A device is provided for unpackaging components encased between a first tape body and a second tape body of a sealed tape. The device includes a component collection device including a cavity for receiving components falling out of the sealed tape being de-taped. A de-taping device is attached to the component collection device. The de-taping device includes a support base held over the cavity, and a shaft on one side of the support base. The support base with the shaft is configured to enable one of the first tape body and the second tape body to be extendable around the shaft and the support base and to be pullable, such that the first tape body and the second tape body are separated and the components fall out of the sealed tape. The support base may include a through-hole configured for sealed tapes to pass through and to be held.