Hollow board

Abstract

The present disclosure relates to a hollow board 1 with first and second main surface layers 3, 5. A plurality of distance elements connecting the first and second main surface layers and maintain a predetermined distance there between. The main surface layers include at least a layer of high-density fiber, HDF, board, and a plurality of distance elements are distributed in the space between the main surface layers, and at least some comprise at least one elongate HDF board strip 15 which is oriented such that its longitudinal edges interconnect the first and second main surface layers 3, 5. The HDF boards of the surface layers and of the at least some of the distance elements comprise wood particles bonded by a resin including an isocyanate, such as methylene diphenyl di-isocyanate, MDI.

Claims

1. Hollow board comprising first and second main surface layers and a plurality of distance elements connecting the first and second main surface layers and maintaining a predetermined distance there between, wherein each main surface layer including at least a layer of fiberboard having a density of at least 800 kg/m.sup.3 (HDF board) and a plurality of distance elements distributed in a space between the main surface layers, and at least some of said plurality of distance elements comprising at least one elongate HDF board strip being oriented such that its longitudinal edges interconnect the first and second main surface layers, wherein the HDF boards of the surface layers and of the at least some of said plurality of distance elements comprise wood particles bonded by a resin including an isocyanate component, wherein the plurality of distance elements includes at least one stack of glued together HDF board strips, wherein the stack is oriented in between the first and second surface layers such that individual board strips in the stack interconnect the first and second surface layers.

2. Hollow board according to claim 1, wherein said at least one HDF board strip extends in a plane perpendicular to the plane of the first and second main surface layers.

3. Hollow board according to claim 1, wherein the hollow board has a main direction of extension and the HDF board strip has an elongate direction being parallel with the main direction of extension.

4. Hollow board according to claim 1, wherein the HDF board strip longitudinal edges that interconnect the main surface layers are cut edges formed by cutting the strip from a HDF board, and wherein the strip side edges being perpendicular to the longitudinal edges have a more smooth surface than the cut longitudinal edges, preferably the strip side edges being press formed side edges.

5. Hollow board according to claim 3, wherein the HDF board strip extends along at least 80% of the length of the board in the main direction of extension.

6. Hollow board according to claim 1, wherein the at least one stack of glued together HDF board strips comprises 3-10 individual HDF board strips.

7. Hollow board according to claim 1, wherein at least one stack adjoins a side edge of the hollow board.

8. Hollow board according to claim 1, wherein at least one connector element is machined in the hollow board at the location of a block placed between the surface layers, the at least one connector element extending at least partly into the block.

9. Hollow board according to claim 8, wherein the at least one block has a length (L) constituting less than 20% of the total length of the hollow board.

10. Hollow board according to claim 1, wherein the stack of HDF board strips are glued together using a polyurethane based reactive hotmelt glue.

11. Hollow board according to claim 1, wherein the plurality of distance elements includes both at least one stack of glued together HDF board strips and at least one distance element comprising a single HDF board strip, the latter being spaced apart from said at least one stack.

12. Hollow board according to claim 1, wherein the first and second main surface layers and at least one side edge surface of the hollow board are made from a single piece of HDF board.

13. Hollow board according to claim 1, wherein the isocyanate component of the resin comprises at least one component selected among methylene diphenyl di-isocyanate (MDI) and polymethylene polyphenylene isocyanate.

14. Hollow board according to claim 1, wherein the HDF board comprises 0.5-15 wt % of resin, excluding any water, containing the isocyanate component.

15. Hollow board according to claim 1, wherein at least one distance element is glued to the first and second main surface layers using a hotmelt glue.

16. Hollow board according to claim 3, wherein the HDF board strip extends along at least 90% of the length of the board in the main direction of extension.

17. Hollow board according to claim 6, wherein the at least one stack has a width (W) constituting less than 20% of the total width of the hollow board.

18. Hollow board according to claim 7, wherein the at least one stack adjoining the side edge has a width (W) constituting less than 20% of the total width of the hollow board perpendicular to that edge.

19. Hollow board according to claim 8, wherein the block is a stack of glued together HDF board strips.

20. Hollow board according to claim 9, wherein the at least one block having a width (W) constituting less than 20% of the total width of the hollow board.

21. Hollow board according to claim 13, wherein the resin comprising at least 30% of polymethylene polyphenylene isocyanate and/or methylene diphenyl di-isocyanate (MDI).

