Patent classifications
Y10T428/12924
Silicon coating on hard shields
A device including a hard shield material; a layer including aluminum or copper; and a silicon layer having a first thickness is disclosed. The device can also include a silicon layer having a second thickness. A method of making the device is also disclosed.
CARBIDE-BASED HARDFACING
One aspect of the disclosure provides an iron-based hardfacing layer which includes hard or wear resistant phases resulting at least in part from dissolution of silicon and/or boron carbide particles into a liquid iron-based metal during the fabrication process. In an embodiment, the hardfacing layer is formed by a fusion welding process in which carbide particles are added to the molten weld pool. In an example, the filler metal supplied to the welding process is a mild steel. In an embodiment, the hardness as measured at the surface of the hardfacing ranges from 40 to 65 HRC. In an example, the iron-based hardfacing layer also includes tungsten carbide particles.
Copper-clad laminate
To provide a copper-clad laminate which maintains adhesion between a resin film and a conductor layer and which suppresses the occurrence of wrinkles. A copper-clad laminate has a base film containing a thermoplastic resin, an underlying metal layer film-formed on a surface of the base film by a dry plating method, and a copper layer film-formed on a surface of the underlying metal layer. The underlying metal layer has a mean thickness of 0.3 to 1.9 nm. Since the underlying metal layer has a mean thickness of 0.3 nm or more, it is possible to maintain adhesion between the base film and a conductor layer. Since the underlying metal layer has a mean thickness of 1.9 nm or less, it is possible to suppress an increase in the temperature of a film during film-forming of the underlying metal layer, and it is possible to suppress the occurrence of wrinkles.
Highly-ordered nano-structure array and Fabricating Method thereof
A highly-ordered nano-structure array, formed on a substrate, mainly comprises a plurality of highly-ordered nano-structure units. Each of the highly-ordered nano-structure units forms a receiving compartment. One end of the receiving compartment opposite to the substrate has an opening. Each of the highly-ordered nano-structure units comprises at least one thin film layer. A periphery and a bottom of the receiving compartment are defined by an inner surface of a surrounding portion of the at least one thin film layer and a top surface of a bottom portion of the at least one thin film layer, respectively. The at least one thin film layer is made of at least one material selected from the group consisting of: metal, alloy, oxide, nitride, and sulfide.
Coated metallic substrate and fabrication method
A coated metallic substrate is provided, including, at least; one layer of oxides, such layer being directly topped by an intermediate coating layer comprising Fe, Ni, Cr and Ti wherein the amount of Ti is above or equal to 5 wt. % and wherein the following equation is satisfied: 8 wt. %<Cr+Ti<40 wt. %, the balance being Fe and Ni, such intermediate coating layer being directly topped by a coating layer being an anticorrosion metallic coating.
Copper foil with carrier
An extremely thin copper foil with a carrier is provided that can keep stable releasability even after being heated for a prolonged time at a high temperature of 350° C. or more. The extremely thin copper foil with a carrier includes a carrier composed of a glass or ceramic material; an intermediate layer provided on the carrier and composed of at least one metal selected from the group consisting of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo; a release layer provided on the intermediate layer and including a carbon sublayer and a metal oxide sublayer or containing metal oxide and carbon; and an extremely thin copper layer provided on the release layer.
Wire material for canted coil spring and canted coil spring
A wire material for a canted coil spring includes a core wire composed of a steel having a pearlite structure, a copper plating layer covering the outer peripheral surface of the core wire, the copper plating layer being composed of copper or a copper alloy, and a hard layer disposed adjacent to the outer periphery of the copper plating layer, the hard layer having a higher hardness than the copper plating layer. The steel constituting the core wire contains 0.5% or more by mass and 1.0% or less by mass carbon, 0.1% or more by mass and 2.5% or less by mass silicon, and 0.3% or more by mass and 0.9% or less by mass manganese, the balance being iron and unavoidable impurities.
Fabrication method for a multi-layer substrate
A method for fabricating a substrate provided with a plurality of layers, includes: providing a steel substrate with an oxide layer including metal oxides on the steel substrate; providing a metal coating layer directly on the oxide layer, the metal coating layer including: at least 8% by weight nickel; at least 10% by weight chromium; and a remainder being iron and impurities from a fabrication process; and providing an anti-corrosion coating layer directly on the metal coating layer.
COATED POST
A method of extending the corrosion resistance of a ground anchoring region of a steel or alloy fence or trellis post already having a sacrificial coating or non-sacrificial coating along an entire length of the fence or trellis post, said method including the step of applying at least one additional coating to the ground anchoring region so as to extend the corrosion resistance of the ground anchoring region. The at least one additional coating can be a sacrificial coating and/or non-sacrificial coating.
Friction material
A friction material comprises an Fe part which contains Fe as a main component, a coating layer formed on a surface of the Fe part, and a friction part formed on a surface of at least a part of the coating layer, and the coating layer comprises a first coating layer and a second coating layer which have a specific average thickness and a specific component in order from Fe part side, and in the second coating layer, in order of positions at which the thickness is 20%, 40%, 60% and 80% of the second coating layer from the side of the first coating layer to the side opposite thereto, a Cu content increases and a Ni content decreases.