HIGH-THRESHOLD-VOLTAGE NORMALLY-OFF HIGH-ELECTRON-MOBILITY TRANSISTOR AND PREPARATION METHOD THEREFOR

Abstract

A high-threshold-voltage normally-off high-electron-mobility transistor (HEMT) includes a nucleation layer and an epitaxial layer are grown sequentially on a substrate; a barrier layer, a source, and a drain above the epitaxial layer; the barrier layer and the epitaxial layer form a heterojunction structure, and the contact interface therebetween is induced by polarization charges to generate two-dimensional electron gas. The HEMT includes a passivation layer above the barrier layer; a gate cap layer above the gate region barrier layer; the upper part of the gate cap layer is subjected to surface plasma oxidation to form an oxide dielectric layer, or a single-layer or multiple gate dielectric insertion layer is directly deposited thereon. The HEMT includes a gate is located above the gate dielectric insertion layer; the gate is in contact with the passivation layer; and a field plate extends from the gate to the drain on the passivation layer.

Claims

1. A high-threshold-voltage normally-off high-electron-mobility transistor, comprising: a substrate, a nucleation layer, an epitaxial layer, a barrier layer, a passivation layer, a gate cap layer, a composite gate dielectric insertion layer, a gate, a source, and a drain; wherein the nucleation layer and the epitaxial layer are sequentially grown on the substrate; the barrier layer, the source, and the drain are located above the epitaxial layer; the barrier layer and the epitaxial layer form a heterojunction structure, and the contact interface therebetween is induced by polarization charges to generate two-dimensional electron gas; the passivation layer is located above the barrier layer; the gate cap layer is located above the gate region barrier layer; the composite gate dielectric insertion layer is located above the gate cap layer; the gate is located above the composite gate dielectric insertion layer; the gate is in contact with the passivation layer; and a field plate extends from the gate to the drain on the passivation layer.

2. The high-threshold-voltage normally-off high-electron-mobility transistor according to claim 1, wherein the substrate is any one of silicon, sapphire, silicon carbide, diamond, and a GaN free-standing substrate; the nucleation layer is an AlN or AlGaN superlattice; the epitaxial layer is GaN or GaAs; the barrier layer is any one of AlGaN, InAIN, AlN, and AlGaAs; and the passivation layer is SiO.sub.2, Si.sub.3N.sub.4, or a composite structure of the two.

3. The high-threshold-voltage normally-off high-electron-mobility transistor according to claim 1, wherein the gate cap layer is p-GaN or p-InGaN or p-AlGaN; and the composite gate dielectric insertion layer is a single-layer structure formed of any material of gallium oxide, silicon dioxide, silicon nitride, aluminum oxide, and hafnium oxide, or a composite multiple structure composed of any combination of the materials, or a high-resistance semiconductor.

4. The high-threshold-voltage normally-off high-electron-mobility transistor according to claim 1, wherein the composite gate dielectric insertion layer is inserted under the gate cap layer.

5. A method of preparing a high-threshold-voltage normally-off high-electron-mobility transistor, comprising following steps: S1: wafer growth; S2: etching of an epitaxial layer structure; S3: preparing of a source and a drain; S4: preparing of a gate dielectric insertion layer; and S5: preparing of a gate.

6. The method of preparing the high-threshold-voltage normally-off high-electron-mobility transistor according to claim 5, wherein step S1 is specifically as follows: using Metal Organic Chemical Vapor Deposition (MOCVD) or molecular beam epitaxy method to sequentially grow a nucleation layer, an epitaxial layer, a barrier layer, and a gate cap layer on a substrate; or, using an MOCVD device to sequentially form a nucleation layer, an epitaxial layer, a barrier layer, and a gate cap layer on a substrate.