22. Hollow board according to claim 9, wherein the resin comprising a 4, 4′-methylene diphenyl di-isocyanate isomer and/or a polymethylene polyphenylene isocyanate that has been formed from a 4, 4′-methylene diphenyl di-isocyanate isomer.

23. Hollow board according to claim 14, wherein the HDF board comprises 2-10 wt % of resin, excluding any water, containing the isocyanate component.

24. Hollow board according to claim 14, wherein the HDF board comprises 3-7, wt % of resin, excluding any water, containing the isocyanate component.

25. Hollow board according to claim 14, wherein the HDF board having a density of 850-1050 kg/m3, a thickness of 0.5-6 mm, and comprises at least 50 wt % of dry wood fibers.

26. Hollow board according to claim 25, wherein the HDF board having a thickness of 1-3.5 mm, and comprises at least 80 wt % of dry wood fibers.

27. Hollow board according to claim 15, wherein at least one distance element is glued to the first and second main surface layers using a polyurethane based reactive hotmelt glue.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 illustrates schematically in perspective a board that can be used as a furniture component.

(2) FIG. 2 shows in perspective a partial cut-out of a hollow board according to the present disclosure.

(3) FIG. 3 illustrates schematically a HDF board according to the present disclosure.

(4) FIGS. 4a-7 illustrate enlarged details of the board in FIG. 2.

(5) FIG. 8 shows schematically a cross section through a connection between a main surface layer and an HDF board strip.

DETAILED DESCRIPTION

(6) The present disclosure relates to a hollow board that can be used as a furniture component. Typically, the board can make up a tabletop, a shelf, a panel in a kitchen cabinet, a door, etc. Many other applications exist. FIG. 1 illustrates schematically in perspective such a hollow board 1. The hollow board comprises a first 3 and a second 5 main surface layer, and generally makes up a flat rectangular cuboid, even though deviations from rectangular shapes, e.g. a parallelepiped could be conceivable. The main surface layers may be quadratic or may as illustrated be elongated having a main direction of extension 7 in which the board has its largest dimension.

(7) In the flat, rectangular cuboid, the first and second main surface layers may in most cases be interconnected at their four edges by edge surface layers 9, 11, although it could be conceivable in some applications to forego from using one or more of the edge surface layers, leaving an opening between the main surface layers at those locations. In most cases, the main surface layers make up most of the outer surface area of the board.

(8) The board is hollow meaning that a lot of air is enclosed therein, or in principle another gaseous medium. This provides a much lighter board as compared to a solid one. Still, a reasonable bending stiffness can be achieved as the mutual separation of the main surface layers 3, 5 provides an increased second moment of area, as compared to if the main surface layers were not separated.

(9) In order to provide structural stability, distance elements are provided, not only at the edges of the board, but spread out in the space between the main surfaces layers of the board, as will be discussed. Thus, there is provided a plurality of distance elements connecting the first 3 and second 5 main surface layers and maintaining a predetermined distance there between.

(10) In the present disclosure, the main surface layers 3, 5 as well as at least some distance members comprise a fiberboard having a density of at least 800 kg/m.sup.3, also called high density fiber board or HDF board.

(11) FIG. 3 illustrates schematically a HDF board 13 according to the present disclosure. The HDF board 13 is produced by mixing wood fibers/particles such as chips or saw dust with a resin at a raised temperature. The mixture is pressed in the illustrated z-direction at a pressure of several MPa while the resin cures. The pressing of the board 13 forms opposite pressed large faces 13a, 13b that may be smooth, as a result of the pressing. The finished product will have very uniform properties over its entire surface.

(12) In the present disclosure, the HDF board material may be about 2.0 mm thick, or within the range 1.0 to 2.4 mm, or more preferred within 1.5 to 2.2 mm.

(13) Even though the HDF board may be used on its own, it may as well be laminated with other materials. For instance, the HDF board surfaces that will make up the outer surface of the hollow board may be laminated with a decorative foil, such as a polypropylene foil or polyolefin foil or another suitable foil that provide a desired property such as being hydrophobic. Veneer is another possible option.

(14) “HDF board” as used in the current application means a fiberboard material having a density of at least 800 kg/m.sup.3. According to a preferred embodiment the HDF board has a density of 850-1050 kg/m.sup.3.

(15) In many cases, conventional HDF boards as well as medium-density fiber, MDF, boards have been produced using a urea formaldehyde composition resin.

