A system for protecting a surface of a substrate includes a protective film, which is configured to be applied and secured to the surface, as well as a backing on an adherent surface of the protective film and an application tape over an exterior surface of the protective film. Protruding features, such as tabs, adjacent to different peripheral edges of the protective film may enable removal of the backing and the application tape from the protective film, and may include features that indicate the order in which each protruding feature is to be grasped to peel its corresponding element away from the protective film.

A separator containing a substrate and a release layer formed on at least one side of the substrate wherein the separator shows a strain of not more than 7% when a load of 5N/20 mm is applied for one minute in the pulling direction, and when the substrate is cut in half in the thickness direction to divide the separator into two, an apparent elastic modulus in the pulling direction of one of the divided separators is larger than an apparent elastic modulus in the pulling direction of the other divided separator.

The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator.

Systems and films for protecting surfaces of various substrates, including electronic devices, such as portable electronic devices, include a liner with a strip liner and a main liner. The strip liner, which covers a small strip of adhesive on the back side of a protective film, is configured to be removed before the main liner. With the small strip of adhesive exposed, the protective film may be aligned with a substrate and, if necessary, removed from the substrates and repositioned thereon. Thereafter, the main liner may be removed to enable complete application of the protective film to the substrate. Methods for securing protective films to substrates are also disclosed.

A label web and method utilize a substrate, first and second longitudinally spaced label arrays each including two or more double-sided adhesive labels removably attached to the substrate, and a peelable protective covering web extending generally coextensive with the substrate. The label arrays and the peelable protective web are configured such that the peelable protective web is selectively removable to expose the first label array while remaining removably attached to the second label array, with both the first and second label arrays remaining removably attached to the substrate, to thereby facilitate removal of all labels in the first label array as a group while the peelable protective covering web remains in place over the second label array.

An applicator is provided for applying protective films to electronic device displays. The applicator includes a base, a screen protector, and a squeegee. The base includes a pocket for receiving an electronic device. The screen protector is affixed to the base so as to overlie an electronic device. The screen protector preferably includes three layers including a protective film, cap sheet, and back liner. The squeegee is provided for removing the back liner and for simultaneously affixing the protective film to an electronic device.

An applicator is provided for applying protective films to electronic device displays. The applicator includes a base, a screen protector, and a squeegee. The base includes a pocket for receiving an electronic device. The screen protector is affixed to the base so as to overlie an 5 electronic device. The screen protector preferably includes three layers including a protective film, cap sheet, and back liner. The squeegee is provided for removing the back liner and for simultaneously affixing the protective film to an electronic device.

A label web and method utilize a substrate, first and second longitudinally spaced label arrays each including two or more double-sided adhesive labels removably attached to the substrate, and a peelable protective covering web extending generally coextensive with the substrate. The label arrays and the peelable protective web are configured such that the peelable protective web is selectively removable to expose the first label array while remaining removably attached to the second label array, with both the first and second label arrays remaining removably attached to the substrate, to thereby facilitate removal of all labels in the first label array as a group while the peelable protective covering web remains in place over the second label array.

An anti-wear composite structure includes an anti-wear layer that has a wear surface opposite an adhesive receiving surface and a thermosetting resin applied to the adhesive receiving surface. The thermosetting resin includes a reactive adhesive configured to bond the anti-wear composite structure to a substrate at an ambient temperature band via pressure-sensitive adhesion. The thermosetting resin has an onset to cure in the ambient temperature band and has a peak cure temperature greater than the ambient temperature band to mechanically and chemically bond the anti-wear composite structure to a substrate.