An apparatus and a method for trimming a module are disclosed. In and embodiment the method includes fixing a rear transverse side of module, guiding the rear cutting head along the rear transverse side thereby cutting off a rear overlapping portion of the overlapping film and releasing the rear transverse. The method further includes moving the module into a region of two longitudinal cutting devices, fixing the module on both longitudinal sides, guiding longitudinal cutting heads along the longitudinal sides thereby cutting off longitudinally overlapping film portions on both longitudinal sides, and releasing the longitudinal sides of the module. The method furthermore includes moving the module into a region of the front cutting device, fixing a front transverse side of the module, guiding a front cutting head along the front transverse side thereby cutting off a front overlapping portion of the overlapping film.