7. The method of preparing the high-threshold-voltage normally-off high-electron-mobility transistor according to claim 5, wherein step S2 is specifically as follows: using a semiconductor photolithography and etching method to prepare a device mesa, and etching a surface through a semiconductor etching method to achieve mesa isolation; repeating the step to etch away a barrier layer in source and drain regions to form a groove; and further, etching away a gate cap layer outside a gate region; or, spin-coating a photoresist uniformly onto a sample; placing the sample onto a hot plate for heating and soft drying; placing the sample in an exposure machine for continuous exposure; developing the sample in a developing solution; heating a hard film on the hot plate; etching the epitaxial layer structure through a Cl-based plasma ICP etching method to form mesa isolation, and then cleaning the sample and removing the photoresist with an acetone solution; repeating the step to etch away a barrier layer in source and drain regions to form a groove; and repeating the step to etch away a cap layer outside a gate region to form a gate cap layer.

8. The method of preparing the high-threshold-voltage normally-off high-electron-mobility transistor according to claim 5, wherein step S3 is specifically as follows: defining a region required by the source and the drain through semiconductor photolithography, and depositing source and drain metal of the device through metal deposition method, and transforming a composite metal structure into an alloy to form an ohmic contact through high-temperature annealing; and using any one of Plasma-Enhanced Chemical Vapor Deposition (PECVD) method, Low-Pressure Chemical Vapor Deposition (LPCVD) method, magnetron sputtering method, and electron beam evaporation method to deposit to form a passivation layer on the surface of the device; or, defining a region required by the source and the drain through semiconductor photolithography, depositing source and drain metals of the device through electron beam evaporation method, and then peeling and cleaning the sample and removing the photoresist in an acetone solution; and transforming a composite metal structure into an alloy to form an ohmic contact through annealing in a nitrogen high temperature environment; and using a PECVD technology deposition method to deposit to form a passivation layer on the surface of the device.

9. The method of preparing the high-threshold-voltage normally-off high-electron-mobility transistor according to claim 5, wherein step S4 is specifically as follows: defining a gate region through semiconductor lithography, and performing surface oxidation on a gate cap layer to form a gate dielectric insertion layer; or, using any one of PECVD, LPCVD, MOCVD, ALD, and magnetron sputtering method to deposit to form a single-layer or composite multiple gate dielectric insertion layer; or, defining a gate region through semiconductor lithography, performing low-power oxygen ion pretreatment on the surface of a gate cap layer, and then using LPCVD to deposit to form a gate dielectric insertion layer.

10. The method of preparing the high-threshold-voltage normally-off high-electron-mobility transistor according to claim 5, wherein step S5 is specifically as follows: defining the gate and the field plate region through semiconductor lithography, depositing a gate metal and a field plate metal extending towards the drain of the device through metal deposition method, and finally depositing a passivation layer on the surface of the device; and then using semiconductor photolithography to define open regions required by the source, the gate, and the drain, removing the passivation layer of the defined region to expose the metal electrode surface, and finally depositing a metal film to make leads, so that the electrode is completed, and the final device structure is obtained; or, defining the gate and the field plate region through semiconductor lithography, depositing a gate and extending field plate metal of the device through electron beam evaporation method, and then peeling and cleaning the sample and removing a photoresist in an acetone solution; and depositing a passivation layer on the surface of the device through PECVD, using semiconductor photolithography to define open regions required by the source, the gate, and the drain, removing the passivation layer of the defined region to expose the metal electrode surface, and depositing an electrode metal through magnetron sputtering to obtain the final device structure.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0039] FIG. 1 is a schematic cross-sectional view of a high-threshold-voltage normally-off High Electron Mobility Transistor (HEMT) device according to the present invention.

[0040] FIG. 2 is an example diagram a of preparation process flow of the device according to the present invention.

[0041] FIG. 3 is an example diagram b of preparation process flow of the device according to the present invention.

[0042] FIG. 4 is an example diagram c of preparation process flow of the device according to the present invention.

[0043] FIG. 5 is an example diagram d of preparation process flow of the device according to the present invention.

[0044] FIG. 6 is an example diagram e of preparation process flow of the device according to the present invention.

[0045] FIG. 7 is an example diagram f of preparation process flow of the device according to the present invention.

