A dismantling system includes a dismantling machine including a tip attachment for dismantling an object to be dismantled, an imaging device that provides a field of view from a second viewpoint position for visually recognizing an object to be dismantled, which is different from a first viewpoint position of an operator, and a dismantling operation device that receives operation by an operator of the tip attachment for dismantling an object to be dismantled with respect to the field of view provided by the imaging device.

A system to remove a ram packer from a ram block is provided. In one embodiment, the system includes an extraction tool having opposing jaws configured to engage a ram packer installed in a ram block. The system may also include an actuator configured to move the opposing jaws to facilitate separation of the ram packer from the ram block. Additional systems, devices, and methods are also disclosed.

An implement system is adapted for use with a machine including an implement and a fork assembly. The fork assembly having one or more loading members includes a first upright portion, a second upright portion, and a crimped portion. Further, the crimped portion interconnects the first upright portion and the second upright portion. A mounting device is configured to support the implement and the fork assembly. Further, the mounting device includes a first side plate and a second side plate. A first transverse member is disposed between the first side plate and the second side plate. A second transverse member is disposed between the first side plate and the second side plate, such that the one or more loading members of the fork assembly are pivotally connected to the second transverse member.

An apparatus for removing a semiconductor chip from a board may include: a laser configured to irradiate the board with a laser beam to heat bumps mounting the semiconductor chip on the board; a picker configured to separate the semiconductor chip from the board; a vacuum portion configured to provide a vacuum to the picker; and an intake. If solder pillars, that are residues of the bumps, are melted by the laser beam, the intake removes the solder pillars using the vacuum provided from the vacuum portion. An apparatus for removing a semiconductor chip from a board may include: a stage configured to support the board on which the semiconductor chip is mounted by bumps; a laser configured to irradiate the board with a laser beam to heat the bumps mounting the semiconductor chip on the board; and a picker configured to separate the semiconductor chip from the board.

A demolishing method utilizes an aggregate stack demolishing scaffold apparatus mounted to an upper part of an aggregate stack including four smoke funnels arranged adjacent to each other. An uneven scaffold including one plate-shaped upper scaffold portion is placed on an upper end of each smoke funnel. A lower scaffold portion is coupled to the upper scaffold portion and located in lower positions in the smoke funnels with the upper scaffold portion being placed on the upper ends of the smoke funnels. A chain block suspends and supports the uneven scaffold from and on an inner wall of each smoke funnel, and adjusts a suspending height. With this configuration, the upper scaffold portion is located on the upper ends of the smoke funnels, and thus there is no possibility of contact between the scaffolds in the smoke funnels causing a worker to lose his balance, thereby improving safety.

An end effector usable with a surgical instrument includes a first jaw pivotably coupled to a second jaw. The first jaw includes staple forming depressions. A staple cartridge is releasably attachable to a channel of the second jaw. A plurality of staples is disposed in the staple cartridge. A shipping wedge is releasably attached to the staple cartridge. The shipping wedge maintains the staples in their respective retention slots and is usable to separate the staple cartridge from the channel of the second jaw.

A dismantling system includes a dismantling machine including a tip attachment for dismantling an object to be dismantled, an imaging device that provides a field of view from a second viewpoint position for visually recognizing an object to be dismantled, which is different from a first viewpoint position of an operator, and a dismantling operation device that receives operation by an operator of the tip attachment for dismantling an object to be dismantled with respect to the field of view provided by the imaging device.

A bale processing machine that removes a binding from a bale allows for rapid bale processing. A method for removing the binding from the bale includes supporting the bale with a bale support at an elevated positon and securing the binding to a binding engagement device. The method also includes cutting the binding and removing the bale support from beneath the bale, such that at least a portion of the bale falls by gravity away from the binding secured to the binding engagement device.

A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

A support core includes a tube body for holding a device in an expanded state, a low-friction film disposed over an outer surface of the tube body, and a fixing device for holding the film in place, the fixing device comprising a loop of tape wrapped longitudinally over the film and through the tube body, or a tab on the film that is affixed to the tube body. To remove the tube body, the tape and/or film are cut so that the film can slide towards the front end of the tube body, and the tube body is then pulled out of the device.