LINER-LESS CONTACT METALLIZATION

Abstract

A low resistance middle-of-line interconnect structure is formed without liner layers. A contact metal layer is deposited on source/drain regions of field-effect transistors and directly on the surfaces of trenches within a dielectric layer using plasma enhancement. Contact metal fill is subsequently provided by thermal chemical vapor deposition. The use of low-resistivity metal contact materials such as ruthenium is facilitated by the process. The process further facilitates the formation of metal silicide regions on the source/drain regions.

Claims

1. A fabrication method comprising: obtaining a structure including a plurality of field-effect transistors, each field-effect transistor including source/drain regions, a dielectric layer covering the plurality of field-effect transistors, and trenches extending within the dielectric layer to the source/drain regions; forming titanium-based silicide regions on the source/drain regions; depositing a continuous contact metal surface layer directly on the silicide regions and the dielectric layer within the trenches using a plasma-enhanced deposition process at 250-350° C. and 1.5 Torr, in a first step at a flow rate of 50-200 sccm to produce a first sub-layer with relatively high film resistivity and in a second step at a flow rate of 20-100 sccm that is less than the flow rate of the first step to produce a second sub-layer with relatively low film resistivity; and subsequent to depositing the continuous contact metal surface layer, filling the trenches with a contact metal fill layer using thermal chemical vapor deposition.

2. The method of claim 1, wherein the plasma-enhanced deposition process includes plasma-enhanced chemical vapor deposition.

3.-6. (canceled)

7. The method of claim 1, wherein forming the titanium-based silicide regions further includes depositing one or more titanium-based materials on the structure such that a titanium-based layer is formed on the source/drain regions and on surfaces of the dielectric layer within the trenches, annealing the structure to form the silicide regions, and selectively removing the titanium-based materials from the structure to expose the surfaces of the dielectric layer within the trenches.

8. The method of claim 7, wherein the continuous contact metal surface layer consists essentially of ruthenium.

9. The method of claim 7, wherein the source/drain regions comprise doped semiconductor regions.

10. The method of claim 9, wherein forming the titanium-based silicide regions further includes depositing titanium and titanium nitride layers sequentially on the structure.

11. The method of claim 1, wherein the continuous contact metal surface layer has a thickness between 0.5 and 2 nanometers.

12. The method of claim 1, wherein using thermal chemical vapor deposition further includes subjecting the structure to a process temperature in the range of 250-350° C.

13. The method of claim 1, wherein the contact metal fill layer is selected from the group consisting of ruthenium, molybdenum, osmium, iridium and rhodium.

14.-20. (canceled)

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The following drawings are presented by way of example only and without limitation, wherein like reference numerals (when used) indicate corresponding elements throughout the several views, and wherein:

[0021] FIG. 1 is a schematic, cross-sectional view of a semiconductor structure including nFET and pFET regions following patterning of a dielectric layer on the structure and deposition of titanium and titanium nitride layers;

[0022] FIG. 2 is a schematic, cross-sectional view thereof following silicidation and removal of unreacted titanium and titanium nitride, and

[0023] FIG. 3 is a schematic, cross-sectional view thereof following contact metallization.

[0024] It is to be appreciated that elements in the figures are illustrated for simplicity and clarity. Common but well-understood elements that may be useful or necessary in a commercially feasible embodiment may not be shown in order to facilitate a less hindered view of the illustrated embodiments.

DETAILED DESCRIPTION

[0025] Principles of the present disclosure will be described herein in the context of illustrative embodiments. It is to be appreciated, however, that the specific embodiments and/or methods illustratively shown and described herein are to be considered exemplary as opposed to limiting. Moreover, it will become apparent to those skilled in the art given the teachings herein that numerous modifications can be made to the embodiments shown that are within the scope of the claims. That is, no limitations with respect to the embodiments shown and described herein are intended or should be inferred.

