Aspects of the disclosure are directed to a first chip ring that includes a first through slot, a second chip ring that includes a second through slot, and a component disposed between the first chip ring and the second chip ring that includes a component through slot, where the first, second and component through slots are coaxial along a slot axis this is oriented at a non-zero valued angle relative to a planar surface of the component facing at least one of the first and second chip rings.

Aspects of the disclosure are directed to a first chip ring that includes a first through slot, a second chip ring that includes a second through slot, and a component disposed between the first chip ring and the second chip ring that includes a component through slot, where the first, second and component through slots are coaxial along a slot axis this is oriented at a non-zero valued angle relative to a planar surface of the component facing at least one of the first and second chip rings.

The shell of this helical broach (1) is formed by stacking a plurality of wafer shells (20.sub.W(1)-20.sub.W(N)) in the axial direction, and is obtained by forming on the wafer shells (20.sub.W(1)-20.sub.W(N)) finishing blades (30.sub.W(1)-30.sub.W(N)) corresponding to teeth grooves on a piece to be cut (W) and forming the finishing blades (30.sub.W(1)-30.sub.W(N)) such that the blade width gradually increases with each of the aforementioned wafer shells (20.sub.W(1)-20.sub.W(N)) from the leading end of the cutting direction toward the trailing end of the cutting direction.