[0046] FIG. 8 is a schematic diagram of energy band comparison of devices in technical solutions with and without a composite gate dielectric insertion layer.

[0047] FIG. 9 is a schematic diagram of threshold voltage characteristics comparison of devices in technical solutions with and without a composite gate dielectric insertion layer.

DETAILED DESCRIPTION

[0048] A high-threshold-voltage normally-off high-electron-mobility transistor and a preparation method therefor are further described below with reference to FIG. 1 to FIG. 9.

[0049] According to the present patent application, for the solution of growing p-type cap layer on a gate, a p-GaN (or p-InGaN or p-AlGaN) gate cap layer is subjected to surface oxidation to form a gate oxide dielectric layer, or a gate dielectric insertion layer is directly deposited or a multiple gate dielectric insertion layer is formed. As shown in FIG. 1, the gate withstand voltage and the threshold voltage of the normally-off device are improved by increasing the conduction band position of the barrier layer. The gate p-type cap layer is a technical solution that can currently better realize normally-off devices in the industry. This technology does not damage the 2DEG channel, so the on-current density (or on-resistance) characteristic of the device is not decreased. Moreover, the additional built-in electric field formed on the p-GaN (or p-InGaN or p-AlGaN) gate cap layer raises the conduction band of the 2DEG channel interface above the Fermi level, so as to realize a normally-off operation. However, the threshold voltage is generally only about 1V, and the maximum withstand voltage of the gate is generally less than 10V. In the present patent application, after a single-layer or composite multiple gate dielectric insertion layer is introduced above the gate cap layer, the conduction band position at the interface of the barrier layer and the 2DEG channel is further elevated, and significantly increased gate withstand voltage (>20V) and threshold voltage (>2V) are obtained.

[0050] FIG. 1 is a schematic cross-sectional view of an HEMT device provided according to the present patent application, which is mainly characterized in that a gate dielectric insertion layer is introduced between the gate metal electrode and the p-type cap layer.

[0051] The basic structure of the device provided according to the present patent application is described as follows: a substrate is located at the bottom, and may be silicon, sapphire, silicon carbide, diamond or a GaN self-supporting substrate, etc.; an AN or AlGaN superlattice nucleation layer is located above the substrate; a GaN or GaAs epitaxial layer is located above the nucleation layer; an AlGaN, InAIN, AN or AlGaAs barrier layer is located above the epitaxial layer; the barrier layer and the epitaxial layer form a heterojunction structure, and the interface is induced by polarized charges to generate two-dimensional electron gas (2DEG); silicon dioxide (SiO2), silicon nitride (Si3N4) or a composite structure thereof is located above the barrier layer to form a passivation layer; a p-GaN or p-InGaN or p-AlGaN cap layer and a single-layer or composite multiple gate dielectric insertion layer formed of various materials such as gallium oxide (Ga.sub.2O.sub.3), SiO.sub.2, Si.sub.3N.sub.4, aluminum oxide (A1.sub.2O.sub.3) or hafnium oxide (HfO.sub.2) are located above the gate region barrier layer; a source and a drain are in contact with the epitaxial layer; a gate and a field plate extending towards the drain are located above the gate dielectric insertion layer.

[0052] The advantage of the device structure provided according to the present patent application is realizing the normally-off device type while maintaining a large on-current density. On this basis, the gate withstand voltage and the threshold voltage of the device can be further improved.

Embodiment 1

[0053] The specific implementation process of the present patent application is as follows:

[0054] step 1: wafer growth.

[0055] Semiconductor material growth techniques such as Metal Organic Chemical Vapor Deposition (MOCVD) or Molecular Beam Epitaxy (MBE) are used to sequentially grow an AlN or AlGaN superlattice nucleation layer, a 2˜10 μm GaN or GaAs epitaxial layer, a 5˜100 nm AlGaN, InAIN, AlN or AlGaAs barrier layer (wherein Al is 0.05˜0.3), and a 30˜100 nm p-GaN or p-InGaN or p-AlGaNgate cap layer on silicon, sapphire, silicon carbide, diamond or a GaN free-standing substrate, as shown in FIG. 2 and FIG. 3.