[0026] FIG. 1 schematically depicts a semiconductor structure 20 including nFET and pFET regions. The nFET region includes nFETs 22A and the pFET region includes pFETs 22B. The nFETs 22A include n-type source/drain regions 24A, for example phosphorus-doped silicon regions. In embodiments wherein the nFETs and pFETs are FinFETs, expanded source/drain regions can be grown epitaxially on the exposed portions of semiconductor fins. Doped silicon or silicon germanium grown epitaxially on the sidewalls (110 surfaces) of silicon fins increases the volumes of the source/drain regions. Either p-type devices or n-type devices can be fabricated depending on the conductivity types of the epitaxial source/drain regions, as known in the art. As used herein, the term “conductivity type” denotes a dopant region being p-type or n-type. As used herein, “p-type” refers to the addition of impurities to an intrinsic semiconductor that creates deficiencies of valence electrons. In a silicon-containing substrate, examples of p-type dopants, i.e., impurities include but are not limited to: boron, aluminium, gallium and indium. As used herein, “n-type” refers to the addition of impurities that contributes free electrons to an intrinsic semiconductor. Examples of n-type dopants, i.e., impurities in a silicon-containing substrate include but are not limited to antimony, arsenic and phosphorus. In embodiments where n-type FinFET devices are to be formed, in-situ n-doped silicon may be used to form the epitaxial source/drain regions. In-situ doping of the source/drain regions can be conducted using conventional precursor materials and techniques. Source/drain regions 24A consisting essentially of phosphorus-doped silicon is employed in an exemplary embodiment. Source/drain epitaxy to form p-doped source/drain regions may include the introduction of boron precursor gas such as diborane. The p-doped source/drain structures may consist essentially of boron-doped silicon germanium in one or more exemplary embodiments. In one exemplary embodiment where the doped source/drain semiconductor material is silicon germanium (SiGe) containing about thirty-five percent (35%) germanium, the dopant is boron in a concentration in the range of 4-9×10.sup.20 cm.sup.−3 and the resulting FinFET structure is p-type. Exemplary epitaxial growth processes that are suitable for use in forming silicon and/or silicon germanium epitaxy include rapid thermal chemical vapor deposition (RTCVD), low-energy plasma deposition (LEPD), ultra-high vacuum chemical vapor deposition (UHVCVD), atmospheric pressure chemical vapor deposition (APCVD) and molecular beam epitaxy (MBE). The temperature for epitaxial deposition processes typically ranges from 550° C. to 900° C. Fin sidewall surfaces are (110) surfaces in one or more embodiments such that epitaxial growth thereon produces in diamond-shaped structures due to the fact that the growth rate on (111) planes is considerably less than on (110) planes. Self-limiting diamond-shaped structures can accordingly be formed. Growth may be limited in some exemplary embodiments to avoid merging of the faceted source/drain regions. It will be appreciated that doped source/drain regions can be formed using other known methods including but not limited to implantation and diffusion doping techniques. It will further be appreciated that many of the principles discussed herein can be applied to various types of field-effect transistors, including planar devices.

[0027] In addition to source/drain regions, the field-effect transistors 22A, 22B include gate regions 26, spacers 28 adjoining the gate regions, and channel regions operatively associated with the gate regions and source/drain regions. In embodiments including FinFETs, the channel regions include portions of fins within the gate regions. The gate regions include gate dielectric and gate conductor portions which may or may not be the same in the nFET and pFET regions of the structure 20. The gate dielectric layer can be a high dielectric constant (high-k) material layer having a dielectric constant greater than 3.9. Gate dielectric layers can include a dielectric metal oxide in some embodiments, which is a high-k material containing a metal and oxygen. Dielectric metal oxides can be deposited by methods well known in the art including, for example, chemical vapor deposition (CVD), physical vapor deposition (PVD), molecular beam deposition (MBD), pulsed laser deposition (PLD), liquid source misted chemical deposition (LSMCD), and atomic layer deposition. The material(s) for forming the gate conductors can include electrically conductive material(s) deposited by physical vapor deposition, chemical vapor deposition, and/or electroplating. A metal gate layer such as an aluminum layer, a tungsten layer, an aluminum alloy layer, or a tungsten alloy layer is formed in some embodiments. Tungsten, for example, can be deposited by chemical vapor deposition. Replacement gate fabrication techniques are employed in some embodiments to obtain the gate regions 26.

