Y10T83/0385

Scribing wheel, method for manufacturing the scribing wheel, and scribing method

A scribing wheel for scribing a brittle material-made substrate. A disc-shaped scribing-wheel base material in use is so designed that a mid-portion of a disc periphery has the largest diameter. A diamond film is formed on the periphery by a CVD method. The periphery is ground in the middle so that a plane including a circle defined by ridge line becomes perpendicular to the central axis of the scribing wheel.

Perforating apparatus for manufacturing a nonlinear line of weakness

A perforating apparatus includes a longitudinal cylinder axis about which a cylinder rotates. At least one shaped anvil is disposed on the cylinder. Further, a support operatively engages with the cylinder, and the support is moveable with respect to the cylinder. A blade is disposed on the support so as to cooperate in contacting relationship with the anvil, and the blade is substantially parallel to the longitudinal cylinder axis. At least one of the blade and the anvil comprises a plurality of teeth, and adjacent teeth are separated by a recessed portion. A web is perforated as the web passes between the rotating cylinder and the support and the blade cooperates with the anvil.

Glass plate scribing apparatus
10793463 · 2020-10-06 · ·

A scribing apparatus includes a horizontal table on which a glass plate is placed and fixed under vacuum suction; a feed screw and a Y-axis control motor 6 for moving the table along a pair of guide rails under scribe numerical control; a guide rail device body installed above the table along an X-axis direction; a carriage mounted on the guide rail device body so as to move in the X-axis direction while being guided; a feed screw and an X-axis control motor for moving the carriage in the X-axis direction under numerical control; and a scribe head installed on the carriage.

Scribing wheel having fine structure recess

Disclosed herein is a scribing wheel having a predetermined thickness and a disk shape. The scribing wheel includes: a wheel body configured in such a way that at least a peripheral edge portion thereof is gradually reduced in thickness from the center to the radial outside; and a cutter part including recesses and cutting blade teeth which are alternately arranged along the peripheral edge portion. Each recess is formed by a combination of side recess portions formed in opposite side surfaces of the peripheral edge portion of the wheel body and an edge recess portion formed in the peripheral edge of the wheel body.

Methods and apparatus for preparing power transmission cables

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

METHODS AND APPARATUS FOR PREPARING POWER TRANSMISSION CABLES
20180174713 · 2018-06-21 ·

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

Methods and apparatus for preparing power transmission cables

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

Glass plate scribing method
09593035 · 2017-03-14 · ·

A scribing apparatus 1 includes a horizontal table 3 on which a glass plate 2 is placed and fixed under vacuum suction; a feed screw 5 and a Y-axis control motor 6 for moving the table 3 along a pair of guide rails 4 under scribe numerical control; a guide rail device body 7 installed above the table 3 along an X-axis direction; a carriage 8 mounted on the guide rail device body 7 so as to move in the X-axis direction while being guided; a feed screw and an X-axis control motor 9 for moving the carriage 8 in the X-axis direction under numerical control; and a scribe head 10 installed on the carriage 8.