Y10T428/1171

Method of manufacturing a magnetic film having high coercivity for use as a hot seed in a magnetic write head

A method of forming a sub-structure, suitable for use as a hot seed in a perpendicular magnetic recording head, is described. A buffer layer of alumina with a thickness of 50-350 Angstroms is formed by atomic layer deposition as a write gap. Thereafter, one or more seed layers having a body-centered cubic (bcc) crystal structure may be deposited on the buffer layer. Finally, a magnetic film made of FeCo or FeNi with a coercivity of 60-110 Oe is deposited on the seed layer(s) by a physical vapor deposition (PVD) method at a rate of 0.48 to 3.6 Angstroms per second. The magnetic film is preferably annealed at 220° C. for 2 hours in a 250 Oe applied magnetic field.

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

A three-dimensional structure in which a wiring is provided on a surface is provided. At least a part of the surface of the three-dimensional structure includes an insulating layer containing filler. A recessed gutter for wiring is provided on the surface of the three-dimensional structure, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.

Devices including at least one adhesion layer and methods of forming adhesion layers

Devices that include a near field transducer (NFT), the NFT having at least one external surface; and at least one adhesion layer positioned on at least a portion of the at least one external surface, the adhesion layer including oxides of yttrium, oxides of scandium, oxides of lanthanoids, oxides of actionoids, oxides of zinc, or combinations thereof.

ALLOY RIBBON AND LAMINATED CORE
20210301380 · 2021-09-30 · ·

An alloy ribbon that is an alloy ribbon containing a metal as a main component, and has a recess on at least one principal surface, in which a depth of the recess is 5% or more and 75% or less of an average thickness.

Supermalloy and MU metal side and top shields for magnetic read heads

The use of supermalloy-like materials such as NiFeMe where Me is one or more of Mo, Cr, and Cu for the side and top shields of a magnetic bit sensor is shown to provide better shielding protection from stray fields because of their extremely high permeability. Moreover, the side shield may comprise a stack in which a Ni, Fe, Co, FeNi, CoFe, or FeCo is sandwiched between two NiFeMe layers to enhance the bias field on an adjacent free layer. Including NiFeMe in a side shield results in an increase in readback amplitude under the same asymmetric sigma. For these sensors, the signal to noise ratio was higher and the bit error rate was lower than with conventional materials in the side shield. A method is disclosed for forming a magnetic bit sensor having supermalloy-like materials in the side shields.

Supermalloy and MU Metal Side and Top Shields for Magnetic Read Heads
20190013041 · 2019-01-10 ·

The use of supermalloy-like materials such as NiFeMe where Me is one or more of Mo, Cr, and Cu for the side and top shields of a magnetic bit sensor is shown to provide better shielding protection from stray fields because of their extremely high permeability. Moreover, the side shield may comprise a stack in which a Ni, Fe, Co, FeNi, CoFe, or FeCo is sandwiched between two NiFeMe layers to enhance the bias field on an adjacent free layer. Including NiFeMe in a side shield results in an increase in readback amplitude under the same asymmetric sigma. For these sensors, the signal to noise ratio was higher and the bit error rate was lower than with conventional materials in the side shield. A method is disclosed for forming a magnetic bit sensor having supermalloy-like materials in the side shields.

Spin valve element and method of manufacturing same

A spin valve element may include a plurality of magnetic element groups. Each magnetic element group may be formed, at least in part, by a plurality of magnetic elements being connected in parallel. Each magnetic element may include an intermediate layer and a pair of ferromagnetic layers sandwiching the intermediate layer. The plurality of magnetic element groups may be connected together in series or in parallel. The plurality of magnetic elements may be configured to undergo a microwave oscillation and are placed in proximity sufficient that oscillation signals are configured to be generated with the magnetic elements mutually synchronized. The proximity may include a range equal to a wavelength of the microwave oscillation.

DEVICES INCLUDING AT LEAST ONE ADHESION LAYER AND METHODS OF FORMING ADHESION LAYERS
20170294201 · 2017-10-12 ·

Devices that include a near field transducer (NFT), the NFT having at least one external surface; and at least one adhesion layer positioned on at least a portion of the at least one external surface, the adhesion layer including oxides of yttrium, oxides of scandium, oxides of lanthanoids, oxides of actionoids, oxides of zinc, or combinations thereof

Devices including at least one adhesion layer and methods of forming adhesion layers

Devices that include a near field transducer (NFT), the NFT having at least one external surface; and at least one adhesion layer positioned on at least a portion of the at least one external surface, the adhesion layer including oxides of yttrium, oxides of scandium, oxides of lanthanoids, oxides of actionoids, oxides of zinc, or combinations thereof.

Interlayer for device including NFT and cladding layers

A device that includes a near field transducer (NFT); at least one cladding layer adjacent the NFT; and a discontinuous metal layer positioned between the NFT and the at least one cladding layer.