[0028] Silicon nitride (Si.sub.3N.sub.4) layer can be deposited via CVD, PECVD, sputtering, or other suitable technique to form the spacers 28. The spacers can include a single layer or be multi-layer. Spacer thickness is between two and ten nanometers (2-10 nm) in some embodiments. Spacers can be formed by any method known in the art, including depositing a conformal nitride layer over dummy gate structures (not shown) and removing unwanted material using an anisotropic etching process such as reactive ion etching or plasma etching. The dummy gates and associated spacers protect the underlying portions of the semiconductor fins that later function as channel regions of FinFET devices in embodiments where FinFETs comprise the field-effect transistors within the structure 20.

[0029] An electrically insulating layer 30, for example silicon dioxide, can be formed on the structure 20 using CVD or other known techniques. Other low-k dielectrics can alternatively be employed to form the layer 30, for example SiOCH. The electrically insulating layer 30 may be planarized using chemical mechanical planarization (CMP), as known in the art. The layer 30 is patterned using a photoresist layer (not shown) and etched to form trenches 32. The trenches extend to the source/drain regions 24A, 24B. A titanium layer is conformally deposited on the structure, lining the surfaces of the dielectric layer and the exposed portions of the source/drain regions. The thickness of the titanium layer is between 30-80 Å in some embodiments. Radio-frequency enhanced physical vapor deposition (RF PVD) is a known technique for depositing thin metal films in vias and contact holes, and may be employed for depositing the titanium layer. A titanium nitride (TiN) layer is deposited on the titanium layer using, for example, atomic layer deposition. The TiN layer protects the titanium layer from oxidation. The deposited titanium and titanium nitride layers are collectively designated by numeral 34 in FIG. 1.

[0030] Unreacted titanium/titanium nitride is selectively removed from the structure following post-silicidation anneal to form titanium disilicide (TiSi.sub.2), leaving the dielectric surfaces of the trenches 32 exposed and titanium-based (TiSi.sub.2) silicide regions 36A, 36B on the source/drain regions 24A, 24B. The selective removal of titanium-based materials from surfaces other than the silicide regions 36A, 36B may be conducted by a wet process using, for example, sulfuric peroxide mixture (SPM), which combines the use of sulfuric acid and hydrogen peroxide. The source/drain regions within the nFET region includes TiSi.sub.2 regions 36A while Ti(SiGe).sub.2 regions 36B are formed on the source/drain regions 24B in the pFET region. The exemplary structure 40 shown in FIG. 2 is accordingly obtained.

[0031] FIG. 3 shows a completed structure 50 including contacts 42 formed within the trenches and electrically communicating with the silicide regions formed on the source/drain regions. Self-aligned contacts facilitate alignment during fabrication of integrated circuit devices having small dimensions. The contacts 42 are formed using at least two deposition stages. The first stage includes a plasma-enhanced deposition process such as plasma-enhanced chemical vapor deposition (PECVD) or plasma-enhanced atomic layer deposition (PEALD). During the first stage, a continuous layer of contact metal such as ruthenium is formed directly on the silicide regions as well as directly on the surfaces of the dielectric layer bounding the trenches 32. In a first exemplary embodiment, a ruthenium layer is deposited using PECVD at a processing temperature in the range of 250-350° C. at 1.5 Torr with 400-600 W plasma power until a layer between 0.5-2.0 nm is formed. The thickness of the layer should be sufficient to ensure the absence of discontinuities in the layer formed on the dielectric surfaces during the first deposition stage. Following completion of the first stage, which in some embodiments includes multiple plasma-enhanced deposition steps, the second stage includes the thermal chemical vapor deposition (CVD) of contact metal. In the first exemplary embodiment, ruthenium is deposited for 25-275 seconds at 1.5 Torr and at a process temperature of 250-350° C. The PECVD process provides good nucleation while thermal CVD provides improved contact metal coverage on the trench sidewalls as compared to PECVD. Ruthenium metallization, for example, reduces interconnect resistance as compared to liner/barrier/nucleation films conventionally used in MOL metallization. The use of a non-halide precursor molecule, for example a metal-organic precursor as known in the art, eliminates the need for a halide-diffusion barrier. Being a high temperature refractory metal, there are no concerns relating to electromigration when employing ruthenium during both stages of the MOL metallization as described herein. Bulk resistivity of ruthenium is about 7.1 μOhm-cm.

