An apparatus and a method for trimming a module are disclosed. In and embodiment the method includes fixing a rear transverse side of module, guiding the rear cutting head along the rear transverse side thereby cutting off a rear overlapping portion of the overlapping film and releasing the rear transverse. The method further includes moving the module into a region of two longitudinal cutting devices, fixing the module on both longitudinal sides, guiding longitudinal cutting heads along the longitudinal sides thereby cutting off longitudinally overlapping film portions on both longitudinal sides, and releasing the longitudinal sides of the module. The method furthermore includes moving the module into a region of the front cutting device, fixing a front transverse side of the module, guiding a front cutting head along the front transverse side thereby cutting off a front overlapping portion of the overlapping film.

In order to improve a saw device with a feed axis for a workpiece to be sawed, with a first saw unit to saw the workpiece in a first sawing plane extending transversely to the feed axis and with a second saw unit to saw the workpiece in a second sawing plane extending transversely to the feed axis, with a central device region arranged between the sawing planes, with a front device region arranged in front of the first sawing plane, viewed in a feed direction, and with a rear device region arranged behind the second sawing plane, viewed in the feed direction, in such a way that as high a cutting efficiency as possible can be achieved, it is proposed that the saw device comprises at least two transport mechanisms arranged in different device regions to transport different workpiece portions along the feed axis.