Patent classifications
Y10T428/31522
Method of manufacturing multi-layer thin film, member including the same and electronic product including the same
Disclosed herein is a method of forming a multilayer thin film by depositing target particles, detached from a target by plasma discharge of inert gas, on a metal object using a multilayer thin film deposition apparatus and a multilayer thin film formed by the method. More specifically, a sputtering deposition apparatus is used as the multilayer thin film deposition apparatus. The method includes coating a metal object with a coating layer, depositing at least one hardness-enhancing layer on the coating layer, and depositing a color layer on the at least one hardness-enhancing layer.
Entry sheet for drilling and drilling method
Provided is an entry sheet for drilling that, compared with a conventional entry sheet for drilling, has better hole position accuracy, can suppress drill bit breakage, and exhibits less processing chips wrapping around the drill bit. This entry sheet for drilling includes a metallic support foil and a layer comprising a resin composition that is formed on at least one surface of the metallic support foil, wherein the resin composition contains a cellulose derivative (A) and a water-soluble resin (B), the cellulose derivative (A) includes a hydroxyalkyl cellulose and/or a carboxyalkyl cellulose having a weight average molecular weight of 20,000 to 350,000, and based on 100 parts by mass of the resin composition, the content of the cellulose derivative (A) is 5 to 40 parts by mass and the content of the water-soluble resin (B) is 60 to 95 parts by mass.
Sequential infiltration synthesis for advanced lithography
A plasma etch resist material modified by an inorganic protective component via sequential infiltration synthesis (SIS) and methods of preparing the modified resist material. The modified resist material is characterized by an improved resistance to a plasma etching or related process relative to the unmodified resist material, thereby allowing formation of patterned features into a substrate material, which may be high-aspect ratio features. The SIS process forms the protective component within the bulk resist material through a plurality of alternating exposures to gas phase precursors which infiltrate the resist material. The plasma etch resist material may be initially patterned using photolithography, electron-beam lithography or a block copolymer self-assembly process.
Coating compositions exhibiting corrosion resistance properties and related coated substrates
Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating later is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed.
Member for semiconductor manufacturing apparatuses
A member for semiconductor manufacturing apparatuses, which includes a ceramic electrostatic chuck and a cooling plate bonded together with a thermosetting sheet, is provided. The thermosetting sheet is made of a cured epoxy-acrylic adhesive. The adhesive contains (A) an epoxy resin capable of hydrogen transfer type polyaddition, (B) an acrylate or methacrylate polymer, and (C) a curing agent.
Conductive member
Provided is such a conductive member that a change in its electrical resistance value caused by its long-term use is reduced to the extent possible. The conductive member has a conductive support and a conductive layer, the conductive layer contains a rubber composition formed of a modified epichlorohydrin rubber, and the modified epichlorohydrin rubber has a unit represented by the following formula (1). In the formula (1), R1, R2, and R3 each independently represent hydrogen or a saturated hydrocarbon group having 1 to 18 carbon atoms. ##STR00001##
Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same
A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): ##STR00001##
wherein m, n, l, R.sub.1, and R.sub.2 are as defined in the specification.
COATING COMPOSITIONS EXHIBITING CORROSION RESISTANCE PROPERTIES AND RELATED COATED SUBSTRATES
Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating later is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed.
Coating compositions exhibiting corrosion resistance properties and related coated substrates
Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating later is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed.
Composite structure having an inorganic coating adhered thereto and method of making same
The present disclosure provides a composite structure and associated method for preparing a composite substrate comprising an inorganic coating that is adhered to an organic-based substrate via an adhesion promoting agent comprising a molecule having a urea moiety at one end of the molecule and an alkoxysilane moiety at the other end of the molecule. The use of adhesion promoting agent having at least one of an amine or imine moiety and an alkoxysilane moiety promotes tight adhesion of the inorganic coating to the substrate.