HIGHLY WRINKLED METAL THIN FILMS USING LIFT-OFF LAYERS

Abstract

Described are fabrication methods of highly wrinkled metal thin films for applications in electronics such as wearable devices, strain sensors, and capacitive sensors.

Claims

1. A method of forming a sensor component, the method comprising: providing a first layer comprising a first polymer; providing a second layer comprising a second polymer over the first layer; forming a third layer over the second layer, the third layer comprising a conductor; shrinking the first layer and the third layer to cause the third layer to be wrinkled; and separating the third layer unit from the first layer.

2. The method of claim 1, wherein the first polymer comprises a shape memory polymer.

3. The method of claim 2, wherein the shape memory polymer comprises a polyolefin.

4. The method of claim 1, wherein the second layer comprises poly(methyl methacrylate).

5. The method of claim 1, wherein the second layer has a thickness of about 100 nm.

6. The method of claim 1, wherein providing the second layer comprises spin coating the second polymer onto the first layer.

7. The method of claim 1, wherein forming the third layer comprises disposing a patterned mask over the second layer and depositing the conductor on the second layer.

8. The method of claim 1, wherein the conductor comprises a metal.

9. The method of claim 8, wherein the metal comprises gold.

10. The method of claim 1, wherein shrinking the first layer comprises shrinking the first layer by more than 300%.

11. The method of claim 1, wherein shrinking the first layer comprises shrinking the first layer by more than 1000%.

12. The method of claim 1, wherein shrinking the first layer comprises shrinking the first layer by 2000%.

13. The method of claim 1, further comprising providing a fourth layer over one surface of the conductor, the fourth layer comprising a stretchable material.

14. The method of claim 13, wherein the fourth layer comprises a silicone layer.

15. The method of claim 14, wherein the silicone layer comprises a thickness of 100-1000 μm.

16. The method of claim 13, further comprising, prior to applying the fourth layer, treating a surface of the third layer to enhance adhesion thereof to the fourth layer.

17. The method of claim 1, wherein removing the second layer comprises exposing the second polymer of the second layer to a solvent vapor to dissolve away the second polymer.

18. The method of claim 1, wherein removing the second layer comprises heating the second layer to a temperature at or above the glass transition temperature of the second polymer for a time sufficient to allow the third layer to separate from the first layer.

19. A sensor component assembly comprising: a shape memory polymer layer; a lift-off layer disposed on the shape memory polymer layer; and a conductive layer; wherein the shape memory polymer layer is capable of being shrunken by an amount sufficient to induce wrinkles in the conductor layer.

20. The sensor component assembly of claim 19, wherein the lift-off layer comprises a polymer.

21. The sensor component assembly of claim 20, wherein the polymer layer comprises poly(methyl methacrylate).

22. The sensor component assembly of claim 19, wherein the conductive layer comprises gold.

23. The sensor component assembly of claim 19, further comprising a stretchable layer disposed over a side of the conductive layer opposite the lift-off layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0009] These and other features, aspects and advantages are described below with reference to the drawings, which are intended to illustrate but not to limit the inventions. The following is a brief description of each of the drawings.

[0010] FIG. 1 shows the strain-to-failure data fabricated samples strained at rates of 10% (left) and 5% (right). Gauge factors (GF) represent the upper linear region of each graph.

[0011] FIG. 2 shows the wrinkle hierarchy formed under A) highly shrinkable SMPs (shrunk by 2000%) compared to that of B) typical SMPs (shrunk by 300%). Both samples were deposited with 15 nm Au.

[0012] FIGS. 2(A) illustrates a method disclosed herein.

[0013] FIG. 2(B) illustrates the method and various sensor component assemblies, which assemblies can be combined with other circuits and components to yield highly sensitive and effective strain gauges such as is illustrated in FIG. 3 and for which test data is shown in FIG. 1.