[0032] As discussed above, the first stage of contact metal deposition includes more than one plasma-enhanced deposition process in some embodiments to produce a multi-layer structure. Contact metal, for example ruthenium, is first deposited at a relatively high flow rate to form a first sub-layer and then at a lower flow rate to form a second sub-layer. Using process conditions described above with respect to PECVD contact metal deposition, the relatively high flow rate can be in the range of 50-200 sccm while the relatively low flow rate is in the range of 20-100 sccm. The deposition of such a bi-layer during the first stage allows use of a PECVD process that provides good nucleation but relatively high film resistivity followed by a PECVD process that provides a relatively low-resistivity film. In some embodiments, both sub-layers are the same material, for example ruthenium or other relatively low-resistivity metal. In other embodiments, the sub-layers are formed from different materials, for example sequential layers of ruthenium, molybdenum, iridium, rhodium, osmium and/or their alloys.

[0033] FIGS. 1-3, as discussed above, depict exemplary processing steps/stages in the fabrication an exemplary structure. Although the overall fabrication method and the structure formed thereby are entirely novel, certain individual processing steps required to implement the method may utilize conventional semiconductor fabrication techniques and conventional semiconductor fabrication tooling. These techniques and tooling will already be familiar to one having ordinary skill in the relevant arts given the teachings herein. Moreover, one or more of the processing steps and tooling used to fabricate semiconductor devices are also described in a number of readily available publications, including, for example James D. Plummer et al., Silicon VLSI Technology: Fundamentals, Practice, and Modeling 1.sup.st Edition, Prentice Hall, 2001, which is hereby incorporated by reference herein. It is emphasized that while some individual processing steps are set forth herein, those steps are merely illustrative, and one skilled in the art may be familiar with several equally suitable alternatives that would be applicable.

[0034] It is to be appreciated that the various layers and/or regions shown in the accompanying figures may not be drawn to scale. Furthermore, one or more semiconductor layers of a type commonly used in such integrated circuit devices or other layers may not be explicitly shown in a given figure for ease of explanation. This does not imply that the semiconductor layer(s) or other layer(s) not explicitly shown are omitted in the actual integrated circuit device.

[0035] Given the discussion thus far, it will be appreciated that, in general terms, an exemplary fabrication method includes obtaining a structure 20 including a plurality of field-effect transistors 22A, 22B, each field-effect transistor including source/drain regions 24A, 24B, a dielectric layer 30 covering the plurality of field-effect transistors, and trenches 32 extending within the dielectric layer to the source/drain regions. Titanium-based silicide regions 36A, 36B are formed on the source/drain regions. A continuous contact metal layer is deposited directly on the silicide regions 36A, 36B and the dielectric layer 30 within the trenches 32 using a plasma-enhanced deposition process. Subsequent to depositing the contact metal surface layer, the trenches are filled with a contact metal fill layer using thermal chemical vapor deposition. The combined contact metal surface and fill layers formed in such a manner ensure adequate adhesion to the dielectric layer in the absence of relatively high resistivity liners while reducing interconnect resistance. In some embodiments, depositing the continuous contact metal surface layer further includes sequentially using first and second flow rates during the plasma-enhanced deposition (for example PECVD) process to form first and second sub-layers of the continuous contact metal surface layer such that the second sub-layer has lower resistivity than the first sub-layer. The first and second sub-layers may or may not comprise the same metal. Forming the titanium-based silicide regions may further include depositing one or more titanium-based materials on the structure such that a titanium-based layer 34 is formed on the source/drain regions and on surfaces of the dielectric layer within the trenches 32, annealing the structure to form the silicide regions 24A, 24B, and selectively removing the titanium-based materials from the structure to expose the surfaces of the dielectric layer 30 within the trenches, such as shown in FIG. 2.

