When manufacturing a plurality of strip members by cutting a belt-like member along a length direction thereof, the belt-like member having embedded therein a plurality of reinforcement cords arranged parallel to each other, and a weft thread that intersects the reinforcement cords, a captured image showing images of at least the reinforcement cords in a cross section of one end of the belt-like member in the length direction is used to detect the position of the image of each of the reinforcement cords (RC). The number of the actual reinforcement cord (RC) to which each of the images of the reinforcement cords (RC) corresponds is determined on the basis of an interval between the images of the detected adjacent reinforcement cords (RC) in the image and an average cord interval, and a cutting position (Xa) is set.

Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

A method and apparatus for sizing window coverings slidably extendable from a bay into an aisle of a retail outlet. The method includes the steps of locating the center of the window covering relative to a cutting station utilizing a half scale for removing a portion of the window covering from each of its ends.

A rotary die apparatus and method for three-axes registration error correction. The rotary die apparatus includes a rotary die for applying patterns to a strip of material, a sensor for sensing fiducials on the strip of material, actuators to adjust the rotary die, and a control system. The actuators adjust the rotary die along an X-axis extending along a direction of travel, along a Y-axis transverse of the direction of travel, and about a theta axis perpendicular to the X-axis and the Y-axis. The control system calculates a registration error based on a difference between an actual location or orientation of the fiducials and a desired location or orientation of the fiducials. Then the control system outputs control signals to the actuators to adjust the rotary die along the X-axis, along the Y-axis, and/or about the theta axis while the rotary die continues to rotate.

A punching device includes a punching unit, a driving unit, an edge detecting unit, a punching position setting unit, and a punching controlling unit. The punching unit punches three holes in a transported sheet along its transport direction. The driving unit moves the punching unit in an orthogonal direction. The edge detecting unit detects, in at least two locations separated from each other in the transport direction, an edge position of an edge of the sheet on one side in the orthogonal direction. The punching position setting unit sets a punching position corresponding to a hole to be punched by the punching unit in the orthogonal direction, on the basis of an amount of change in the orthogonal direction between the two edge positions. The punching controlling unit causes the punching unit to move to the punching position and punch a hole in the sheet.

A rotary die apparatus and method for three-axes registration error correction. The rotary die apparatus includes a rotary die for applying patterns to a strip of material, a sensor for sensing fiducials on the strip of material, actuators to adjust the rotary die, and a control system. The actuators adjust the rotary die along an X-axis extending along a direction of travel, along a Y-axis transverse of the direction of travel, and about a theta axis perpendicular to the X-axis and the Y-axis. The control system calculates a registration error based on a difference between an actual location or orientation of the fiducials and a desired location or orientation of the fiducials. Then the control system outputs control signals to the actuators to adjust the rotary die along the X-axis, along the Y-axis, and/or about the theta axis while the rotary die continues to rotate.

An industrial slicer comprises: a cutting station (1) that includes a plurality of blades (21, 22, 23) for slicing a food product, which blades (21, 22, 23) are spaced apart from each other by a cutting pitch, so as to obtain slices of said product having a thickness corresponding to the cutting pitch. The slicer also comprises adjustment means (5, 7, 3, 31, 41) for adjusting the distance between the blades (21, 22, 23).

Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

A recording material post-processing device includes: a recording material receiving unit that receives a recording material on which an image is formed from an image forming apparatus, the apparatus including an image forming unit that forms an image on a recording material to be transported, and a detection unit that detects a position of the recording material, on which the image is to be formed by the image forming unit, in a direction intersecting a transport direction of the recording material; a post-processing unit that performs post processing on the recording material received via the recording material receiving unit from the image forming apparatus; and a moving unit that moves the post-processing unit in the direction intersecting the transport direction of the recording material based on information related to the position of the recording material detected by the detection unit of the image forming apparatus.

Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.