Stacked modules

Abstract

The present invention relates to a module that has a lower component of a module (1) having a material (3) in which at least one first structural element (4) is embedded, and an upper component of a module (2) having a material (3) in which at least a second component (16) is embedded. The upper component of the module (2) and the lower component of the module (1) are stacked, with the lower and the upper component of the module (2) being electrically connected and mechanically linked to each other. In addition, the present invention relates to a simple and cost-effective process for the production of a variety of modules. The invention makes it possible for the modules to be miniaturized with respect to surface and height and/or makes it possible to achieve greater integration by 3D packaging.

Claims

1. A module comprising: a lower component of the module having a first material in which at least a first structural element is embedded, and an upper component of the module having a second material in which at least a second structural element is embedded, wherein at least one of the first structural element and the second structural element is a semiconductor chip with built-in active or passive circuitry, a passive structural element, a sensor, a digital chip, a microelectromechanical systems (MEMS) device, or an acoustic wave filter, wherein the upper component of the module and the lower component of the module are stacked on top of one another, wherein the lower and the upper components of the module are in electrical connection and are mechanically connected, wherein at least one of the lower and upper components of the module, on a side facing the other of the lower and upper component of the module, has a first rewiring layer having a metal coating, by means of which the lower and upper components are electrically connected together; and wherein the upper component of the module has a second rewiring layer on its upper side directed away from the lower component of the module and has a metallization that forms both an antenna structure as well as passive elements that are connected with the second structural element.

2. The module of claim 1, wherein at least one of the components of the module, on its under side and on its opposite upper side has a rewiring layer, wherein the rewiring layers are connected with a plated through hole that extends through the component of the module.

3. The module of claim 1, wherein the lower component of the module has metal columns on an upper side facing the upper component of the module, wherein the upper component of the module has metal columns on its under side facing the lower component of the module, and wherein the metal columns of the lower component of the module and the metal columns of the upper component of the module are connected.

4. The module of claim 1, wherein the first or second material is a prepreg material or a molding material.

5. A module comprising: a lower component of the module having a first material in which at least a first structural element is embedded, and an upper component of the module having a second material in which at least a second structural element is embedded, a metallization arranged on an exterior surface of the module which allows an electromagnetic shielding of the module or which is used to dissipate heat from the module, wherein the upper component of the module and the lower component of the module are stacked on top of one another, wherein the lower and the upper components of the module are in electrical connection and are mechanically connected, and wherein at least one of the components of the module, on a side facing the other component of the module, has a rewiring layer having a metal coating, by means of which the module components are electrically connected together.

6. The module of claim 5, wherein: the metallization that forms an antenna structure arranged on an exterior surface of the module.

7. The module of claim 5, wherein the first and/or the second structural element is selected from a semiconductor chip with built-in active or passive circuitry, a passive structural element, a sensor, a digital chip, or a microelectromechanical systems (MEMS) device.

8. A module comprising: a lower component of the module having a first material in which at least a first structural element is embedded, and an upper component of the module having a second material in which at least a second structural element is embedded, the upper component being electrically and mechanically connected to the lower component, wherein the upper component has a rewiring layer having a metal coating that forms an antenna structure connected with the second structural element, wherein the upper component and the lower component are stacked on top of one another, and wherein an acoustic wave filter is the first structural element and/or the second structural element.

9. A module comprising: a lower component having a first structural element embedded in a first material, an upper component, mechanically connected to and stacked on the lower component, having second structural element embedded in a second material, wherein at least one of the first structural element and the second structural element is a semiconductor chip with built-in active or passive circuitry, a passive structural element, a sensor, a digital chip, a microelectromechanical systems (MEMS) device, or an acoustic wave filter, wherein at least one of the lower and upper components of the module has, on a side facing the other of the lower and upper component of the module, a first rewiring layer having a metal coating, by means of which the lower and upper components are electrically connected together, and a second rewiring layer on an opposite upper side, and wherein the first and second rewiring layers are connected with a plated through hole that extends through the component of the module.

10. A module comprising: a lower component having a first structural element embedded in a first material, an upper component, mechanically connected to and stacked on the lower component, having second structural element embedded in a second material, wherein at least one of the first structural element and the second structural element is a semiconductor chip with built-in active or passive circuitry, a passive structural element, a sensor, a digital chip, a microelectromechanical systems (MEMS) device, or an acoustic wave filter, wherein at least one of the lower and upper components of the module, on a side facing the other of the lower and upper component of the module, has a first rewiring layer having a metal coating, by means of which the lower and upper components are electrically connected together; and wherein the lower component of the module has metal columns on an upper side facing the upper component of the module, wherein the upper component of the module has metal columns on an under side facing the lower component of the module, and wherein the metal columns of the lower component of the module and the metal columns of the upper component of the module are connected.

Description

(1) The present invention is described below in more detail with reference to the attached figures.

(2) FIG. 1 shows a lower component of the module in cross-section.

(3) FIG. 2 shows an upper component of the module in cross-section.

(4) FIG. 3 shows a module which has been manufactured by stacking the lower component of a module shown in FIG. 1 and the upper component of the module shown in FIG. 2 in cross-section.

