A galley cart has a rear wall with an inlet port and an outlet port. A first divider has a first edge, wherein a first distance is defined between the first edge and a front wall. A second divider has a second edge, wherein a second distance is defined between the second edge and the front wall. The second distance is less than the first distance for control of the flow of cooling air.

A heat transfer element includes curved mounting surfaces configured to mate with an outer surface of a pipe for attachment thereto; and a channel configured to receive a tracer therein. The heat transfer element is configured to effect conductive heat transfer from the tracer to the pipe, or to process flowing through the pipe, when attached with heat transfer cement (HTC) to both the pipe and the tracer. A system includes a pipe and a tracer; HTC; and a heat transfer element having curved mounting surfaces configured to mate with an outer surface of the pipe and attached thereto via the HTC, and a channel in which the tracer is received and secured via HTC. The heat transfer element is configured to effect conductive heat transfer from the tracer to the pipe, or to process flowing through the pipe, when attached with HTC to both the pipe and the tracer.

A double pipe type heat exchanger includes an inner pipe having a first flow path defined therein and an outer pipe arranged around the inner pipe to define a second flow path between the inner pipe and the outer pipe. The inner pipe includes a spiral groove formed on an outer circumferential surface of the inner pipe to extend along a longitudinal direction of the inner pipe. The outer pipe includes a reduced diameter portion protruding inwardly so that the inner surface of the outer pipe is intermittently contacted with the outer circumferential surface of the inner pipe.

Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.

A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device.

A heat exchange system includes a tubular fan air inlet portion and a tubular cooled air outlet portion connected to a first end of a tubular mid portion. The heat exchange system further includes a tubular hot air inlet portion and a tubular recycled fan air outlet portion connected a second end of the mid portion. Still further, the heat exchange system includes an integrally-formed, compliant heat exchanger tube extending between the hot air inlet portion and the cooled air outlet portion within the mid portion to define a heat exchanger first flow passage within the heat exchanger tube and a second flow passage outside of the heat exchanger tube but within the tubular mid portion. Methods for fabricating such heat exchange systems are also provided.

A split air conditioner has a cabinet with a fan and evaporator for mounting within a structure. The cabinet includes one or more movable dampers or movable filters positioned in the flow path between the air inlet and the outlet for selectively filtering contaminants from the air to provide a greater or lesser degree of filtration of the air. The movable filters include sliding and/or pivot mounting structure which may accommodate stacking multiple filters with different filtering characteristics. The system may operate in a filtering only mode with no cooling, a cooling only mode with no filtering, or a combination of cooling and selective filtering.

A method includes forming fluid conduit inside a heat shield in an additive manufacturing process, removing powder from an interior passage of the fluid conduit and from an insulation gap defined between the fluid conduit and the heat shield, separating the heat shield and fluid conduit from the build platform, and shifting the fluid conduit to a shifted position relative to the heat shield. The method includes securing the fluid conduit to the heat shield in the shifted position.

A method of custom manufacturing a flame arrestor includes providing a housing having an interior surface and an exterior surface where the exterior surface of the housing is shaped to fit within a fluid passageway. The method includes forming, using an additive manufacturing technique, a three-dimensional lattice structure by depositing a first material onto the interior surface of the housing in a predetermined pattern. The lattice structure includes a plurality of connected lattice members forming channels extending from a first end to a second end of the three-dimensional lattice structure. An element of a second material is provided adjacent to the three-dimensional lattice structure. The second material is different than the first material and the element is configured to draw heat away from fluid flowing through the plurality of channels.

A method includes forming fluid conduit inside a heat shield in an additive manufacturing process, removing powder from an interior passage of the fluid conduit and from an insulation gap defined between the fluid conduit and the heat shield, separating the heat shield and fluid conduit from the build platform, and shifting the fluid conduit to a shifted position relative to the heat shield. The method includes securing the fluid conduit to the heat shield in the shifted position.