Patent classifications
Y10T83/141
Parting device and parting method
A parting device and a parting method are provided, in particular for trimming workpieces (2), in particular solar modules. The parting device has a multi-member (12, 13, 14, 15) programmable robot (6) which is in the form of a tactile robot, in particular a force/torque-regulated robot. The robot guides a parting tool (8) which is in the form of a knife.
Wire saw
A device for cutting a length of pipe includes a clamp portion for clamping around a length of pipe and a bow moveable with respect to the clamp portion that retains a loop of diamond embedded wire. The device further includes a feed for driving the bow with respect to the clamp portion and a detector for detecting bending of the wire and a control responsive to the detector for controlling feed rates. The device is made of modular parts and has synchronizing arms for clamping around a length of pipe. In one embodiment, the wheels are retained in enclosures with slots through which the cutting wire passes.
TABLE SAW WITH TABLE SENSOR FOR SENSING CHARACTERISTIC OF WORKPIECE
Various safety systems for power tools, and in particular table saws include detection systems for detecting a dangerous condition relative to a blade of the power tool, reaction systems for taking mitigation action in response to detection of a dangerous condition. The safety system may detect, prevent, and/or mitigate a dangerous condition associated with the power tool.
Cutting system, adjustable sorting apparatus and method thereof
A method and a cutting system for sheets includes a cutting center, a sorting apparatus with handlers for gripping pieces cut by the cutting center, and a transfer board, movable between the handler area and the inside of the cutting center, supporting the sheets. The cutting center includes a cutting head movably mounted above the transfer board with a distance detection sensor, detecting distance data with respect to a sheet on the transfer board. The cutting center and sorting apparatus have respective first and second control logics. A data interface unit lies between the first and second control logic, by which distance data from the distance detection sensor, are transferred. The second control logic has a processor defining, periodically during operation cycles, an altitude map based on the distance data detected in a number of positions, and controlling a gripping step of the handlers based on the altitude map.
Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces
Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.
Sawing machine and method for controlling a sawing machine
A method for controlling a sawing machine with a sawing tool, which is driven by an electrical sawing tool drive with a first frequency converter, and with a sawing feed device for moving the driven sawing tool at a feed rate in relation to a workpiece to be sawn, and also to such a sawing machine. The feed rate is changed over from an idling feed rate to a working feed rate when the sawing tool engages in the workpiece. A value of a physical variable which corresponds to the torque transferred from the sawing tool drive to the sawing tool or from which a change in this torque can be calculated is determined here at the first frequency converter. The changeover from the idling feed rate to the working feed rate takes place in dependence on the value of this physical variable.
Sample preparation saw
A saw has a system for sensing the torque on a cutting blade to signal when the blade begins to cut material. The saw has a drive belt extending between a driven wheel and a drive wheel and a belt tensioner that engages a side of the belt and maintains tension in the belt. The belt tensioner is movable to maintain the tension in the belt. A control system calculates the movement of the belt tensioner. The saw has a system for determining the size of the sacrificial blade. A through beam photoelectric emitter and receiver pair are positioned on opposite sides of the blade such that a largest cutting blade is moved above the beam regardless of a horizontal position of the cutting blade and sensor senses a vertical position of the axis of the blade. The sensor senses the vertical position of the blade axis when the blade is moved above the beam.
Window Covering Sizing Method and Apparatus
A method and apparatus for cutting a window covering comprises saw for cutting the window blind. A clamp assembly moves the window covering relative to the saw. A controller moves the clamp assembly to automatically position the window covering relative to the saw. The saw is moved into engagement with the window covering to cut the window covering.
CUTTING SYSTEM, ADJUSTABLE SORTING APPARATUS AND METHOD THEREOF
A method and a cutting system for sheets includes a cutting center, a sorting apparatus with handlers for gripping pieces cut by the cutting center, and a transfer board, movable between the handler area and the inside of the cutting center, supporting the sheets. The cutting center includes a cutting head movably mounted above the transfer board with a distance detection sensor, detecting distance data with respect to a sheet on the transfer board. The cutting center and sorting apparatus have respective first and second control logics. A data interface unit lies between the first and second control logic, by which distance data from the distance detection sensor, are transferred. The second control logic has a processor defining, periodically during operation cycles, an altitude map based on the distance data detected in a number of positions, and controlling a gripping step of the handlers based on the altitude map.
Window covering sizing method and apparatus
A method and apparatus for cutting a window covering comprises saw for cutting the window blind. A clamp assembly moves the window covering relative to the saw. A controller moves the clamp assembly to automatically position the window covering relative to the saw. The saw is moved into engagement with the window covering to cut the window covering.