(5) FIG. 4 shows the module shown in FIG. 3 after performing additional processing steps.

(6) FIG. 5 shows in cross section a module according to an alternate embodiment.

(7) FIG. 1 shows a lower component of a module 1 that can be attached to an upper component of a module 2 to form a module. A single lower component of a module 1 is shown in FIG. 1. The lower component of a module 1 along with a variety of other lower components of modules can be processed into a wafer group or panel group.

(8) The lower component of a module 1 has a material 3 in which a first structural element 4 as well as other components 5 are embedded. Material 3 can be a molding material, an organic layered fabric, based in particular on epoxy or phenol, or a prepreg-material, for example.

(9) For example, the first structural element 4 may be a structural element that operates with SAW waves (surface acoustic wave=SAW). Accordingly, it is an encapsulated structural element having a cavity. The lower component of module 1 is designed in such a way that various structural elements 4, 5 can be embedded in the material 3. It is thus a technology platform that allows for integration of various construction elements 4, 5 in the module.

(10) The other structural elements 5 can be sensor chips which can be analog or digital, for example. In addition to the actual sensor element, such a sensor chip can also have logic for assessing measured data as well as a memory element. Alternatively or additionally, the other structural elements 5 can be selected from one or more of the following: a semiconductor chip with built-in active or passive circuitry, a passive structural element, a digital chip or a MEMS device.

(11) In addition, a rewiring layer 7 is arranged on the upper side 6 of the lower component of the module. The rewiring layer 7 has a metal layer 8. The rewiring layer 7 is multilayered, the metal layer 8 being arranged in several layers. The first structural element 4 has multiple contacts 9. These are connected to the metal layer 8 of the rewiring layer 7. The metal layer 8 connects the contacts 9 of the first structural element 4 with the contacts 10 arranged on the upper side of the rewiring layer 7. In this way, the position of contacts 10 can be adjusted in any way. In particular, the contacts 9 of the structural elements 4, 5 can be wired into a flat arrangement on the top 6 of the lower component of the module 1 so that the center distance of the contact can be significantly increased.

(12) The lower component of the module 1 shown in FIG. 1 has no rewiring layer on its lower side 11. This is produced in a later step.

(13) The rewiring layer 7 arranged on the top 6 of the lower component of the module 1 is electrically connected with a plated through hole 12, which extends through the lower component of the module 1.

(14) In addition, metal columns 13 are arranged on the upper side 6 of the lower component of the module 1. The metal columns 13 can consist of copper, for example. The metal columns 13 are arranged on the contacts 10 of the rewiring layer 7 and are therefore electrically connected to the metal layer 8 of the rewiring layer 7. In conjunction with the corresponding metal columns on the lower side of the upper component of the module 2, the metal columns 13 can provide electrical contact of the two components of the modules 1, 2.

(15) There is also a ring 14 on the upper side 6 of the lower component of the module 1. This is made of a metal, such as copper. The ring 14 provides mechanical stabilization and can be connected with a corresponding ring which is arranged on an lower side of an upper component of a module 2, for example by eutectic bonding.

(16) In addition, on the upper side 6 of the lower component of the module 1, metallic structures 15 made of copper, for example, may be arranged that mechanically stabilize the mechanical connection between the lower and the upper component of the module 1, 2, and that are not electrically connected.

(17) The ring 14 arranged at the edge of the upper side 6 and the other metallic structures 15 arranged in an interior area of the upper side 6 provide mechanical stabilization for the lower component of the module 1 and prevent warping.

(18) FIG. 2 shows the upper component of module 2. A single upper component of a module 2 is shown in FIG. 2. The upper component of the module 2 can be produced along with a variety of other upper components of a module 2 in a wafer group or a panel group.

(19) The upper component of the module 2 is designed to be connected with the lower component of the module 1 to form a module. The upper component of the module 2 has a structure that is similar to the lower component of the module 1. The upper component of the module 2 has a material 3 in which a second structural element 16 as well as further structural components 5 are embedded. Material 3 can be, for example, one of the above mentioned materials that are also used for the lower component of the module 1. Material 3 can be the same as the material 3 of the lower component of module 1 or can differ from this.

(20) The upper component of the module 2 also forms a platform for the integration of different structural components 16, 5. The second structural element 16 and the other structural elements 5 can, for example, be a sensor chip, one or more selected from an analog or digital chip, a passive component or a sensor chip.

(21) The upper component of the module 2, shown in FIG. 2, does not have a rewiring layer 7. In alternative embodiments, the upper component of the module 2 can have a single layer or multilayer rewiring layer 7 on its lower side 17 and/or on its upper side 18.

(22) Metal columns 13 are arranged on the under side 17 of the upper component of the module 2 which can be connected to the metal columns 13 on the upper side 6 of the lower component of the module 1 in order to electrically connect the two components of the module 1, 2. The metal columns 13 are made of copper, for example, and have a coating containing tin 19 on their side facing the lower component of the module. The metal columns 13 of the lower component of the module 1 and the metal columns 13 of the upper component of the module 2 are connected by eutectic bonding, the combination of copper and tin making a connection.

