A method and apparatus for cutting a window covering comprises saw for cutting the window blind. A clamp assembly moves the window covering relative to the saw. A controller moves the clamp assembly to automatically position the window covering relative to the saw. The saw is moved into engagement with the window covering to cut the window covering.

A device for cutting off one or more sample regions from a sample carrier that contains impregnated sample material, e.g. blood, is described. The device includes: a cutting unit (103) for cutting off the one or more sample regions from the sample carrier, an optical imaging unit (101) for producing an electronic image of the sample carrier, and a processor (102) for controlling a display screen (108) to display the image (104) and one or more indicators (105, 105) each expressing the location of one sample region to be cut off. Thus, an operator of the device is enabled to monitor, without direct visual communication to the sample carrier, what region or regions of the sample carrier is/are to be cut off. As no direct visual communication with the sample carrier is needed, the working ergonomics of the operator can be improved.

A method and apparatus for cutting a window covering comprises saw for cutting the window blind. A clamp assembly moves the window covering relative to the saw. A controller moves the clamp assembly to automatically position the window covering relative to the saw. The saw is moved into engagement with the window covering to cut the window covering.

A method and apparatus for cutting a window covering comprises saw for cutting the window blind. A clamp assembly moves the window covering relative to the saw. A controller moves the clamp assembly to automatically position the window covering relative to the saw. The saw is moved into engagement with the window covering to cut the window covering.

A self-cleaning apparatus for sorting a mixture of materials is disclosed that comprises a material sorter and a gantry positioning system elevated above the material sorter. The gantry positioning system includes a longitudinal travel rail with a longitudinal travel rail carriage, a traverse travel rail with a transverse travel rail carriage connected to the longitudinal travel rail carriage running perpendicular to the longitudinal travel rail, and a vertical travel rail connected to the vertical travel rail carriage running perpendicular to the traverse travel rail. A cutter and, optionally, a picker, are connected to the vertical travel rail. The gantry positioning system can move the cutter and picker various directions to dislodge and remove material that may have accumulated on the sorter. Instead of a gantry positioning system, the apparatus may have a multi-axis arm.

A cell cutting device that cuts a mother substrate for display devices includes a fixing unit configured to move in a state where the mother substrate for display devices is fixed on the fixing unit, a cutter configured to perform a cutting process on the mother substrate for display devices and the cutter faces a surface of the mother substrate during the cutting process, a cutter driving unit driving the cutter in a state where the cutter is fixed thereon, and a buffer member arranged on another surface of the mother substrate to correspond to the cutter. The other surface is opposite the surface facing the cutter.

A self-cleaning apparatus for sorting a mixture of materials is disclosed that comprises a material sorter and a gantry positioning system elevated above the material sorter. The gantry positioning system includes a longitudinal travel rail with a longitudinal travel rail carriage, a traverse travel rail connected to the longitudinal travel rail carriage running perpendicular to the longitudinal travel rail, with a traverse travel rail carriage, and a vertical travel rail connected to the vertical travel rail carriage running perpendicular to the traverse travel rail. A cutter and optionally, a picker, are connected to the vertical travel rail. The gantry positioning system can move the cutter and picker various directions to dislodge and remove material that may have accumulated on the sorter. Instead of a gantry positioning system, the apparatus may have a multi-axis arm.

A method and apparatus for cutting a window covering comprises saw for cutting the window blind. A clamp assembly moves the window covering relative to the saw. A controller moves the clamp assembly to automatically position the window covering relative to the saw. The saw is moved into engagement with the window covering to cut the window covering.

A self-cleaning apparatus for sorting a mixture of materials is disclosed that comprises a material sorter and a gantry positioning system elevated above the material sorter. The gantry positioning system includes a longitudinal travel rail with a longitudinal travel rail carriage, a traverse travel rail connected to the longitudinal travel rail carriage running perpendicular to the longitudinal travel rail, with a traverse travel rail carriage, and a vertical travel rail connected to the vertical travel rail carriage running perpendicular to the traverse travel rail. A cutter and optionally, a picker, are connected to the vertical travel rail. The gantry positioning system can move the cutter and picker various directions to dislodge and remove material that may have accumulated on the sorter. Instead of a gantry positioning system, the apparatus may have a multi-axis arm.

Systems and methods may be provided for generating reduced-height circuit packages such as infrared detector packages. An alignment and dicing system may include an infrared camera that captures images of alignment marks of a wafer assembly through a lid wafer of the wafer assembly, a light source that illuminates the alignment marks through the lid wafer, and dicing equipment that dices the wafer assembly based on infrared images captured using the infrared camera. The light source may illuminate the alignment marks through the lid wafer by providing light such as infrared light to the wafer assembly through optics of the infrared camera. The infrared camera may capture images of alignment marks formed on a detector wafer of the wafer assembly or on an interior or lower surface of the lid wafer through the lid wafer. The dicing equipment may be aligned with the wafer assembly based on the captured images.