(16) In the present disclosure a resin comprising an isocyanate component has been found to provide useful properties for a hollow board. It has been found that a HDF board produced with this resin has a lower hygroscopic expansion than has a board produced with a urea formaldehyde composition. This is an important advantage if the product for instance is produced under conditions with low temperatures and low humidity, and is subsequently used under conditions with high temperatures and high humidity. In a case where a significant swelling takes place it is likely for instance that a laminated foil on an edge surface cracks, as such a foil, particularly if made in a plastic material, itself does not expand substantially due to the increased humidity and temperature. Further, in some cases, the swelling may render the board useless, for instance if it does not longer fit together with another component that is not affected in the same way. Still further a HDF board produced with a resin comprising an isocyanate component has also been found to have a higher Modulus of Elasticity at high relative humidity, compared to prior art HDF boards.

(17) More particularly, the isocyanate component may comprise polymethylene polyphenylene isocyanate (also called Isocyanic acid, Polymethylenepolyphenylene ester) and/or methylene diphenyl di-isocyanate, MDI. In case the isocyanate component of the resin comprises methylene diphenyl di-isocyanate then it is preferably the 4,4′ isomer thereof (4,4′-methylene diphenyl di-isocyanate). Working examples involving the above referenced isocyanate components will be described hereinafter.

(18) Details of an example of a structure according to the present disclosure will now be described with reference to FIG. 2 showing a hollow board with one main surface layer partially cut away, and FIGS. 4a-8 showing enlarged details of FIG. 2. FIG. 4a shows enlarged the detail A in FIG. 2.

(19) A plurality of distance elements 14 may be distributed in a space 16 formed between the main surface layers 3, 5. Those distance elements may include, as shown in FIG. 4a, an elongate HDF board strip 15 produced as mentioned above. This strip 15 has a width corresponding to the distance between the main surface layers 3, 5, and is oriented standing on its edge such that its longitudinal edges 17 interconnect the first and second main surface layers 3, 5 such that the space 16 is formed between them. The HDF board strip 15 extends in a plane perpendicular to the planes of the first and second main surface layers, and its longitudinal edges 17 are glued to the main surface layers 3, 5. This may be achieved by e.g. applying a layer of glue to the inner surfaces of the first and second main surface layers 3, 5. A polyurethane based reactive hotmelt glue, such as RAP IDEX® HL 9554 F, available from H.B. Fuller Europe GmbH, Zurich, CH, may be used to this end.

(20) While it would be possible to use a wider HDF board strip that is inclined with respect to the direction perpendicular to the planes of the first and second surface layers, the perpendicular configuration is structurally preferred. By gluing the HDF board strip such that it extends in a plane perpendicular to the planes of main surface layers, a local I-beam is formed where the HDF board strip constitutes the beam web and the main surface layers constitutes the beam flanges. This configuration provides significant bending stiffness about an axis that is parallel to the plane of the main surface layers and perpendicular to the direction in which the HDF board strip extends.

(21) When, as illustrated in FIG. 1, the hollow board has a longitudinal direction 7 of extension, the HDF board strip 15 may run straight and in parallel with this direction 7.

(22) This allows the board to take up a greater load, for instance if used as a bookshelf. It may be preferable to let the HDF board strip extend along the full length of the hollow board, from one short edge 11 to the other, and to glue the ends of the strip to the board making up those short edges. However, this is not necessary to obtain an improved bending stiffness. For instance, an 80% extension of the length of the board may be enough for some applications. A plurality of HDF board strips 15 may be used spaced apart at even distances over the surface.

(23) Another advantage of arranging an HDF board strip 15 in this way is that most of the hygroscopic expansion that may take place, despite the choice of resin, will take place in what was the z-direction of the HDF board 13, as illustrated in FIG. 3, from which the HDF board strip 15 was derived. This is due to the board 13 being pressed in this direction during production. Any hygroscopic expansion of the HDF board strip 15 taking place in what was the orthogonal x- and y-directions of the HDF board 13, see FIG. 3, from which the HDF board strip 15 was derived will most likely be negligible in comparison. This means that the HDF board strip 15 illustrated in FIG. 4a can be allowed to expand almost without affecting the hollow board at all, because any such expansion of the board strip 15, occurring in the z-direction of the original HDF board 13, will occur in an expansion direction ED being parallel to the plane of the surface layers 3, 5, meaning that the expansion will occur in the hollow space available between adjacent distance elements 14. FIG. 4b illustrates this preferred arrangement of the HDF board strip 15, as seen in cross-section, in which the longitudinal edges 17, that are to be glued to the main surface layers 3, 5, are cut edges, with a degree of roughness caused by cutting the board strip 15 from a large board, such as the board 13 illustrated in FIG. 3, while the side faces/edges 18 of the board strip 15 are surfaces formed already in the HDF board forming process, i.e. the side faces/edges 18 originate from the pressed large surfaces 13a, 13b of the board 13 illustrated in FIG. 3, and are as such more smooth than the longitudinal edges 17. The cutting of the strips 15 from the large board 13 could be made by means of a saw, a knife arrangement or any other suitable means.

