Patent classifications
Y10T428/249974
REDUCED DENSITY HOLLOW GLASS MICROSPHERE POLYMER COMPOSITE
The invention relates to a hollow glass microsphere and polymer composite having enhanced viscoelastic and rheological properties.
Thermally Insulative Expanded Polytetrafluoroethylene Article
The present invention is directed to a thermally insulative material comprising PTFE, including an expanded PTFE (ePTFE), having a thermal conductivity of less than or equal to 25 mW/m K at atmospheric conditions. In one embodiment, the insulative material of the present invention includes aerogel particles and polytetrafluoroethylene (PTFE). The insulative material may be formed into articles that are hydrophobic, highly breathable, possess high strength, and which may be used in non-static applications such as dynamic flexing and the like. The insulative articles are flexible, stretchable, and bendable. Also, the insulative material has little to no shedding or dusting of fine particles. Aerogel particles having a particle density of less than about 100 kg/m.sup.3 and a thermal conductivity of less than or equal to about 15 mW/m K at atmospheric conditions (about 298.5 K and 101.3 kPa) may be used in the insulative material.
Reduced density hollow glass microsphere polymer composite
The invention relates to a hollow glass microsphere and polymer composite having enhanced viscoelastic and rheological properties.
UTILITY MATERIALS INCORPORATING A MICROPARTICLE MATRIX FORMED WITH A SETTING AGENT
A composition, utility material, and method of making a utility material is disclosed. A composition having an improved setting time may include a plurality of microparticles mixed with a sodium silicate binder and an isocyanate setting agent, where the microparticle composition has a setting time of less than or equal to one hour. A utility material may be a wallboard that includes the composition.
Reduced density hollow glass microsphere polymer composite
The invention relates to a hollow glass microsphere and polymer composite having enhanced viscoelastic and rheological properties.
UTILITY MATERIALS INCORPORATING A MICROPARTICLE MATRIX FORMED WITH A SETTING AGENT
A composition, utility material, and method of making a utility material is disclosed. A composition having an improved setting time may include a plurality of microparticles mixed with a sodium silicate binder and an isocyanate setting agent, where the microparticle composition has a setting time of less than or equal to one hour. A utility material may be a wallboard that includes the composition.
Composite materials and uses thereof
The present invention relates to composite materials and the use thereof as energy resistant, for example blast-resistant, materials. Preferred aspects of the invention relate to layered composite panels comprising solid foam materials which have both a blast attenuation function and an anti-ballistic function. In further aspects, the invention provides novel composite panels which are suitable for use as blast resistant and/or anti-ballistic materials. In some examples described, the layered composite panel comprises a polymeric material (10) bonded to a first solid open-cell foam panel (12), and a cured polymeric material (14) penetrates a surface of the first solid open-cell foam panel (12).
REDUCED DENSITY HOLLOW GLASS MICROSPHERE POLYMER COMPOSITE
The invention relates to a hollow glass microsphere and polymer composite having enhanced viscoelastic and rheological properties.
Inorganic material composite
The invention relates to a ceramic particulate and polymer composite having enhanced viscoelastic and rheological properties.
METHODS FOR PRODUCING METAL CARBIDE MATERIALS
Methods of producing silicon carbide, and other metal carbide materials. The method comprises reacting a carbon material (e.g., fibers, or nanoparticles, such as powder, platelet, foam, nanofiber, nanorod, nanotube, whisker, graphene (e.g., graphite), fullerene, or hydrocarbon) and a metal or metal oxide source material (e.g., in gaseous form) in a reaction chamber at an elevated temperature ranging up to approximately 2400° C. or more, depending on the particular metal or metal oxide, and the desired metal carbide being produced. A partial pressure of oxygen in the reaction chamber is maintained at less than approximately 1.01×10.sup.2 Pascal, and overall pressure is maintained at approximately 1 atm.