The invention relates to a sintered metal material comprising at least one magnetic part, characterised by directional through-pores having a size of between 1 and 100 μm, said material having a density varying by less than 20% from one sample of 1 cm3 to another taken from a one-piece part made from the material.

The invention relates to a sintered metal material comprising at least one magnetic part, characterised by directional through-pores having a size of between 1 and 100 μm, said material having a density varying by less than 20% from one sample of 1 cm3 to another taken from a one-piece part made from the material.

The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.