A method is for making an electronic device that includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic device may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

A power fuse for protecting an electrical load subject to transient load current cycling events in a direct current electrical power system is provided. The power fuse includes at least one fuse element assembly that includes an elongated planar substrate, a plurality of fusible weak spots, and a conductor. The weak spots are formed on the substrate and are longitudinally spaced from one another on the substrate. The conductor is separately provided from the substrate and the weak spots. The conductor includes a solid elongated strip of metal having no stamped weak spot openings therein and therefore avoiding thermal-mechanical fatigue strain in the conductor when subjected to the transient load current cycling events. The solid elongated strip of metal includes coplanar connector sections that are mounted to respective ones of the weak spots and obliquely extending sections bent out of plane of the connector sections to extend above the substrate.

A method is for making an electronic device that includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

In a chip fuse, a heat-storing layer is formed on an insulated substrate, a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section. The chip fuse includes surface electrode sections on both ends in the length direction of the chip fuse and a fuse element section between the surface electrode sections. In this chip fuse, a rectangular bank section is formed over the heat-storing layer and the surface electrode sections to surround the fuse element section, and a first protective layer is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed to form the rectangular bank section.

A power fuse for protecting an electrical load subject to transient load current cycling events in a direct current electrical power system is provided. The power fuse includes at least one fuse element assembly that includes one or more substrates, one or more sets of weak spots, and a conductor. The weak spots are formed on the substrates, and the substrates are longitudinally spaced apart from one another along the conductor. The conductor is separately provided from the substrate and the weak spots. The conductor includes one or more strips of metal having no stamped weak spot openings therein and therefore avoiding thermal-mechanical fatigue strain in the conductor when subjected to the transient load current cycling events. The conductor includes connector sections that are attached to respective ones of the sets of weak spots, and extending sections coupling the connector sections.

A thermal switch includes a thermally responsive plate assembly including a metal support deforming from an initial shape before a header plate assembly is secured to a housing assembly, with a result that a position of a movable contact in the housing assembly is adjusted so as to be within a predetermined height range relative to an open end of a housing. A contact pressure of switching contacts after the assembling is produced by the height adjustment, and subsequently, a neighborhood of a part of the housing to which part the thermally responsive plate assembly is secured is deformed, so that an operating temperature is calibratable.

The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.

A complex type fusible link which includes an insulative block base including a plurality of cavities; a conductive connecting plate which is integrally embedded in the insulative block base, a part of the conductive connecting plate being exposed to at least one of the cavities; a plurality of fusible elements each of which is accommodated in corresponding one of the cavities and includes a first end which is connected to the part of the conductive connecting plate and a second end; and a plurality of terminals each of which is integrally embedded in the insulative block base and includes a first end which is connected to the second end of corresponding one of the fusible elements and a second end which is exposed from the insulative block base, at least one of the fusible elements includes a fastening portion to which another fusible element is fastened.

A fuse includes a fuse element and a fuse body. A portion of the fuse element is housed in a fuse body. The fuse element includes a first terminal and a second terminal disposed outside of the fuse body. The first terminal and the second terminal electrically connects the fuse element to a circuit to be protected and a power source. A first endbell and a second endbell is coupled to the fuse element. A predetermined amount of arc quenching material is disposed within the fuse body. The arc quenching material contacts at least a portion of the fuse element. The predetermined amount of the arc quenching material is less than a total volume size of the fuse tube. The arc quenching material is compacted. A remaining air gap in the fuse tube is filled with a liquid adhesive and cured to a solid state.

Some embodiments include a fuse having a tungsten-containing structure directly contacting an electrically conductive structure. The electrically conductive structure may be a titanium-containing structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Some embodiments include a method of forming and using a fuse. The fuse is formed to have a tungsten-containing structure directly contacting an electrically conductive structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Current exceeding the predetermined level is passed through the interface to rupture the interface.