A rectangular parallelepiped ingot defined by a height H, a width W and a length L, having longitudinal faces extending between two end faces, having a volume between 0.15 m.sup.3 and 0.80 m.sup.3 and a surface area to volume ratio between 10 m.sup.−1 and 18 m.sup.−1, made of at least one metal, including at least one notch and a notch tip along the ingot length, wherein the at least one notch is configured such that: MaxD<H/2, MaxD<W/2 and MaxD being the maximum distance between any point of the ingot and the closest surface of the ingot.

An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.

By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.

Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.

An aluminum strip for a component, in particular a brazing component, in particular a tube or a disk, includes a profile having a brazing connection, wherein in at least one area, in particular in the area of the brazing connection: a first part of the strip thickness is taken up by a core layer of a first aluminum alloy; at least a second part of the strip thickness is taken up by at least one plating layer of a second aluminum alloy, wherein the first and the second aluminum alloy are configured to form a brown band layer during a brazing process; and at least a third part of the strip thickness is taken up by at least one brown band layer that is formed out of the first and the second aluminum alloy during the brazing process, and wherein a strip thickness of the aluminum strip is less than 500 m and a thickness of the core layer and/or a thickness of the plating layer is configured such that after the brazing process at least 5% of the strip thickness that is taken up by the first aluminum alloy of the core layer still remains in the at least one area, and the brown band layer takes up more than 20% of the strip thickness, and the core layer is designed to be multi-layered with one, preferably central, main core layer and at least one side core layer.

The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150 C. with a temperature of 25 C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.

Billets and methods for manufacturing them are disclosed. The billets include a cladding member including an alloy selected from the group including stainless steel, nickel-chrome, nickel-copper, and copper-nickel alloys, and a steel body that is positioned so that it has an interface with the cladding member, the steel body having a formation in which the scavenging metal is located and elements being provided for separating the scavenging metal from the cladding member at the interface.

The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher and 99.9995% or lower, sphericity which is 0.95 or higher and a diameter of 1 m or more to 1000 m or lower.

The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher and 99.9995% or lower, sphericity which is 0.95 or higher and a diameter of 1 m or more to 1000 m or lower.

A steel for electron-beam welding according to the present invention includes at least C: 0.02% to 0.10%, Si: 0.03% to 0.30%, Mn: 1.5% to 2.5%, Ti: 0.005% to 0.015%, N: 0.0020% to 0.0060%, and O: 0.0010% to 0.0035%, further includes S: limited to 0.010% or less, P: limited to 0.015% or less, and Al: limited to 0.004% or less, with a balance including iron and inevitable impurities. An index value CeEBB obtained by substituting composition of the steel into following Formula 1 falls in the range of 0.42 to 0.65%, the number of oxide having an equivalent circle diameter of 1.0 m or more is 20 pieces/mm.sup.2 or less at a thickness center portion in cross section along the thickness direction of the steel, and the number of oxide containing Ti of 10% or more and having an equivalent circle diameter of not less than 0.05 m or more and less than 0.5 m falls in the range of 110.sup.3 to 110.sup.5 pieces/mm.sup.2 at the thickness center portion.
CeEBB=C+Mn+ 1/15Cu+ 1/15Ni+Cr+Mo+V(Formula 1)