[0056] Step 2: the epitaxial layer structure etching.

[0057] Semiconductor photolithography and etching technology are used to prepare a device mesa. The surface is etched by 300˜800 nm through the semiconductor etching techniques such as Cl-based gas Inductively Coupled Plasma (ICP) or Reactive Ion Etching (RIE) to achieve mesa isolation. The step is repeated to etch away the barrier layer in the source and the drain regions to form a groove. The p-type cap layer outside the gate region is further etched away, as shown in FIG.4. The semiconductor photolithography technology includes complete steps such as homogenization, soft baking, exposure, development, and film hardening.

[0058] Step 3: preparation of the source and the drain.

[0059] Regions required by the source and drain are defined through the semiconductor lithography technology described in step 2. Source and drain metals are deposited through metal deposition techniques such as magnetron sputtering and electron beam evaporation. The composite metal structure is transformed into an alloy to form an ohmic contact through high-temperature annealing. SiO.sub.2, Si.sub.3N.sub.4 or a composite structure thereof are deposited through plasma enhanced chemical vapor deposition (PECVD), low pressure chemical vapor deposition (LPCVD), magnetron sputtering or electron beam evaporation to form a device surface passivation layer, as shown in FIG. 5.

[0060] Step 4: preparation of the gate dielectric insertion layer.

[0061] The gate region is defined through the semiconductor lithography technology described in step 2. The p-GaN (or p-InGaN or p-AlGaN) gate cap layer is subjected to surface oxidation to form a Ga.sub.2O.sub.3 dielectric layer. A single layer or composite multi-media insertion layer such as SiO.sub.2, Si.sub.3N.sub.4, alumina (A1.sub.2O.sub.3) or hafnium oxide (HfO.sub.2) is directly deposited through PECVD, LPCVD, MOCVD, ALD or magnetron sputtering, as shown in FIG. 6.

[0062] Step 5: preparation of the gate.

[0063] The gate and field plate regions are defined through the semiconductor lithography technology described in step 2. The gate metal and the field plate metal extending towards the drain of the device are deposited through the metal deposition technique described in step 3, as shown in FIG. 7. Finally, a passivation layer having a thickness of 300˜5000 nm is deposited on the device surface. Then, open regions required by the source, the gate, and the drain are defined through the semiconductor lithography technology described in step 2. The passivation layer of the defined region is removed to expose the metal electrode surface. Finally, the metal film is deposited to make leads, so that the electrode is completed, and the final device structure is obtained.

Embodiment 2

[0064] The specific implementation process of the present patent application is as follows (detailed parameters and steps):

[0065] Step 1: GaN structure epitaxial growth.

[0066] A 100 nm AlGaN super lattice nucleation layer, a 2 μm GaN epitaxial layer, a 20 nm AlGaN barrier layer (the Al component is 0.25), and a 50 nm p-GaN cap layer are sequentially grown on a 6-inch p-type Si substrate by using an MOCVD device. The structure and size of the device are designed as follows: the distance between the source and the gate of the device is 2 μm; the length and width of the gate are 3 μm and 200 μm; the length of the field plate extending from the gate to the drain is 1 μm; the distance between the gate and the drain is 10 μm; and each electrode area is 200×200 μm.sup.2.

[0067] Step 2: epitaxial layer structure etching.

[0068] Semiconductor photolithography technology is used, and the specific process is as follows:

[0069] (1) an AZ5214 photoresist is spin coated uniformly onto a sample at a rate of 4000 r/min for 30 s;

[0070] (2) the sample is placed onto a hot plate at 100° C. for heating and soft drying for 90 s;

[0071] (3) the sample is placed in an exposure machine with a light intensity of 7 mW/cm.sup.2 for continuous exposure for 20 s;

[0072] (4) the sample is developed for 45 s in a developing solution; and

[0073] (5) a hard film is heated on the hot plate at 105° C. for 60 s.

