PIXEL MODULE AND FINGERPRINT IDENTIFICATION SYSTEM

Abstract

A pixel module and a fingerprint identification system are provided. The pixel module includes: a top-layer electrode, configured to receive a contact of a finger, a contact capacitance being formed between the top-layer electrode and the finger; a pixel circuit, configured to detect a capacitance value of the contact capacitance; and a resistor, coupled between the top-layer electrode and the pixel circuit. The pixel module suppresses the electrostatic current formed by the electrostatic charges, thereby achieving the effect of electrostatic protection.

Claims

1. A pixel module, comprising: a top-layer electrode, configured to receive a contact of a finger, a contact capacitance being formed between the top-layer electrode and the finger; a pixel circuit, configured to detect a capacitance value of the contact capacitance; and a resistor, coupled between the top-layer electrode and the pixel circuit.

2. The pixel module according to claim 1, wherein the resistor is configured to suppress a current between the top-layer electrode and the pixel circuit.

3. The pixel module according to claim 1, wherein the resistor has a resistance higher than 10 ohms.

4. The pixel module according to claim 1, wherein the resistor is formed of a polycrystalline silicon layer in an integrated chip process.

5. The pixel module according to claim 1, wherein the pixel circuit is arranged below the top-layer electrode, and the pixel circuit has an area that is less than or equal to an area of the top-layer electrode.

6. A fingerprint identification system, comprising a plurality of pixel modules, wherein each pixel module comprises: a top-layer electrode, configured to receive a contact of a finger, a contact capacitance being formed between the top-layer electrode and the finger; a pixel circuit, configured to detect a capacitance value of the contact capacitance; a resistor, coupled between the top-layer electrode and the pixel circuit; and a fingerprint judging module, coupled to the plurality of pixel modules, and configured to judge whether each pixel module corresponds to a finger ridge or a finger valley.

7. The fingerprint identification system according to claim 6, wherein the resistor is configured to suppress a current between the top-layer electrode and the pixel circuit.

8. The fingerprint identification system according to claim 6, wherein the resistor has a resistance higher than 10 ohms.

9. The fingerprint identification system according to claim 6, wherein the resistor is formed of a polycrystalline silicon layer in a n integrated chip process.

10. The fingerprint identification system according to claim 6, wherein the pixel circuit is arranged below the top-layer electrode, and the pixel circuit has an area that is less than or equal to an area of the top-layer electrode.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] FIG. 1 is a schematic diagram of a pixel module in the prior art;

[0013] FIG. 2 is a schematic diagram of a pixel module according to an embodiment of the present disclosure; and

[0014] FIG. 3 is a schematic diagram of a fingerprint identification system according to an embodiment of the present disclosure.

DETAILED DESCRIPTION

[0015] In order to make the objectives, technical solutions, and advantages of the present disclosure clearer, the present disclosure is further described in detail below by reference to the embodiments and the accompanying drawings. It should be understood that the embodiments described here are only exemplary ones for illustrating the present disclosure, and are not intended to limit the present disclosure.

[0016] Referring to FIG. 1, FIG. 1 is a schematic diagram of a pixel module 10. As illustrated in FIG. 1, the pixel module 10 includes a top-layer electrode TP and a pixel circuit PC. The top-layer electrode TP is configured to receive a contact of a finger FG, wherein a contact capacitance CF is formed between the top-layer electrode TP and the finger FG. Since the top-layer electrode TP is exposed outside to receive the contact of the finger FG, and the pixel module 10 needs to be subjected to wafer sawing and encapsulation and the like manufacturing processes, electrostatic charges may be accumulated in the vicinity of the top-layer electrode TP. It should be noted that when the pixel circuit PC is directly and electrically connected to the top-layer electrode TP, the electrostatic charges in the vicinity of the top-layer electrode TP may generate an electrostatic current I1 to the pixel circuit PC; and when the electrostatic charges in the vicinity of the top-layer electrode TP are too high, the electrostatic current I1 may cause damages to the pixel circuit PC.