[0014] FIG. 3 is an example of a wrinkled metal film straight trace shrunk by 2000%, casted in an elastomeric silicone, and lifted off from a highly shrinkable SMP.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0015] Various embodiments discussed herein are configured to improve the mechanical and electrical properties of wrinkled metal thin films by using highly shrinkable SMPs (e.g., polyolefins) to induce more wrinkle formation. Without subscribing to any particular theory, to isolate the wrinkled metal thin film from the SMP, the SMP is dissolved away using common solvents like acetone. Polyolefins (PO) are relatively resistant to common solvents, thus a lift-off layer susceptible to solvents can be used. The lift-off layer, e.g., poly(methyl methacrylate) (PMMA, 950K A2 resist), can be a dissolved polymer solution suspended in anisole that can be capable of reflowing at the glass transition temperature of the polymer substrate.

Example Materials and Procedures:

[0016] 1. In block 100 of a method illustrated in FIG. 2(A), a first layer 104, e.g., a Polymer substrate: PO shrink-wrap film (being about 20 um thick) is provided, e.g., mounted onto a glass slide and secured, e.g., using polyimide tape. [0017] 2. In block 200 of the method a second layer 204, e.g., Lift-off polymer layer: PMMA is applied onto the PO surface such that a portion, e.g., at least half of the polyolefin substrate is covered with the polymer solution. The PMMA layer can be thinned to about 100 nm thickness through a two-step spin coating process: 1) 500 rpm spin speed with an acceleration of 500 rpm2 for 10 seconds, and then 2) 100 rpm spin speed with an acceleration of 1040 rpm2 for 40 seconds. Other thicknesses and speeds can be used. [0018] 3. In block 300 of the method, a conductor 304, e.g., a Metal thin film can be deposited. A pre-patterned frisket film mask can be attached to the PO+PMMA surface for selective metal deposition. 15 nm of gold (Au) is deposited onto the surface and mask via sputter deposition. The mask is removed, revealing an Au thin film design on the previously exposed regions of the PO+PMMA surface. [0019] 4. In block 400 of the method, thermal shrinkage occurs. The deposited PO+PMMA sample can be removed from its glass mount, sandwiched between two parchment paper-lined glass plates that are spaced about 1 mm apart, and is thermally shrunk in a 150° C. toaster oven until flat for about 10 minutes. At this point, the sample has shrunk by a large percentage, e.g., by about 2000% and the Au film has wrinkled due to a stiffness mismatch compared to the shrinking polymer substrate. [0020] 5. In block 500 of the method, a surface treatment is provided. The shrunk sample can be immersed in a covered silane bath consisting of (3-mercaptopropyl)trimethoxysilane (MPTMS) diluted in pure ethanol to a concentration of about 5 mmol. After about a 1-hour treatment period, the sample is rinsed with ethanol and dried using an air gun. The silane acts as a molecular glue to enhance the bond between the wrinkled Au thin film and the stretchable silicone elastomeric material. [0021] 6. In block 600 of a method, a stretchable material or layer 604, e.g., a silicone elastomer layer is provided. A 1:1 ratio of Smooth-On 00-30 Ecoflex elastomer can be prepared and vacuumed for about 10 minutes to remove air bubbles from mixing. The Ecoflex can be drop-casted to a thickness of 300-400 um onto the entire sample surface. The casted sample is placed in a vacuum chamber for about 20 minutes to remove air trapped between the Au-elastomer interface. The elastomer is then cured in an oven heated to at least about 80° C. for about ≧1 hour. The elastomer can be cured overnight. [0022] 7. In block 700 of a method, a wrinkled Au thin film is removed from a polymer substrate. The result is also illustrated in FIG. 2(B) in which the lift-off layer is present to the left of the arrow but is absent to the right of the arrow, such that the conductor 304 and the stretchable layer 604 are separated, e.g., as a unit, from the first layer 104. Lift-off of the Au film can be completed using any suitable method, such as: [0023] a. The sample is exposed to an abundant, continuous supply of solvent vapor to dissolve away the lift-off layer. In a fume hood, a 25 mL Erlenmeyer flask is filled with 15 mL of acetone. Larger flasks can be used with more acetone. The sample is hung inside the flask, but does not touch the liquid acetone. The flask is then loosely covered with aluminum foil and heated on a hot plate heated to about 95° C. to vaporize the acetone. The sample is exposed to the acetone vapor for 2-2.5 hours, or until the wrinkled Au thin film (adhered to the elastomer) can be easily peeled off the PO substrate. Once removed, the Au+elastomer is immersed in isopropyl alcohol for 20 minutes before being hang-dried overnight. [0024] b. The sample is heated above the glass transition temperature of the lift-off polymer to “melt” the lift-off layer. The sample is placed on a glass slide elastomer-side down. The glass slide and sample are heated on a hot plate, heated to about 120-140° C., for 7-9 minutes (actual values depend on the hot plate heat efficiency) to induce the reflow state of the lift-off PMMA polymer layer. The wrinkled Au thin film and casted elastomer are peeled away from the PO. Acetone is used to dissolve away any residual PMMA from the wrinkled Au thin film. If acetone is used, the sample can be hang-dried overnight.

