This invention provides a roll-bonded laminate composed of a hard copper layer and a stainless steel layer, which is sufficient both in radiation performance and strength. A roll-bonded laminate 1A is composed of a copper layer 10A and a stainless steel layer 20A, in which thickness of the roll-bonded laminate 1A is 0.02 mm to 0.4 mm, hardness of the copper layer 10A is 70 Hv or higher, and 180° peel strength of the roll-bonded laminate 1A is 6 N/20 mm or more.

A slide member is provided with a base material, a plated slide layer and an intermediate plated layer. The plated slide layer contains a solid lubricant. The intermediate plated layer is disposed between the base material and the plated slide layer, the intermediate plated layer increasing cohesion of the base material and the plated slide layer. The plated slide layer has a content of the solid lubricant in a range from 30 to 70 vol %, inclusive.

A sliding member of the present invention includes a base material and a coating layer that is formed on the base material. The coating layer includes a particle aggregate, and the particle aggregate contains two or more kinds of precipitation hardened copper alloy particles that have different compositions. The sliding member has high coating strength and superior wear resistance.

The present disclosure provides systems and methods that employ slurries to form layers adjacent to substrates. Such layers can include, for example, one or more of iron, chromium, nickel, silicon, vanadium, titanium, boron, tungsten, aluminum, molybdenum, cobalt, manganese, zirconium, and niobium, oxides thereof, nitrides thereof, sulfides thereof, or combinations thereof. In some examples, such layers are stainless steel layers.

This invention provides a roll-bonded laminate composed of a hard copper layer and a stainless steel layer, which is sufficient both in radiation performance and strength. A roll-bonded laminate 1A is composed of a copper layer 10A and a stainless steel layer 20A, in which thickness of the roll-bonded laminate 1A is 0.02 mm to 0.4 mm, hardness of the copper layer 10A is 70 Hv or higher, and 180° peel strength of the roll-bonded laminate 1A is 6 N/20 mm or more.

The present invention discloses a metal composite wire capable of increasing a tightness degree of copper-aluminum bonding. The metal composite wire includes a metal core rod. Continuous spiral grooves are formed in a surface of the core rod. The core rod is cladded with a metal cladding layer with higher electrical conductivity than the core rod. An average depth of the continuous spiral grooves ≤1/10 of a thickness of the metal cladding layer. By setting the thickness of the metal cladding layer as t.sub.1, a specific gravity of the metal cladding layer as ρ.sub.1, a diameter of the core rod as R, the average depth of the continuous spiral grooves as h, and a specific gravity of the core rod as ρ.sub.2, $t_1=\sqrt{\frac{{\left(R-h\right)}^2\times {\rho }_1+k\times {\left(R-h\right)}^2\times {\rho }_2-k\times {\left(R-h\right)}^2\times {\rho }_1}{(}}$

To provide a copper-clad laminate which maintains adhesion between a resin film and a conductor layer and which suppresses the occurrence of wrinkles. A copper-clad laminate has a base film containing a thermoplastic resin, an underlying metal layer film-formed on a surface of the base film by a dry plating method, and a copper layer film-formed on a surface of the underlying metal layer. The underlying metal layer has a mean thickness of 0.3 to 1.9 nm. Since the underlying metal layer has a mean thickness of 0.3 nm or more, it is possible to maintain adhesion between the base film and a conductor layer. Since the underlying metal layer has a mean thickness of 1.9 nm or less, it is possible to suppress an increase in the temperature of a film during film-forming of the underlying metal layer, and it is possible to suppress the occurrence of wrinkles.

A clad material includes a first layer made of stainless steel and a second layer made of Cu or a Cu alloy and roll-bonded to the first layer. In the clad material, a grain size of the second layer measured by a comparison method of JIS H 0501 is 0.150 mm or less.

One aspect of the disclosure provides an iron-based hardfacing layer which includes hard or wear resistant phases resulting at least in part from dissolution of silicon and/or boron carbide particles into a liquid iron-based metal during the fabrication process. In an embodiment, the hardfacing layer is formed by a fusion welding process in which carbide particles are added to the molten weld pool. In an example, the filler metal supplied to the welding process is a mild steel. In an embodiment, the hardness as measured at the surface of the hardfacing ranges from 40 to 65 HRC. In an example, the iron-based hardfacing layer also includes tungsten carbide particles.

An extremely thin copper foil with a carrier is provided that can keep stable releasability even after being heated for a prolonged time at a high temperature of 350 C. or more. The extremely thin copper foil with a carrier includes a carrier composed of a glass or ceramic material; an intermediate layer provided on the carrier and composed of at least one metal selected from the group consisting of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo; a release layer provided on the intermediate layer and including a carbon sublayer and a metal oxide sublayer or containing metal oxide and carbon; and an extremely thin copper layer provided on the release layer.