[0036] A semiconductor structure 50 is further provided that includes a plurality of field-effect transistors 22A, 22B, each field-effect transistor including source/drain regions 24A, 24B, a dielectric layer 30 covering the plurality of field-effect transistors, and trenches 32 extending within the dielectric layer to the source/drain regions. The source/drain regions include titanium-based silicide regions 36A, 36B. A continuous contact metal surface layer directly contacts the silicide regions and the dielectric layer within the trenches 32. A contact metal fill layer is in direct contact with the contact metal surface layer. PECVD layers typically exhibit higher resistivity than metal layers deposited using thermal CVD, so the continuous contact metal surface layer will have higher resistivity than the contact metal fill layer of the contacts 42 in at least some exemplary embodiments. The contact metal surface and fill layers fill the trenches 32. The contact metal surface layer adheres to the dielectric layer in the absence of a liner. In some embodiments, both the continuous contact metal surface layer and the contact metal fill layer comprise the same material, for example ruthenium. Both layers comprising each contact 42 may consist essentially of ruthenium. In embodiments wherein the continuous contact metal surface layer includes sub-layers, each sub-layer comprises the same metal or metal alloy in some embodiments. In other embodiments, different metals comprise one or more sub-layers of the continuous contact metal surface layer. In a bi-layer structure, the later-deposited sub-layer of the continuous contact metal surface layer has lower resistivity than the underlying sub-layer.

[0037] At least a portion of the techniques described above may be implemented in an integrated circuit. In forming integrated circuits, identical dies are typically fabricated in a repeated pattern on a surface of a semiconductor wafer. Each die includes a device described herein, and may include other structures and/or circuits. The individual dies are cut or diced from the wafer, then packaged as an integrated circuit. One skilled in the art would know how to dice wafers and package die to produce integrated circuits.

[0038] Those skilled in the art will appreciate that the exemplary structures discussed above can be distributed in raw form (i.e., a single wafer having multiple unpackaged chips), as bare dies, in packaged form, or incorporated as parts of intermediate products or end products that benefit from having FET devices and contacts formed in accordance with one or more of the exemplary embodiments.

[0039] The illustrations of embodiments described herein are intended to provide a general understanding of the various embodiments, and they are not intended to serve as a complete description of all the elements and features of apparatus and systems that might make use of the circuits and techniques described herein. Many other embodiments will become apparent to those skilled in the art given the teachings herein; other embodiments are utilized and derived therefrom, such that structural and logical substitutions and changes can be made without departing from the scope of this disclosure. It should also be noted that, in some alternative implementations, some of the steps of the exemplary methods may occur out of the order noted in the figures. For example, two steps shown in succession may, in fact, be executed substantially concurrently, or certain steps may sometimes be executed in the reverse order, depending upon the functionality involved. The drawings are also merely representational and are not drawn to scale. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense.

[0040] Embodiments are referred to herein, individually and/or collectively, by the term “embodiment” merely for convenience and without intending to limit the scope of this application to any single embodiment or inventive concept if more than one is, in fact, shown. Thus, although specific embodiments have been illustrated and described herein, it should be understood that an arrangement achieving the same purpose can be substituted for the specific embodiment(s) shown; that is, this disclosure is intended to cover any and all adaptations or variations of various embodiments. Combinations of the above embodiments, and other embodiments not specifically described herein, will become apparent to those of skill in the art given the teachings herein.

[0041] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. Terms such as “above” and “below” are used to indicate relative positioning of elements or structures to each other as opposed to relative elevation.

[0042] The corresponding structures, materials, acts, and equivalents of any means or step-plus-function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the various embodiments has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the forms disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit thereof. The embodiments were chosen and described in order to best explain principles and practical applications, and to enable others of ordinary skill in the art to understand the various embodiments with various modifications as are suited to the particular use contemplated.

[0043] The abstract is provided to comply with 37 CFR. §1.72(b), which requires an abstract that will allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, in the foregoing Detailed Description, it can be seen that various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments require more features than are expressly recited in each claim. Rather; as the appended claims reflect, the claimed subject matter may lie in less than all features of a single embodiment. Thus the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as separately claimed subject matter.

[0044] Given the teachings provided herein, one of ordinary skill in the art will be able to contemplate other implementations and applications of the techniques and disclosed embodiments. Although illustrative embodiments have been described herein with reference to the accompanying drawings, it is to be understood that illustrative embodiments are not limited to those precise embodiments, and that various other changes and modifications are made therein by one skilled in the art without departing from the scope of the appended claims.