Patent classifications
Y10T29/49762
Assembling device
An assembling device includes a holding member and a processing device. The holding member is configured to hold a first assembly component and a second assembly component. The processing device is configured to process a first excess thickness portion and a second excess thickness portion. The first excess thickness portion is provided at the first assembly component and is configured to adjust a gap between the first assembly component and the second assembly component. The second excess thickness portion is provided at the second assembly component and is configured to adjust the gap.
ASSEMBLING DEVICE
An assembling device includes a holding member and a processing device. The holding member is configured to hold a first assembly component and a second assembly component. The processing device is configured to process a first excess thickness portion and a second excess thickness portion. The first excess thickness portion is provided at the first assembly component and is configured to adjust a gap between the first assembly component and the second assembly component. The second excess thickness portion is provided at the second assembly component and is configured to adjust the gap.