An automated, high throughput system that mechanically separates electrode tips from spark plugs to facilitate recovery of platinum group metals in the electrodes. Spark plugs may be fed into the system in bulk and an automated mechanism under computer control executes a sequence of operations to feed plugs in a fixed orientation and at a controlled rate to a robot arm. The robot arm has a gripper that securely holds a set of spark plugs and passes them across a cutting tool to separate tips from the bodies. The gripper has independently actuated finger assemblies that accommodate plugs of varying shapes. A visual inspection system ensures that spark plugs are oriented with the tips facing in the same direction to simplify operation of the robot and the cutting tool. The tips may be processed to extract the contained valuable metals; the remaining bodies may be recycled as iron scrap.

An apparatus for removing a semiconductor chip from a board may include: a laser configured to irradiate the board with a laser beam to heat bumps mounting the semiconductor chip on the board; a picker configured to separate the semiconductor chip from the board; a vacuum portion configured to provide a vacuum to the picker; and an intake. If solder pillars, that are residues of the bumps, are melted by the laser beam, the intake removes the solder pillars using the vacuum provided from the vacuum portion. An apparatus for removing a semiconductor chip from a board may include: a stage configured to support the board on which the semiconductor chip is mounted by bumps; a laser configured to irradiate the board with a laser beam to heat the bumps mounting the semiconductor chip on the board; and a picker configured to separate the semiconductor chip from the board.

A system and method for dismantling components of electronic media electronic storage devices such as hard disk drives, solid state drives and hybrid hard drives. The components are dismantled in a nondestructive manner so as to be capable of reuse. First devices loosen the various components of the storage device, Second devices are provided for removing components from the storage device. A holding chassis receives the storage device, and moves the storage device for engagement with the first and second devices. A mechanism may be provided for destroying the data containing portion of the electric storage device when it is removed from the storage device. A database of information concerning past and current storage devices including their configurations, component locations and screw/fastener locations is provided along with a scanning system for retrieving information about the storage device being introduced into the system. The scanned information and information from the database is used to control and position the first and second devices and holding chassis.

This application relates to a method for disassembling a portable electronic device. The method can include generating data associated with disassembling the portable electronic device based on measurements of a housing of the portable electronic device, removing a display assembly from the housing using a first module of a modular system based on the measurements of the housing, and removing an energy storage component from the housing using a second module of the modular system based on the measurements of the housing.

According to some embodiments, a method for processing an electronic component associated with a portable electronic device by a conveyor system subsequent to removing the electronic component from a housing of the portable electronic device, where the conveyor system includes a container that is capable of carrying the electronic component, is described. The method can include depositing, at a receiving station of the conveyor system, the electronic component within a cavity of the container. The method can further include while moving the container that carries the electronic component from the receiving station in a direction towards a removal station of the conveyor system: monitoring a temperature of the electronic component, and in response to determining that the temperature of the electronic component exceeds a temperature threshold range associated with a thermal event: cooling the electronic component by dissipating thermal energy associated with the thermal event.

According to some embodiments, a method operable by an electronic component recovery system for detaching an electronic component adhesively bonded to a housing by way of an adhesive bond, is described. The electronic component is carried within a cavity defined by the housing of a portable electronic device. The method can include while the housing having the electronic component attached thereto is located at an electronic component detaching module, where the electronic component detaching module includes a movable arm capable of rotating about a hinge: cooling the housing and the electronic component attached thereto to a temperature that is low enough to weaken the adhesive bond, and causing the movable arm to rotate about the hinge such that a portion of the housing strikes a detachment element with sufficient force to separate the electronic component from the housing.

A keypad bezel for attaching to a housing of a handheld computer comprises a main body including plurality of screw holes and tabs for connecting the main body to the computer housing and a plurality of leverage points in the main body useful for removing the keypad bezel from the housing. To remove the keypad bezel, the screws are removed from the screw holes and a removal tool is positioned so that it mates with recesses the keypad bezel and force is applied to the removal tool in a direction way from the housing. The force removes the tabs out of corresponding slots in the housing allowing the bezel to be removed.

An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

A circuit card assembly release tool is disclosed. The tool includes a body and two flanges extending outward from the body at an end of the body. The tool is structured and arranged such that the two flanges are adapted to simultaneously apply a force to two ejectors that are pivotally connected to a seated circuit card assembly when the tool is urged in a direction relative to the seated circuit card assembly.

A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.