RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.

A device for illuminating a space comprising is discussed. In one variation, the device includes: a central body portion, with a length and a width, and including two plates running along the length of the central body portion wherein the two plates are separated by a spacer; an opening for the removal of heat during operation of the device that extends along a portion of the length of the central body portion, a light emitting diode on the central body portion; a reflector, extending from the central body portion, for reflecting light emitted by the light emitting diode towards the illuminated space. Other variations are also discussed as are methods for using suitable variations for retrofitting existing non-light emitting diode light sources.

A wire extends through a ceramic body. The wire comprises a material selected from the group consisting of platinum, palladium, rhodium, iridium, osmium and alloys of platinum, palladium, rhodium, iridium, and osmium. The wire directly contacts the ceramic body to form a substantially hermetic seal between the ceramic body and the wire.

A package apparatus comprises a first wiring layer, a first dielectric material layer, a first conductive pillar layer, a first buffer layer, a second wiring layer, and a protection layer. The first wiring layer has a first surface and a second surface opposite to the first surface. The first dielectric material layer is disposed within partial zone of the first wiring layer. The first conductive pillar layer is disposed on the second surface of the first wiring layer. The first buffer layer is disposed within partial zone of the first conductive pillar layer. The second wiring layer is disposed on the first buffer layer and one end of the first conductive pillar layer. The protection layer is disposed on the first buffer layer and the second wiring layer.

A package apparatus comprises a first wiring layer, a first dielectric material layer, a first conductive pillar layer, a first buffer layer, a second wiring layer, and a protection layer. The first wiring layer has a first surface and a second surface opposite to the first surface. The first dielectric material layer is disposed within partial zone of the first wiring layer. The first conductive pillar layer is disposed on the second surface of the first wiring layer. The first buffer layer is disposed within partial zone of the first conductive pillar layer. The second wiring layer is disposed on the first buffer layer and one end of the first conductive pillar layer. The protection layer is disposed on the first buffer layer and the second wiring layer.

A method of and device for making a three dimensional electronic circuit. The method comprises coupling one or more magnet wires with a substrate along a surface contour of the substrate, immobilizing the one or more magnet wires on the substrate, and forming the electronic circuit by electrically coupling the one or more magnet wires with an integrated circuit chip.

An elastic flexible substrate includes an insulating base material having a first insulating film and a second insulating film, and a plurality of wires, each of which is disposed on one of the first insulating film and the second insulating film. The insulating base material has a plurality of bonding portions that are surface-bonded, openings are formed between the bonding portions, and two of the plurality of wires are electrically connected in the bonding portions.

A flexible laminate (1) includes an electrically non-conductive substrate (2) with a substantially planar configuration, an electrically conductive element (3) on a surface of the electrically non-conductive substrate, and a layer (4) on a surface of the electrically non-conductive substrate (2). The electrically non-conductive substrate (2), the electrically conductive element (3) and the layer (4) are coaxially punctured forming a punctured region (6). They are connected to each other through a mechanical connection element (5) which extends through the electrically non-conductive substrate (2), the electrically conductive element (3) and the layer (4) at the punctured region (6). The cross-sectional area of the electrically conductive element (3) at the location of the punctured region (6) is larger than the cross-sectional area of the electrically conductive element (3) outside the punctured region (6).

A printed circuit board includes a substrate, and a wiring provided on the substrate. The wiring includes a copper-based metal wire provided on the substrate and a surface-treated layer provided on the copper-based metal wire. The copper-based metal wire includes mainly a copper. The surface-treated layer includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than the copper.