A method for manufacturing a ceramic substrate containing glass includes a firing step in which an unfired silver-based conductor material is disposed on an unfired ceramic layer and is fired. The unfired silver-based conductor material contains at least one of a metal boride and a metal silicide.

A method for producing a ceramic multilayer element is disclosed. In an embodiment the method includes forming a plurality of multilayer segments in a green state, wherein each multilayer segment is formed by pressing together a plurality of ceramic layers in the green state and pressing together the multilayer segments in the green state to form a multilayer element that is in the green state. The method further includes sintering the multilayer element that is in the green state to form a ceramic multilayer element that includes the ceramic layers and electrode layers arranged one on top of another, wherein at least one or more of a temperature at which the multilayer segments are pressed together, a pressing force applied during the pressing of the multilayer segments, and/or a duration of the pressing of the multilayer segments are adjusted.

A touch panel includes first sensor electrode arrays in which first island-shaped electrode portions are arrayed along a first direction and connected through connecting portions, second sensor electrode arrays in which second island-shaped electrode portions are arrayed at intervals along a second direction, jumper wiring portions being superimposed through insulating portions and connecting the second island-shaped electrode portions arranged adjacent to each other along the second direction, and a lead-out wiring portion connected to the first and second sensor electrode arrays, the first and second sensor electrode arrays being formed of a first transparent conductor layer having a first thickness, the jumper wiring portions being formed of a second transparent conductor layer having a second thickness, the lead-out wiring portion being formed of a third transparent conductor layer having a third thickness that is larger than the first thickness.

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

A method of manufacturing a circuit substrate includes the steps of preparing a conductor paste in which a powder of at least one of a metal boride and a metal silicide is added to a powder of silver (Ag), applying the conductor paste to a surface of a ceramic substrate which has been fired, applying a glass paste to the surface of the ceramic substrate after applying the conductor paste, firing the conductor paste applied to the surface so as to form a conductor trace, and firing the glass paste applied to the surface so as to form a coating layer.

A method can be used for producing ceramic multilayer components. The method includes providing green layers for the ceramic multilayer components, stacking the green layers into a stack, and subsequently compressing the stack to form a block. Furthermore, the method includes isolating the block into partial blocks that each have a longitudinal direction, thermally treating the partial blocks, subsequently mechanically machining surfaces of the partial blocks, and providing the partial blocks with outer electrodes and isolating the partial blocks in each case transversely to the longitudinal direction into individual ceramic multilayer components.

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

A ceramic substrate includes a ceramic layer mainly formed of a glass ceramic and a conductor trace mainly formed of silver (Ag). In an adjacent region located adjacent to the conductor trace, the concentration of boron atoms (B) contained in the ceramic layer increases toward the conductor trace.