In the production of an internal-tin-processed Nb.sub.3Sn superconducting wire, the present invention provides a Nb.sub.3Sn superconducting wire that is abundant in functionality, such as, the promotion of formation of a Nb.sub.3Sn layer, the mechanical strength of the superconducting filament (and an increase in interface resistance), the higher critical temperature (magnetic field), and the grain size reduction, and a method for producing it. A method for producing a Nb.sub.3Sn superconducting wire according to an embodiment of the present invention includes a step of providing a bar 10 that has a Sn insertion hole 12 provided in a central portion of the bar 10 and a plurality of Nb insertion holes 14 provided discretely along an outer peripheral surface of the Sn insertion hole 12, and that has an alloy composition being Cu-xZn-yM (x: 0.1 to 40 mass %, M=Ge, Ga, Mg, or Al, provided that, for Mg, x: 0 to 40 mass %), a step of mounting an alloy bar with an alloy composition of Sn-zQ (Q=Ti, Zr, or Hf) into the Sn insertion hole 12 and inserting Nb cores into the Nb insertion holes 14, a step of subjecting the bar 10 to diameter reduction processing to fabricate a Cu-xZn-yM/Nb/Sn-zQ composite multicore wire with a prescribed outer diameter, and a step of subjecting the composite multicore wire to Nb.sub.3Sn phase generation heat treatment.

A Sn-plated steel sheet including a base plated steel sheet having a steel sheet, a Sn-plated layer on at least one surface of the steel sheet, and a film layer containing a zirconium oxide and a tin oxide. An adhesion amount of Sn per surface of the Sn-plated steel sheet is 0.1 g/m.sup.2 or more and 15 g/m.sup.2 or less, an amount of the zirconium oxide in the film layer is in a range of 1 mg/m.sup.2 or more and 30 mg/m.sup.2 or less in terms of an amount of metal Zr, a peak position of a binding energy of Sn3d.sub.5/2 of the tin oxide is 1.4 eV or more and less than 1.6 eV from a peak position of a binding energy of metal Sn, and a quantity of electricity required for reduction of the tin oxide is more than 5.0 mC/cm.sup.2 and 20 mC/cm.sup.2 or less.

Provided is a tin-plated copper terminal material, a terminal formed from the terminal material, and an electric-wire terminal structure using the terminal: the terminal material has a substrate of copper or a copper alloy; an intermediate zinc layer of a zinc alloy that is formed on the substrate and has a thickness of 0.10 μm to 5.00 μm; and a tin layer of tin or a tin alloy that is formed on the intermediate zinc layer and in which the length proportion occupied by low-angle grain boundaries is 2% to 30% with respect to the total length of all crystal grain boundaries; wherein galvanic corrosion is effectively suppressed.

A tin-plated copper alloy terminal material in which an Sn-based surface layer is formed on a surface of a base material that is made of copper or a copper alloy, and a Cu—Sn alloy layer and an Ni layer or an Ni alloy layer are sequentially formed between the Sn-based surface layer and the base material from the Sn-based surface layer side: the Cu—Sn alloy layer is a layer that is formed only of an intermetallic compound alloy which is obtained by substituting some of Cu in Cu.sub.6Sn.sub.5 alloy with Ni; and parts of the Cu—Sn alloy layer are exposed from the Sn-based surface layer, thereby forming a plurality of exposed portions; an average thickness of the Sn-based surface layer is from 0.2 μm to 0.6 μm (inclusive); and an area rate of the exposed portions of the Cu—Sn alloy layer relative to a surface area of is 1% to 40% (inclusive).

A metal composite comprises: a first matrix comprising magnesium, a magnesium alloy, or a combination thereof; a second matrix comprising aluminum, an aluminum alloy, steel, a zinc alloy, a tin alloy, or a combination comprising at least one of the foregoing; a corrosion reinforcement material; and a boundary layer disposed between the first matrix and the second matrix; wherein the boundary layer has a thickness of 10 nm to 200 μm.

Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a bond pad of a microfeature workpiece, with the volume of material including a first metallic constituent and the bond pad including a second constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the bond pad to alloy the first metallic constituent and the second metallic constituent so that the first metallic constituent is alloyed generally throughout the volume of material. A thickness of the bond pad can be reduced from an initial thickness T1 to a reduced thickness T2.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

The present invention relates generally to a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.

Provided is a chemical treatment steel sheet including a steel sheet; a composite coated layer which is formed on at least one surface of the steel sheet, and contains 2 to 200 mg/m.sup.2 of Ni in terms of an amount of metal Ni and 0.1 to 10 g/m.sup.2 of Sn in terms of an amount of metal Sn, and in which an island-shaped Sn coated layer is formed on an Fe—Ni—Sn alloy layer; and a chemical treatment layer that is formed on the composite coated layer, and contains a 0.01 to 0.1 mg/m.sup.2 of Zr compounds in terms of an amount of metal Zr and 0.01 to 5 mg/m.sup.2 of phosphate compounds in terms of an amount of P.

A wiring board and a method for manufacturing the wiring board in which an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted. Copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect.