There is provided a profile measuring apparatus, including: an irradiation section configured to irradiate a measurement light to a measurement area of the object; an imaging section configured to obtain an image of the measurement area; a table configured to place the object thereon; a coordinate calculation section configured to calculate a position of the measurement area based on an image detected by a detection section; and a positioning mechanism configured to drive and control a relative position of the imaging section and the table. The positioning mechanism calculates a relative position of the imaging section to the table, based on an information with respect to an edge line direction of a convex portion or an extending direction of a concave portion in the measurement area of the object having a repetitive concave-convex shape, to move at least one of the table and the imaging section.

An apparatus for semiconductor manufacturing includes an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing. The apparatus further includes a first robotic arm to uninstall the housing from the carrier and to reinstall the housing into the carrier; one or more second robotic arms to remove the filter from the carrier and to install a new filter into the carrier; and an output port to release the carrier to production.

A system includes a plurality of semiconductor processing tools; a carrier purge station; a carrier repair station; and an overhead transport (OHT) loop for transporting one or more substrate carriers among the plurality of semiconductor processing tools, the carrier purge station, and the carrier repair station. The carrier purge station is configured to receive a substrate carrier from one of the plurality of semiconductor processing tools, purge the substrate carrier with an inert gas, and determine if the substrate carrier needs repair. The carrier repair station is configured to receive a substrate carrier to be repaired and replace one or more parts in the substrate carrier.

A method for sealing fluid cooled conduits in-situ for a generator is provided. The fluid or liquid cooled conduits are located external to a stator of the generator and substantially outward of stator bars. The method includes draining coolant from the fluid cooled conduits, and drying interior surfaces of the fluid cooled conduits. In inserting step inserts a borescope and a sealant applicator through an opening in one of the fluid cooled conduits. A locating step locates a brazed joint in the fluid cooled conduit, and a positioning step positions the borescope and the sealant applicator near the brazed joint. An applying step applies a sealant to the inside of the fluid cooled conduit at the brazed joint A viewing step may be used to view the brazed joint with the borescope to confirm that the applying step has been successful.

An electronic device includes an electronic circuit board containing a processing element and a vision sensor. A carrier frame is used to support the electronic circuit board. An optical element is positioned over the sensor and supported by the carrier frame. The electronic circuit board is bent to reduce the length, thickness and/or width of the electronic device, without increasing the others of the length, thickness and/or width of the electronic device.

A method and system for identifying a given geometrical feature of an optical component or semi-finished ophthalmic lens blank, where an optical component is made of an organic material that can emit light at an emission wavelength λ.sub.e when being lighten at an illumination wavelength λ.sub.i different from the emission wavelength λ.sub.e, a surface of the optical component is illuminated with an incident light beam including at least light at the illumination wavelength but devoid from light at the emission wavelength, light emitted at the emission wavelength by the illuminated surface is collected to build an image of the surface, and the surface image is processed to apply metrics to compare the image with reference data specific to the given geometrical feature.

A method for detecting cracks in an aircraft or gas turbine component includes ascertaining geometric data about the component using an optical measurement method, analyzing the geometric data, using an electronic evaluation device, so as to automatically recognize and/or classify at least one of cracks and other damage and storing a position of the at least one of cracks and other damage.

A method for manufacturing a gravure plate includes, setting a certain measurement area on a surface of the gravure plate, finding at least one of a spatial volume that is the total of the volume of a space formed by a plurality of cells located in the measurement area and an average depth obtained by dividing the spatial volume by a surface area of the measurement area, and adjusting, based on a relationship between at least one of the spatial volume and the average depth and an application thickness of a printing material after printing, at least one of the spatial volume and the average depth so as to fall within at least one of a specified value range for the spatial volume and a specified value range for the average depth determined in accordance with a target value range for the application thickness.

A workpiece processing method includes a carry-in step of carrying a workpiece into the field of view of a magnifier, a work step of performing predetermined work on the workpiece based on an image provided via the magnifier, and a carry-out step of carrying the workpiece out of the field of view of the magnifier, and a robot performs at least one of the carry-in step and the carry-out step as well as the work step.

An apparatus for semiconductor manufacturing includes an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing. The apparatus further includes a first robotic arm to uninstall the housing from the carrier and to reinstall the housing into the carrier; one or more second robotic arms to remove the filter from the carrier and to install a new filter into the carrier; and an output port to release the carrier to production.