A cutting apparatus includes a cassette table on which a first cassette in which a frame unit, ring-shaped frame and wafer are housed, and a second cassette in which a simple wafer is housed. A first conveying unit having a first frame holding part holds the ring-shaped frame of the frame unit withdrawn from the first cassette and conveys the frame unit to a chuck table. A first wafer holding part holds the simple wafer withdrawn from the second cassette and conveys the simple wafer to the chuck table. A cutting unit cuts the wafer, and a second conveying unit conveys the frame unit from the chuck table to a cleaning unit. A second wafer holding part holds the cut simple wafer and conveys it from the chuck table to the cleaning unit.

A fiber cleaver having a displaceable fiber guide for aligning and guiding an optical fiber. Generally, the fiber cleaver includes a pair of clamps that may articulate between a retracted position and a clamping position. A displaceable fiber guide directs the optical fiber as it travels along an internal path of the fiber cleaver. The fiber guide translates between a loading position and a clamping position. When the clamps are securing the optical fiber to the internal path, a linear actuator may be depressed in order to translate the fiber guide and ultimately direct the optical fiber toward a scoring blade to cleave the fiber. The fiber guide is sized and shaped such that a predetermined length of optical fiber will remain after cleaving.

A station for cutting a barb suture is provided. The barb cutting station includes a suture transport assembly for supporting a first suture, a first knife assembly for forming barbs on the first suture, and a first clamp and position assembly for approximating the at least first suture towards the at least first knife assembly. The barb cutting station may further include at least a first suture cutting mechanism configured for severing the at least first suture when a defect is detected. The station may also include at least a first visual inspection assembly configured for detecting defective barbs.

A cutting apparatus includes a cassette table on which a first cassette in which a frame unit, ring-shaped frame and wafer are housed, and a second cassette in which a simple wafer is housed. A first conveying unit having a first frame holding part holds the ring-shaped frame of the frame unit withdrawn from the first cassette and conveys the frame unit to a chuck table. A first wafer holding part holds the simple wafer withdrawn from the second cassette and conveys the simple wafer to the chuck table. A cutting unit cuts the wafer, and a second conveying unit conveys the frame unit from the chuck table to a cleaning unit. A second wafer holding part holds the cut simple wafer and conveys it from the chuck table to the cleaning unit.

Among other things, a piece of furniture is formed from three separate precut pieces of flat cardboard. A first one of the pieces has a bottom edge to rest on a floor with the first piece rising vertically from the bottom edge and has at least one slot at an upper edge of the first piece. A second one of the pieces has a bottom edge to rest on the floor with the second piece rising from the bottom edge and having at least one slot at an upper edge of the second piece. A third one of the pieces has a crease across the piece and at least two slots along at least one edge that is parallel to the fold. The piece of furniture is formed by mating the one slot in the first piece with one of the slots of the third piece, folding the third piece of cardboard at the crease, and mating the one slot in the second piece with another one of the slots of the third piece, with the third piece folded along the crease.

A cell cutting device that cuts a mother substrate for display devices includes a fixing unit configured to move in a state where the mother substrate for display devices is fixed on the fixing unit, a cutter configured to perform a cutting process on the mother substrate for display devices and the cutter faces a surface of the mother substrate during the cutting process, a cutter driving unit driving the cutter in a state where the cutter is fixed thereon, and a buffer member arranged on another surface of the mother substrate to correspond to the cutter. The other surface is opposite the surface facing the cutter.

A station for cutting a barb suture is provided. The barb cutting station includes a suture transport assembly for supporting a first suture, a first knife assembly for forming barbs on the first suture, and a first clamp and position assembly for approximating the at least first suture towards the at least first knife assembly. The barb cutting station may further include at least a first suture cutting mechanism configured for severing the at least first suture when a defect is detected. The station may also include at least a first visual inspection assembly configured for detecting defective barbs.

A station for cutting a barb suture is provided. The barb cutting station includes a suture transport assembly for supporting a first suture, a first knife assembly for forming barbs on the first suture, and a first clamp and position assembly for approximating the at least first suture towards the at least first knife assembly. The barb cutting station may further include at least a first suture cutting mechanism configured for severing the at least first suture when a defect is detected. The station may also include at least a first visual inspection assembly configured for detecting defective barbs.

The embodiments of the present invention provide a display mother panel to be divided into a plurality of display panels. A sealing agent is provided around a display region of each display panel, the sealing agents provided between adjacent longitudinal edges of the display regions of two adjacent display panels in a same row are formed integrally, and a first black matrix is provided on the sealing agents provided between the adjacent longitudinal edges of the display regions of the two adjacent display panels. The embodiments of the present invention also provide a method of cutting the display mother panel. The display mother panel may be easily cut into the plurality of display panels by cutting the display mother panel using the method according to the embodiments of the present invention, and each display panel has a relatively large display area.

A device for punching and scoring a medium includes a punch tool and a grooved score guide. The punch tool has a cutter configured to cut an edge of a sheet of the medium. The positioning edge is disposed on the device and configured to guide an edge of the medium and position the medium with respect to the punch tool. The grooved score guide is formed in the device and configured to match a scoring tool to create a score line in the medium. The arrangement between the punch tool and positioning edge is configured to cut a notch in the edge of the medium at a notch point. The grooved score line is disposed in relationship to the punch tool to create the score line in the medium from the notch point across the medium.