Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Hot melt adhesives comprising (i) styrene butadiene copolymer, (ii) olefin block copolymer (OBC), and (iii) water white hydrogenated hydrocarbon resin are described. The adhesives exhibit high optical clarity and are relatively clear over a wide range of temperatures. The adhesives also exhibit good adhesion at cold temperatures. Also described are laminates of the adhesive with polymeric films, such as adhesive labels that can be used in labeling containers. In addition, various goods such as containers labeled using the adhesives are described.

A composition includes methyl methacrylate MMA, at least one elastomer or a core-shell polymer, and at least one radical former, as an adhesive, sealant or coaling for gluing, sealing or coaling substrates containing plasticized PVC.

An adhesive tape has a preferably textile carrier and of a pressure-sensitive adhesive which is applied on at least one side of the carrier and is in the form of a dried polymer dispersion. The polymer being synthesized from (a) 5% to 25% by weight, preferably 10% to 22% by weight, of ethylene, (b) 30% to 69% by weight, preferably 40% to 60% by weight, of alkylacrylic ester having C.sub.4 to C.sub.12 alkyl radicals, (c) 20% to 55% by weight, preferably 28% to 38% by weight, of vinyl acetate, (d) 0% to 10% by weight of other ethylenically unsaturated compounds, and the pressure-sensitive adhesive comprising between 15 and 100 parts by weight of a tackifier (based on the mass of the dried polymer dispersion).

A building material comprising a substrate layer and a pressure-sensitive adhesive layer, where the pressure-sensitive adhesive layer includes expandable graphite.

A protective film 10 of the present invention is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21 while heating the resin substrate 21. The protective film 10 includes a base material layer and a pressure sensitive adhesive layer which is positioned between the base material layer and the resin substrate 21 and is adhered to the resin substrate 21. The base material layer is formed of a laminate having a first layer which is positioned on the opposite side of the pressure sensitive adhesive layer, contains a thermoplastic resin, and has a melting point of 150° C. or higher and a second layer which is positioned on the pressure sensitive adhesive layer side, contains a thermoplastic resin, and has a melting point of lower than 120° C.

Hot melt adhesives comprising (i) styrene butadiene copolymer, (ii) olefin block copolymer (OBC), and (iii) water white hydrogenated hydrocarbon resin are described. The adhesives exhibit high optical clarity and are relatively clear over a wide range of temperatures. The adhesives also exhibit good adhesion at cold temperatures. Also described are laminates of the adhesive with polymeric films, such as adhesive labels that can be used in labeling containers. In addition, various goods such as containers labeled using the adhesives are described.

Adhesive tapes are described which find particular application for sealing joints or regions between adjacent panels such as rigid foam insulation panels. Also described are methods of using the sealing tapes and systems of sealed panels using the sealing tapes.

Hot melt adhesives comprising (i) styrene butadiene copolymer, (ii) olefin block copolymer (OBC), and (iii) water white hydrogenated hydrocarbon resin are described. The adhesives exhibit high optical clarity and are relatively clear over a wide range of temperatures. The adhesives also exhibit good adhesion at cold temperatures. Also described are laminates of the adhesive with polymeric films, such as adhesive labels that can be used in labeling containers. In addition, various goods such as containers labeled using the adhesives are described.

Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.