(24) There may also be provided as distance elements stacks 19 comprising glued HDF board strips 15, which may be glued together using the same glue as is used to attach the single strips 15 to the main surface layers 3, 5. The stack 19 is oriented in between the first and second surface layers such that individual board strips in the stack interconnect the first and second surface layers, i.e. the individual layers in the stack are oriented in the same way as the single strips. Such stacks 19 form laths that provide additional strength where needed. As shown in FIG. 2 this may be useful at side edges of the hollow board and at other locations where the hollow board need be connected to other components as will be discussed.

(25) FIG. 5 shows enlarged the detail B in FIG. 2. A block in the form of a short stack 21 of HDF board strips may as shown be arranged to adjoin an edge 11 of the board. The short stack 21 may as illustrated be glued to another stack 19, and is used to provide basis for a connector element, in the illustrated case a hole 23 for a screw or the like. The short stack 21 is therefore only needed in the vicinity of the location of the connector 23. In an alternative embodiment, a connector 23 is located at an arbitrary position in a main surface layer 3, 5, for example to support a shelf of a book shelf or to support a handle of a door. If so, the short stack is only needed at that location, and does not need to adjoin an edge. Preferably the short stack 21 may have a length L extending less than 20% of the total length of the board in the extension direction of the stack strips, or in any case the short stack 21 extending less than half of the total length of the board. Such a short stack 21 therefore adds only little extra weight and still may provide a useful additional function. In general, the stack 19, 21 width W, as seen perpendicular to the extension direction of the stack strips of the stack 19, 21, may preferably extend less than 20% of the total width of the board to save weight.

(26) As alternative to, or in combination with, a block having the form of a short stack 21 made from glued together HDF board strips, a block may also be made from other materials. For example, a block may be made from plastic or metal, and may be located between the surface layers 3, 5 for the purpose of providing various functionalities, for example as will be described hereinafter.

(27) Connector elements may also be added in the main surface layers. FIG. 6 shows enlarged the detail C in FIG. 2. Here connector elements in the form of drilled holes 25 are provided in the main surface layer 3 at a location where a stack 19 of glued HDF board strips is provided beneath the main surface layer 3. Such holes 25 may for instance be used to fit plugs or screws for connecting the hollow board to another element. Another example is illustrated in FIG. 7 showing enlarged the detail D in FIG. 2. Here a connector element in the form of a groove 27 is provided in the main surface layer 3 at a location where a stack 19 of glued HDF board strips is provided beneath the main surface layer 3. In such a groove 25, a HDF boar may be slid in, for instance.

(28) FIG. 8 shows a cross section through a connection between an HDF board strip 15 and a main surface layer 3. As illustrated, the main surface layer 3 comprises a main surface layer HDF board 29 with a main surface layer foil 31 laminated thereon to present the outer surface 35 of the main surface layer 3. A glue layer 33 is provided on the inner surface 37 of the main surface layer 3, and adheres to the HDF board strip 15, at least to the strip edge 17 thereof. The glue layer 33 is thus applied just before the board strips 15 are assembled with the main surface layer 3.