[0017] To reduce the damages that may be caused by the current formed by the electrostatic charges to the pixel circuit, a resistor may be coupled between the top-layer electrode and the pixel circuit. Referring to FIG. 2, FIG. 2 is a schematic diagram of a pixel module 20 according to an embodiment of the present disclosure. The pixel module 20 includes a resistor R, a top-layer electrode TP and a pixel circuit PC. Similar to the pixel module 10, the top-layer electrode TP is configured to receive the contact of the finger FG, wherein a contact capacitance CF is formed between the top-layer electrode TP and the finger FG. In circuit layout, the pixel circuit PC is configured just under the top-layer electrode TP, and the pixel circuit PC occupies a circuit area that is less than or equal to the area of the top-layer electrode TP. Different from the pixel module 10, the pixel module 20 includes a resistor R coupled between a top-layer electrode TP and a pixel circuit PC, wherein the resistor R is configured to suppress electrostatic current I2 between the top-layer electrode TP and the pixel circuit PC. That is, with respect to electrostatic charges having a fixed charge quantity, the resistor R is capable of effectively suppressing the value of the electrostatic current I2, thereby protecting the pixel circuit PC.

[0018] Generally, the resistor R may be practiced without any limitation. For example, the resistor R may be achieved by using a polycrystalline silicon layer in the circuit layout, for example, the resistor may be formed by a polycrystalline silicon layer in the IC chip manufacturing process, which is, however, not limited thereto. The resistance of the resistor R is not limited. Preferably, the resistance of the resistor R is higher than 10 ohms.

[0019] In the prior art, since the pixel circuit is subject to restriction of the circuit area (In the case of applying to the pixel module of the fingerprint identification system, the circuit area occupied by the pixel circuit may be less than or equal to the area of the top-layer electrode), the pixel module fails to accommodate an additional electrostatic protection circuit; and with respect to the pixel circuit, the pixel module fails to achieve the effect of electrostatic protection. Over the prior art, the pixel module according to the present disclosure suppresses the electrostatic current formed by the electrostatic charges by using the resistor which coupled between the top-layer electrode and the pixel circuit, thereby achieving the effect of electrostatic protection.

[0020] In another aspect, the pixel circuit 20 may be applicable to a fingerprint identification system. Referring to FIG. 3, FIG. 3 is a schematic diagram of a fingerprint identification system 30 according to an embodiment of the present disclosure. The fingerprint identification system 30 includes pixel modules 20_1˜20_M and a fingerprint judging module 300; wherein the pixel modules 20_1˜20_M are the same as the pixel module 20 in terms of circuit structure, which are thus not described herein any further. The fingerprint judging module 300 is coupled to the pixel modules 20_1˜20_M, and configured to judge, according to output signals Vo_1˜Vo_M, whether the locations of the pixel modules 20_1˜20_M correspond to a finger ridge or a finger valley of a user. It should be noted that the resistors R included in the pixel modules 20_1˜20_M are capable of effectively suppressing the electrostatic current formed by the electrostatic charges, thereby achieving the effect of electrostatic protection.

[0021] In conclusion, the pixel module according to the present disclosure suppresses the electrostatic current formed by the electrostatic charges by using the resistor coupled between the top-layer electrode and the pixel circuit, thereby achieving the effect of electrostatic protection.

[0022] The present disclosure further provides a fingerprint identification system including: a plurality of pixel modules. Each pixel module includes: a top-layer electrode, configured to receive a contact of a finger, a contact capacitance being formed between the top-layer electrode and the finger; a pixel circuit, configured to detect a capacitance value of the contact capacitance; a resistor, coupled between the top-layer electrode and the pixel circuit; and a fingerprint judging module, coupled to the plurality of pixel modules, and configured to judge whether each pixel module corresponds to a finger ridge or a finger valley. The fingerprint identification system is capable of suppressing the electrostatic current formed by the electrostatic charges, thereby achieving the effect of electrostatic protection.

[0023] Described above are preferred embodiments of the present disclosure, and any equivalent modifications, polishments and the like made within the scope of the present disclosure should be covered within the scope of the present disclosure.

[0024] The described embodiments above are merely preferred embodiments of the present disclosure, but are not intended to limit the present disclosure. Any modification, equivalent replacement, and improvement made without departing from the spirit and principle of the present disclosure may fall within the protection scope of the present disclosure.