An electronic device manufacturing system includes a mainframe that includes a first transfer chamber and facets defining first side walls of the first transfer chamber. The facets include a first facet that has a first number of substrate access ports, a second facet that has a second number of substrate access ports, and a third facet that has the second number of substrate access ports. The second number of substrate access ports is different than the first number of substrate access ports.

Provided is a method for manufacturing a gas sensor capable of securing airtightness without a chip in a sensor element. The method includes a step of obtaining an assembled body constituting the gas sensor, including steps of causing one end of the sensor element to abut to a positioning member for positioning the sensor element; applying a force F1 to the annularly-mounted members including a powder compact annularly mounted to the sensor element under a state that the sensor element is positioned and thereby compressing the powder compact so as to fix the sensor element inside of the tubular body, applying a force F2 larger than the force F1 to the annularly-mounted members under a state that the sensor element is not positioned and thereby further compressing the powder compact, so as to hermetically seal inside of the tubular body.

Provided is a method for manufacturing a gas sensor which suppresses a defective product caused by a defective posture of a sensor element therein. The method includes a step of obtaining an assembled body constituting the gas sensor, including steps of: causing one end of the sensor element to come to abut to a positioning member for positioning the sensor element; and applying a first force to the annularly-mounted members including a powder compact annularly mounted to the sensor element under a state that the sensor element is positioned and thereby compressing the powder compact so as to fix the sensor element inside of the tubular body, and the compression is performed while constraining the sensor element in a predetermined constraining region in the other end side of the sensor element.

A system including multiple inspection machines and an NG board discharge machine which moves an NG board to a checking position visible to a worker. The system acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position.

An automatic manufacturing station (3) and a manufacturing process for workpieces (2), in particular for vehicle body parts, has a manufacturing area (4) with a plurality of program-controlled manufacturing robots (9). The workpieces (2) are externally fed to the manufacturing station (3) on production load carriers (8). The manufacturing station (3) also has a plurality of work stations (10, 11, 12, 13). A station-bound transport device (15) transports the production load carriers (8) within the manufacturing station (3).

A multi-station rotating terminal crimping machine head is provided, the multi-station rotating terminal crimping machine head includes a machine table, a supporting device, a punching head, a rotating seat, a plurality of station seats, a first driving motor, and a first right-angle speed reducer. The supporting device is fixedly disposed on the machine table. The punching head is disposed on the supporting device. The rotating seat is rotatably disposed on the machine table. The plurality of the station seats are disposed on the rotating seat and rotate along with the rotating seat. The first driving motor and the first right-angle speed reducer are disposed on the machine table.

The present disclosure provides a multi-station rotating terminal crimping machine head, including a machine table, a supporting device, a punching head, a rotating seat, a plurality of station seats, a first driving motor, and a first right-angle speed reducer. The supporting device is fixedly disposed on the machine table. The punching head is disposed on the supporting device. The rotating seat is rotatably disposed on the machine table. The plurality of the station seats are disposed on the rotating seat and rotate along with the rotating seat. The first driving motor and the first right-angle speed reducer are disposed on the machine table.

An electronic device manufacturing system includes a mainframe including a transfer chamber and facets defining side walls of the transfer chamber. The facets include first facet, second facet, third facet, and fourth facet that form the transfer chamber. The first facet has a first number of substrate access ports. The second facet has a second number of substrate access ports. A first substrate access port of the first facet has a first side dimension and a second substrate access port of the second facet has a second side dimension that is different from the first side dimension. The second facet is adjacent to the first facet. The third facet is adjacent to the second facet. The fourth facet has the second number of substrate access ports. The second number of substrate access ports is different than the first number of substrate access ports.

An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.

A substrate working system includes a component mounter that mounts a component on a substrate, and an inspection unit provided in the component mounter or a device downstream of the component mounter and that performs a substrate inspection different from a normal substrate inspection when an abnormality related to a mounting operation is detected in the component mounter.