Example 1

(29) An HDF board was produced in the following manner: Wood based fibers having an average length of about 5-20 mm and an average diameter of about 0.05-0.3 mm were formed by pressing, and refining wood chips and then drying the resulting fibers according to normal HDF production procedures. The wood fibers were mixed with a resin called I-BOND® MDF EM 4330, which is available from Huntsman Holland BV, Botlek-Rotterdam, Netherlands. This resin comprises, as a major active ingredient, Polymethylene polyphenylene isocyanate (CAS: 9016-87-9) (sometimes also referred also to as Isocyanic acid, Polymethylenepolyphenylene ester). The resulting wood fiber mixture comprised about 5.5 wt % moisture, 4.5 wt % resin, excluding any water, and the remaining part, i.e. 90 wt %, was dry wood fibers. This wood fiber mixture was used to form a fiber mat of 12 mm thickness, which was introduced into an HDF board press. The fiber mat was, during a period of about 3 seconds, exposed to a high pressure treatment which involved exposing the fiber mat to a pressure that increased up to 4 N/mm.sup.2 and that was then reduced again. The temperature was about 200° C. during this initial high pressure treatment. After the high pressure treatment the pressure was about 0.4 N/mm.sup.2 and this pressure was maintained for about 5 seconds, combined with a temperature of about 160° C. Then pressure was increased to about 1.5 N/mm2, temperature was maintained at about 160° C., and this final pressing was performed during about 9 seconds. In total the pressing occurred during 3+5+9=17 seconds, and the resulting HDF board had a thickness of about 2 mm, a density of 940 kg/m3 and a moisture content of about 4 wt % after pressing.

Example 2

(30) Wood fibers were prepared in a similar manner as in Example 1. The wood fibers were mixed with a resin called I-BOND® MDF PM 4390 available from Huntsman Holland BV, Botlek-Rotterdam, Netherlands. This resin comprises, as major active ingredients, Polymethylene polyphenylene isocyanate (CAS: 9016-87-9), (sometimes also referred also to as Isocyanic acid, Polymethylenepolyphenylene ester), and 4,4′-Methylenediphenyl diisocyanate (CAS: 101-68-8). The resulting wood fiber mixture comprised about 5.5 wt % moisture, 4.5 wt % resin, excluding any water, and the remaining part, i.e. 90 wt %, dry wood fibers. This wood fiber mixture was used to form a fiber mat of 12 mm thickness, which was introduced into an HDF board press. The fiber mat was pressed following the same sequence as described above for Example 1. The resulting HDF board had a thickness of about 2 mm, a density of 940 kg/m3 and a moisture content of about 4 wt % after pressing.

Comparative Example

(31) The comparative example HDF board was prepared in a similar manner as Examples 1 and 2, with the difference that the resin used was a commercially available Melamine Urea Formaldehyde (MUF). A wood fiber mixture comprised about 8 wt % moisture, 10 wt % resin and the remaining part, i.e. 82 wt %, dry wood fibers. This wood fiber mixture was used to form a fiber mat of 12 mm thickness, which was introduced into an HDF board press in which an HDF board was formed with a thickness of about 2 mm, a density of 940 kg/m3 and a moisture content of about 4 wt % after pressing.

(32) Results:

(33) The HDF boards produced according to the above techniques were exposed to different degrees of humidity and were then tested for modulus of elasticity (MoE) according to EN310. Table 1 below presents the test results. The column to the right in table 1 presents for each example the Modulus of Elasticity at 90% relative humidity divided by the Modulus of Elasticity at 60% relative humidity. The closer to 1 that this value is the less is the board affected by humidity:

(34) TABLE-US-00001 TABLE 1 Modulus of Elasticity (MoE), (N/mm.sup.2), at different relative Humidity Relative Humidity MoE at 90%/ 60% 70% 80% 90% MoE at 60% Example 1 5700 5200 4700 3200 0.56 Example 2 4800 4500 4000 3200 0.67 Comparative 5200 4300 2900 2200 0.42 Example

(35) As can be seen from table 1 the HDF board of the Comparative Example is heavily affected at high relative humidity. The HDF-boards of Examples 1 and 2 on the other hand resists humidity much better and at 90% relative humidity still have substantially more than 50% of their Modulus of Elasticity at 60% relative humidity.

(36) The present disclosure is not restricted to the above examples, and may be varied and altered in different ways within the scope of the appended claims. For example, it has been described hereinabove that all distance elements 14, 19 are made from HDF boards comprising wood particles bonded by a resin including an isocyanate component. While this is a preferred embodiment, it is in some applications possible to use some distance elements made from another material. For example, some of the distance elements could be made of MDF, having a lower density than HDF. MDF would have a density of less than 800 kg/m.sup.3, more typically a density of 600-780 kg/m3. In such an embodiment at least the distance elements located close to the edges of the hollow board are preferably made from HDF, while the central distance elements may be made from MDF, or another material, since the hollow board is somewhat less sensitive to humidity induced swelling at its central portions.