An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 μm or more.

A composite material includes: an iron-based alloy layer; an intermediate layer provided on the iron-based alloy layer; and a tungsten-containing layer provided on the intermediate layer, wherein the intermediate layer is composed of pure nickel or is an alloy that contains at least one selected from a group consisting of copper, cobalt, and iron at more than 0 mass % and less than or equal to 71 mass % in total, and that contains nickel at more than or equal to 29 mass % and less than 100 mass %.

Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.

An example hydraulic system component of a machine includes a protective coating deposited by high velocity air fuel (HVAF) thermal spray, exhibiting high adhesion strengths and surface morphologies that promote lubricant adhesion and reduce the leakage of oil and/or hydraulic fluid from the hydraulic system. The coating may have surface roughness with Rz values less than 2 μm and hardness of 1000 Vickers or greater. The HVAF coating may be thinner than conventional coatings with thicknesses less than 100 μm. The HVAF coating may be deposited on a variety of steel components with adhesion strengths greater than those achieved by high velocity oxygen fuel (HVOF). The HVAF coating may be formed without time consuming roughening and/or post-grind operations, resulting in cost savings compared to conventional coatings. The coatings may have operational lifetimes of 1000 hours or more.

A process of fabricating a shield, a process of preparing a component, and an erosion shield are disclosed. The process of fabricating the shield includes forming a near-net shape shield. The near-net shape shield includes a nickel-based layer and an erosion-resistant alloy layer. The nickel-based layer is configured to facilitate secure attachment of the near-net shaped to a component. The process of preparing the component includes securing a near-net shape shield to a substrate of a component.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

The present invention relates generally to a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.

Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.

The present invention relates generally to a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.

An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 μm or more.