The present invention relates to a porous support (20) intended to be removably positioned on a top side (11b) of a perforated plate (11) of a table (10) of a vacuum hold down device (1), the perforated plate having a bottom side (11a) connected to a vacuum system (13) for producing reduced pressure on the bottom side, wherein the porous support includes a perforated tray (21) provided on one side (21a) with outer reliefs (23) and on the other side (21b) with a blade penetrable porous structure (22) fixed thereon. The invention further relates to a vacuum hold down device (1) including such a support. The invention also relates to a process for replacing a first porous support by a second porous support in such a device.

A semiconductor package sawing device is provided that includes a semiconductor package sawing unit, an automatic tool providing portion disposed adjacent to the semiconductor package sawing unit, and a semiconductor package alignment portion. The automatic tool providing portion includes a transfer unit for transferring a chuck unit to the semiconductor package sawing unit.

An apparatus for manufacturing footwear, the apparatus including a jig and a cutting die. The jig including a base member and a plurality of pins, the jig having an outline conforming to an entire outline of a conventional midsole of an article of footwear and having an upwardly facing top surface configured to engage a foam midsole member, and the plurality of pins positioned about a periphery of the base member and projecting upwardly. The cutting die having a plurality of blades configured to form sipes in the lower surface of the foam midsole member, the cutting die being movable toward the top surface of the base member to bring the blades into contact with the foam midsole member disposed between the cutting die and the base member.

The present invention relates to a porous support intended to be removably positioned on a top side of a perforated plate of a table of a vacuum hold down device, the perforated plate having a bottom side connected to a vacuum system for producing reduced pressure on the bottom side, wherein the porous support comprises a perforated tray provided on one side with outer reliefs and on the other side with a blade penetrable porous structure fixed thereon. The invention further relates to a vacuum hold down device comprising such a support. The invention also relates to a process for replacing a first porous support by a second porous support in such a device.

The present invention relates to a porous support (20) intended to be removably positioned on a top side (11b) of a perforated plate (11) of a table (10) of a vacuum hold down device (1), said perforated plate having a bottom side (11a) connected to a vacuum system (13) for producing reduced pressure on said bottom side, wherein the porous support comprises a perforated tray (21) provided on one side (21a) with outer reliefs (23) and on the other side (21b) with a blade penetrable porous structure (22) fixed thereon. The invention further relates to a vacuum hold down device (1) comprising such a support. The invention also relates to a process for replacing a first porous support by a second porous support in such a device.

A semiconductor package sawing device is provided that includes a semiconductor package sawing unit, an automatic tool providing portion disposed adjacent to the semiconductor package sawing unit, and a semiconductor package alignment portion. The automatic tool providing portion includes a transfer unit for transferring a chuck unit to the semiconductor package sawing unit.

Devices and methods for processing animal or human tissue are provided. The devices may include a vacuum surface to secure the tissue in place and an apparatus for removing fat or other material from the tissue. The apparatus can include one or more blades and/or a fluid jet system.

The present invention relates to a device to cut hair, fibers, or thin, flexible materials, comprising at least one retaining element (2) with a cylindrically formed interior that is suitable for immobilizing and potentially bundling in lengthwise direction a sample (1) to be cut, composed of a multiplicity of hairs, fibers, or thin, flexible materials, and a cutting device (3) that is suitable for cutting the sample that is immobilized and possibly bundled in lengthwise direction, in a direction that is substantially perpendicular to the cylinder axis of the interior of the retaining element (2). The present invention relates furthermore to a method making use of the device, as well as a hair section that can be produced with the device or the method.

A magnetic cutting system includes a magnetic cutting mat assembly. The magnetic cutting mat assembly includes a cutting mat, and a magnetic layer attached to the cutting mat. Magnets releasably attach to the magnetic cutting assembly. A grain alignment guide having at least one opening receives one of magnets to secure the grain alignment guide to the magnetic cutting assembly.

Devices and methods for processing animal or human tissue are provided. The devices may include a vacuum surface to secure the tissue in place and an apparatus for removing fat or other material from the tissue. The apparatus can include one or more blades and/or a fluid jet system.