[0025] Materials and thicknesses of the lift-off polymer, the deposited metal, and silicone elastomer can be modified to fabricate different types of electronic sensors and electrodes. The advantages of this invention include mechanical and electrical robustness under high strain, and greater sensitivity as measured by the gauge factor of the fabricated thin film device. At 10% strain increments, the resulting device can withstand strains greater than 300%. At slower strain rates, the device can withstand strains beyond 400%. Above 150% strain, the gauge factor can reach up to 40 indicating high sensitivity to strain. The fabrication process and materials are low-cost and require relatively small volumes of solvents compared to typical thin film fabrication processes. This invention can be adopted into other fabrication platforms to improve the mechanical and electrical properties of existing thin film devices.

[0026] While the present description sets forth specific details of various embodiments, it will be appreciated that the description is illustrative only and should not be construed in any way as limiting. Furthermore, various applications of such embodiments and modifications thereto, which may occur to those who are skilled in the art, are also encompassed by the general concepts described herein. Each and every feature described herein, and each and every combination of two or more of such features, is included within the scope of the present invention provided that the features included in such a combination are not mutually inconsistent.

[0027] Some embodiments have been described in connection with the accompanying drawings. However, it should be understood that the figures are not drawn to scale. Distances, angles, etc. are merely illustrative and do not necessarily bear an exact relationship to actual dimensions and layout of the devices illustrated. Components can be added, removed, and/or rearranged. Further, the disclosure herein of any particular feature, aspect, method, property, characteristic, quality, attribute, element, or the like in connection with various embodiments can be used in all other embodiments set forth herein. Additionally, it will be recognized that any methods described herein may be practiced using any device suitable for performing the recited steps.

[0028] For purposes of this disclosure, certain aspects, advantages, and novel features are described herein. It is to be understood that not necessarily all such advantages may be achieved in accordance with any particular embodiment. Thus, for example, those skilled in the art will recognize that the disclosure may be embodied or carried out in a manner that achieves one advantage or a group of advantages as taught herein without necessarily achieving other advantages as may be taught or suggested herein.

[0029] Although these inventions have been disclosed in the context of certain preferred embodiments and examples, it will be understood by those skilled in the art that the present inventions extend beyond the specifically disclosed embodiments to other alternative embodiments and/or uses of the inventions and obvious modifications and equivalents thereof. In addition, while several variations of the inventions have been shown and described in detail, other modifications, which are within the scope of these inventions, will be readily apparent to those of skill in the art based upon this disclosure. It is also contemplated that various combination or sub-combinations of the specific features and aspects of the embodiments may be made and still fall within the scope of the inventions. It should be understood that various features and aspects of the disclosed embodiments can be combined with or substituted for one another in order to form varying modes of the disclosed inventions. Further, the actions of the disclosed processes and methods may be modified in any manner, including by reordering actions and/or inserting additional actions and/or deleting actions. Thus, it is intended that the scope of at least some of the present inventions herein disclosed should not be limited by the particular disclosed embodiments described above. The limitations in the claims are to be interpreted broadly based on the language employed in the claims and not limited to the examples described in the present specification or during the prosecution of the application, which examples are to be construed as non-exclusive.