A heat dissipation device includes a first plate having a first plurality of angled grooves arranged in a first direction, and a second plate having a second plurality of angled grooves arranged in the first direction. The second plate is coupled to the first plate, at least portions of the first plurality of angled grooves and the second plurality of angled grooves are connected to each other such that the first plurality of angled grooves and the second plurality of angled grooves define a fluid channel of the heat dissipation device, and the fluid channel includes coolant. The heat dissipation device also includes at least one capillary structure. At least a portion of the fluid channel is covered by the at least one capillary structure.

The disclosure presents a heat exchanger having flat tubes received in a double header plate. The double header plate includes a complementary arrangement of a main header plate and a reinforcement header plate. Slots are arranged in one of the header plate and complementary tabs are arranged in the other header plate. The tabs are configured to engage the slots to enable a complementary alignment of the two header plates.

A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.

A heat dissipation device includes a first plate having a first plurality of angled grooves arranged in a first direction, and a second plate having a second plurality of angled grooves arranged in the first direction. The second plate is coupled to the first plate, at least portions of the first plurality of angled grooves and the second plurality of angled grooves are connected to each other such that the first plurality of angled grooves and the second plurality of angled grooves define a fluid channel of the heat dissipation device, and the fluid channel includes coolant. The heat dissipation device also includes at least one capillary structure. At least a portion of the fluid channel is covered by the at least one capillary structure.

A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.

A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.

A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.

A heat dissipation device includes a first plate having a first plurality of angled grooves arranged in a first direction, and a second plate having a second plurality of angled grooves arranged in the first direction. The second plate is coupled to the first plate, at least portions of the first plurality of angled grooves and the second plurality of angled grooves are connected to each other such that the first plurality of angled grooves and the second plurality of angled grooves define a fluid channel of the heat dissipation device, and the fluid channel includes coolant. The heat dissipation device also includes at least one capillary structure. At least a portion of the fluid channel is covered by the at least one capillary structure.

Disclosed is an improved method of manufacturing cooled accelerator grid with full penetration weld configuration. In a preferred form, the method includes the steps of: machining a plurality of stubs, a first and a second end of a plurality of inconel pipes; welding the stubs with the first end of the inconel pipes forming a water connector assembly; machining of a base plate; welding the base plate with the water connector assembly; machining the base plate welded with the water connector assembly, wherein machining further comprises milling of plurality of cooling channels across angled plane of the base plate welded with the water connector assembly; closing of plurality of cooling channels located on the base plate welded with the water connector assembly; and welding each of plurality of external hydraulic circuits with the second end of each of the plurality of inconel pipes.

A method for producing a plate heat exchanger with at least two heat exchanger blocks which are produced separately from one another in a soldering furnace Each heat exchanger block has multiple separating sheets arranged parallel to one another and which form a plurality of beat exchanger passages for fluids involved in a heat exchange process. At least one support provided with solder is heated in order to melt the solder, the support is arranged between opposing outer surfaces of the heat exchanger blocks to be connected which are placed one on top of the other or adjacently, the support(s) thus being fixed between the opposing outer surfaces. After the solder is hardened, a bonded and heat-conductive connection is produced between the heat exchanger blocks. Sheets or wire arrangement can be used as the supports.