Methods of coating a substrate are disclosed. The methods comprise applying shear force to a coating composition either before or during application of the coating composition to the substrate. The coating composition comprises a water-borne or solvent-borne film-forming resin and a catalyst associated with a carrier, wherein at least some of the catalyst can be released from the carrier upon application of the shear force. Also provided are coated articles prepared by the methods.

There is provided resist underlayer film for lithography process with high dry etching resistance, wiggling resistance, and heat resistance. Resist underlayer film-forming composition for lithography including polymer having unit structure of Formula (1): wherein A is hydroxy group-substituted C.sub.6-40 arylene group derived from polyhydroxy aromatic compound; B is C.sub.6-40 arylene group or C.sub.4-30 heterocyclic group containing nitrogen atom, oxygen atom, sulfur atom, or combination thereof; X.sup.+ is H.sup.+, NH.sub.4.sup.+, primary ammonium ion, secondary ammonium ion, tertiary ammonium ion, or quaternary ammonium ion, T is hydrogen atom, C.sub.1-10 alkyl group or C.sub.6-40 aryl group that may be substituted with halogen group, hydroxy group, nitro group, amino group, carboxylate ester group, nitrile group, or combination thereof as substituent, or C.sub.4-30 heterocyclic group containing nitrogen atom, oxygen atom, sulfur atom, or combination thereof, B and T may form C.sub.4-40 ring together with carbon atom to which they are bonded. ##STR00001##

The present invention provides an interlayer film for laminated glass, that exhibits an excellent sound-insulating performance for solid-borne sound in an environment at or below 0° C. Another object is to provide laminated glass that is obtained using this interlayer film for laminated glass. The present invention is an interlayer film for laminated glass, that has a sound-insulating layer for which a temperature T1, which is the temperature that gives the maximum value of tan δ at a frequency of 1 Hz, is in the range from −30° C. to 0° C.

Methods of coating a substrate are disclosed. The methods comprise applying shear force to a coating composition either before or during application of the coating composition to the substrate. The coating composition comprises a water-borne or solvent-borne film-forming resin and a catalyst associated with a carrier, wherein at least some of the catalyst can be released from the carrier upon application of the shear force. Also provided are coated articles prepared by the methods.

A multi-layered laminate for producing membranes for electroacoustic transducers, comprises a first layer of a polyether ether ketone film having a heat of crystallisation of at least 15 J/g, a second layer (of a thermoplastic plastic film having a heat of crystallisation of no more than 5 J/g, and an adhesive layer arranged between the first and second layers. Alternatively, the first and second layers are defined by their shrinkage properties after 15 minutes at 200° C.: the first layer has shrinkage of more than 10% in at least one direction, and the second layer has shrinkage of less than 10% in the longitudinal and transverse directions. A laminate constructed in this manner exhibits lower fold formation when processed using multi-cavity thermoforming. The laminates are useful for the production of membranes for electroacoustic transducers.

The present invention provides an interlayer film for laminated glass, that exhibits an excellent sound-insulating performance for solid-borne sound in an environment at or below 0° C. Another object is to provide laminated glass that is obtained using this interlayer film for laminated glass. The present invention is an interlayer film for laminated glass, that has a sound-insulating layer for which a temperature T1, which is the temperature that gives the maximum value of tan δ at a frequency of 1 Hz, is in the range from −30° C. to 0° C.

The method consists of the formation of a layer over a stone substrate to increase its hardness, chemical resistance, wear and scratch resistance, comprising applying on the substrate a coating matrix incorporating an organic material and fillers including inorganic nanoparticles and/or microparticles; chemically binding said matrix to the substrate, by a self-assembly process and/or a binding process by covalent bonding, electrostatic bonding, van der Waals bonding or hydrogen bonds; and finally drying said matrix. The mentioned organic material is selected from organosilanes, organophosphates, polycarboxylic compounds, compounds based on triazine heterocycles and said nanoparticles are nanoparticles of oxides, carbides, borides, nitrides of metals or of semimetals.

A method for producing a semiconductor device, which includes forming an underlayer film on a semiconductor substrate with a resist underlayer film forming composition that contains a solvent, and a polymer containing a unit structure of Formula (2):
O—Ar.sub.2—O—Ar.sub.3-T-Ar.sub.4  Formula (2)
where Ar.sub.2, Ar.sub.3, and Ar.sub.4 are individually a C.sub.6-50 arylene group or an organic group containing a heterocyclic group; at least one of Ar.sub.3 and Ar.sub.4 is a phenylene group; and T is a carbonyl group. The resist underlayer film forming composition has a solid content of 0.1 to 70 mass % of a total mass of the composition.

The present invention aims to provide an intermediate film for laminated glass which, in the case of being used for constituting a laminated glass, enables to improve the sound-insulating property of the obtained laminated glass, and a laminated glass. The intermediate film 1 for laminated glass of the present invention comprises a first layer 2 which contains a polyvinyl acetal resin and a plasticizer, and the polyvinyl acetal resin and the first plasticizer are a polyvinyl acetal resin and a first plasticizer which have a cloud point of 5° C. or lower when the cloud point is measured using a solution prepared by dissolving 8 parts by weight of the polyvinyl acetal resin in 100 parts by weight of the first plasticizer; and the laminated glass 11 of the present invention comprises first and second components for laminated glass, and the intermediate film 1 for laminated glass sandwiched between the first and second components for laminated glass.

A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): ##STR00001##
wherein m, n, l, R.sub.1, and R.sub.2 are as defined in the specification.