(23) Alternatively, the metal columns 13 may be coated with a conductive adhesive material instead of tin. In this case, the metal columns 13 can be glued to the corresponding metal columns of the lower component of the module 1.

(24) On its lower side 17, the upper component of the module also has a ring 14 which is designed to connect with the ring of the lower component of the module 1. In addition, the under side 17 of the upper component of the module 2 has more metallic structures 15, which contribute to the increased mechanical stability of the module. As already discussed in connection with the lower component of the module 1, the ring 14 and the other metallic structures 15 ensure mechanical stabilization and prevent warping of the upper component of the module 2. The ring 14 and other metallic structures 15 are coated with tin to allow connection by eutectic bonding. Alternatively, these elements may be coated with an adhesive. Alternatively to connection via eutectic bonding, other connection processes are possible, for example, an Ag-sintering process or soldering.

(25) FIG. 3 shows the module after the lower component of the module 1 of FIG. 1 was fixed to the upper component of the module 2 of FIG. 2. In this connection, a wafer or a panel that has a variety of lower components of a module 1 is attached to a wafer or panel that has a corresponding variety of upper components of a module 2.

(26) The two components of the module 1, 2 were connected to each other by eutectic bonding. This step was completed while the two components of a module 1, 2 in each case having a variety of other components of a module 1, 2 are connected in a wafer or a composite panel. Using eutectic bonding, the rings 14, the metal columns 13 and other metallic structures 15 were connected. The metal columns 13 provide electrical contact of the two components of the module 1, 2 with each other. The rings 14 and other metallic structures 15 are mechanically connected to each other and increase the mechanical stability of the module and in this way prevent warping of the module.

(27) In addition, an electrically insulating under-fill layer 20 is arranged between the two components of the module 1, 2. The under-fill layer 20 can consist of a conventional material or of an anisotropic conductive adhesive. It has no air pockets or voids. The under-fill layer 20 is disconnected by the structures for electrical and mechanical connection of components of the module 1, 2. These include in particular the rings 14, the other metallic structures 15 and the metal columns 13.

(28) The under-fill layer 20 ensures that the under side 17 of the upper component of the module 1 and the upper side 6 of the lower component of the module 2 each have a uniform surface without steps. The connection of the two components of the module 1, 2 can be sealed by the under-fill layer 20.

(29) In addition, material 3 was removed from the under side 11 of the lower component of the module 1 to expose the end of the through hole 12 directed downward. A contact layer 21 was then added to the under side 11 of the lower component of the module 1. This makes it possible for the module to make contact with a printed circuit board or similar.

(30) Removal of the material 3 from the lower side 11 of the lower component of the module 1 was carried out only after connecting the lower component of the module 1 with the upper component of module 2, because thereafter the module has an increased mechanical stability so that the risk of breaking the module is quite low during removal of the material.

(31) FIG. 4 shows the module shown in FIG. 3 after carrying out further steps of the manufacturing process.

(32) The modules, which were in a wafer or panel group in FIG. 3, are now separated, for example, by a sawing process. The oblique side surfaces of the module shown in FIG. 4 resulted as a result of this.

(33) In addition, material 3 was removed from the upper side 18 of the upper component of the module 2. In particular, the upper component of the module 2 was thinned using a grinding process. In this way, the thickness of the materials 3 was reduced over the structural elements 5, 16. In addition, cuts were inserted, which were used for plated through holes.

(34) Metallizations 22, 23, 24 are applied on the upper side 18 of the upper component of the module 2. Metallization 22 forms an antenna structure. Metallization 23 is used for the cooling of the module. Metallization 24 serves to protect against electrostatic discharge. In addition, a thermal via 25 is proposed that is intended to conduct heat produced to the upper side 18 of the module.

(35) With the thinning, the second structural element 16 was exposed so that its upper side is not covered by the material 3. Instead, metallization 23 is now arranged on the upper side of the second structural element 16, which serves to cool the second structural element 16.

(36) FIG. 5 shows a module in accordance with an alternate embodiment. The module shown in FIG. 5 is different from the previously shown module in that a rewiring layer 7 is arranged on the upper side 18 of the upper component of the module 2 and in that plated through holes 12 are provided in the upper component of the module which contact the rewiring level 7 arranged on the upper side 18 of the upper component of the module 2 with a contact arranged on the lower side 17. The plated through holes 12 are embedded Z lines.

(37) The rewiring layer 7 arranged on the upper side 18 of the upper component of the module 2 form an antenna structure.

(38) In the module shown in FIG. 5, the upper component of the module 2 was not thinned.

LIST OF REFERENCE NUMERALS

(39) 1 lower component of the module 2 upper component of the module 3 material 4 first structural element 5 another structural element 6 upper side of the lower component of the module 7 rewiring layer 8 metal layer 9 contact of the first structural element 10 contact of rewiring layer 11 lower side of the lower component of the module 12 plated through hole 13 metal column 14 ring 15 metallic structures 16 second structural element 17 lower side of the upper component of the module 18 upper side of the upper component of the module 19 coating 20 under-fill layer 21 contact layer 22 Metallization 23 Metallization 24 Metallization 25 thermal via