.