[0074] The epitaxial layer structure with a depth of 500 nm is etched through the Cl-based plasma ICP etching technology under a 150 W power supply power to form mesa isolation. Then, the sample is cleaned and the photoresist is removed with an acetone solution. This step is repeated, and a lower power supply power of 30 W is selected to etch away the 20 nm barrier layer in the source and drain regions to form a groove. This step is repeated, and a lower power supply power of 30 W is selected to etch away the p-GaN outside the gate region, thus forming a gate cap layer.

[0075] Step 3: preparation of the source and the drain.

[0076] Regions required by the source and the drain are defined through the semiconductor lithography technology described in step 2. Source and drain metals of the device, i.e. Ti/Al/Ni/Au (20/100/45/55 nm), are deposited through electron beam evaporation technology. Then, the sample is peeled and cleaned and the photoresist is removed in the acetone solution. The composite metal structure is transformed into an alloy to form an ohmic contact through annealing in a nitrogen high temperature environment at 875° C. for 30 s. A 200 nm SiO.sub.2 passivation layer is deposited by PECVD.

[0077] Step 4: preparation of the gate dielectric insertion layer.

[0078] The gate region is defined through the semiconductor lithography technology described in step 2. Low-power (30 W) oxygen ion pre-treatment is performed on the surface of the p-GaN gate cap layer. Then, a Si.sub.3N.sub.4 gate dielectric insertion layer having a thickness of 5 nm is deposited through LPCVD.

[0079] Step 5: preparation of the gate.

[0080] The gate and field plate regions are defined through the semiconductor lithography technology described in step 2. The gate and extending field plate metals of the device, i.e. Ni/Au (100/100 nm), are deposited through electron beam evaporation. Then the sample is peeled and cleaned and the photoresist is removed in the acetone solution. Finally, a 1000 nm SiO.sub.2 passivation layer is deposited on the device surface through PECVD. Then, open regions required by the source, the gate, and the drain are defined through the semiconductor lithography technology described in step 2. The passivation layer of the defined region is removed to expose the metal electrode surface. An Al metal having a thickness of 1500 nm is deposited through magnetron sputtering to obtain the final device structure.

[0081] FIG. 8 and FIG. 9 illustrate the comparison results of energy bands and threshold voltage characteristics of devices in technical solutions with and without a gate dielectric insertion layer obtained using the device structure parameters in the embodiments. It can be seen from the figures that the introduction of the gate dielectric insertion layer may significantly elevate the band order and conduction band position of the barrier layer, so as to increase the gate withstand voltage and threshold voltage of the normally-off device. The threshold voltage of the device is increased from 1.5 V to 4.5 V, while the good on-current level of the device is retained.

[0082] The foregoing are merely preferred specific implementation modes of the present invention, but the scope of protection of the present invention is not limited to this. Any equivalent variations or replacements to the technical solutions of the present invention and the inventive concepts thereof which are made by persons skilled in the art within the technical scope disclosed by the present invention shall be encompassed by the protection scope of the present invention. The embodiments described in the present invention do not limit the content of the present invention, and other heterojunction HEMT devices with 2DEG are applicable to the scope proposed by the present invention. Any other passivation layer growth (including different growth techniques and different passivation layer combinations or directly skipping passivation process steps), ohmic contact electrode preparation processes (including different metal selection, deposition methods, and annealing conditions) or mesa etching processes are applicable to the scope proposed by the present invention for the purpose of realizing the basic functions of the normally-off HEMT device in the present invention of performing plasma treatment on the surface of the p-type gate cap layer to form a dielectric layer or additionally introducing a single-layer or multiple composite dielectric insertion layer structure. The composite gate dielectric insertion layer may be an insulating barrier layer or a dielectric layer that realizes the carrier tunneling effect. Moreover, the composite gate dielectric insertion layer may also be inserted under the gate cap layer according to claim 1. In this case, the composite gate dielectric may also be a high-resistance semiconductor. Similarly, changes in material structure parameters and electrode dimensions or equivalent replacements should all be covered by the protection scope of the present invention.