A sensor device has an insulative non-woven fabric and a conductive fabric forming an electrode. The conductive fabric is joined to one surface of the non-woven fabric by at least one of fusion and seaming.

A sensor device has an insulative non-woven fabric and a conductive fabric forming an electrode. The conductive fabric is joined to one surface of the non-woven fabric by at least one of fusion and seaming.

Certain aspects of the invention provides a transient liquid phase (TLP) bonding structure, including Ni based alloys and a TLP bonded layer formed by pack cementation on the Ni based alloys using a pack composition. In one embodiment, the pack composition includes 57 wt. % of aluminum oxide powder, 30 wt. % of Ti powder, 10 wt. % of Ni-50 wt. % Al alloy powder and 3 wt. % of ammonium chloride powder. The Ni based alloys may be Ni-20 wt. % Cr alloys. In certain embodiments, pack cementation is performed on the Ni based alloys under argon for an hour using the pack composition to form a coating. Then the structure is sonicated in acetone for 2 hours, and then annealed under vacuum at about 1200 C. for 2 days to form the TLP bonding structure, which has a uniform phase distribution with identical compositions and properties at its bonding regions.

A fabric having resilient prominences on at least one surface is described for improved thermal protection, drag reduction and quick drying. Resilient prominences are bulges that extend outward from a fabric surface and trap some volume of air or other material therein. For example, a resilient prominence may be dome shaped and extend outward from the fabric plane. A resilient prominence is resilient in shape, whereby the resilient prominence may be compressed and then popped back into substantially the original shape. Reflective and/or absorptive materials may be configured on the surface of the fabric to provide camouflage from IR cameras. Reflective material may be configured on the fabric to reflect heat back to the wearer of a garment made with the fabric described.