IMPLANTABLE ELECTRODE DEVICE AND METHOD OF FORMING AN IMPLANTABLE ELECTRODE DEVICE

Abstract

An implantable electrode device is provided comprising a first layer and a second layer, the second layer being on top of the first layer and including at least one electrode contact. The at least one electrode contact is exposable to a nerve of a nervous tissue of a human or of an animal. A connecting means electrically connects the electrode contact, where the connecting means is made up of at least one conducting wire, and the conducting wire is arranged within the first layer and is fixed to the electrode contact.

Claims

1. An implantable electrode device (1), comprising: a first layer (7; 7a 7b, 7c), and a second layer (6), the second layer (6) being on top of the first layer (7) and including at least one electrode contact (4, 4′), the at least one electrode contact (4, 4′) being exposable to a nerve of a nervous tissue of a human or of an animal, a connecting means which electrically connects the at least one electrode contact (4, 4′), wherein the connecting means is made up of at least one conducting wire (14, 14′), the at least one conducting wire (14, 14′) being arranged within the first layer (7; 7a 7b, 7c) and being fixed to the at least one electrode contact (4, 4′).

2. The implantable electrode device (1) of claim 1, wherein the at least one conducting wire (14, 14′) is arranged in a core (8) included within the first layer (7; 7a 7b, 7c).

3. The implantable electrode device (1) of claim 1, wherein the core (8) has the form of a channel (12) within the first layer (7), extending from a first opening (9) in the first layer (7; 7a 7b, 7c) to a position (13) underneath the at least one electrode contact (4, 4′).

4. The implantable electrode device (1) of claim 1, wherein the at least one electrode contact (4, 4′) is formed as at least one contact pad.

5. The implantable electrode device (1) of claim 4, wherein the at least one conducting wire (14, 14′) is fixed to the at least one electrode contact (4, 4′) at a point located underneath the at least one electrode contact (4, 4′).

6. The implantable electrode device (1) of claim 1, wherein the first layer (7; 7a 7b, 7c) has a first surface (10) and a second surface (11), wherein the second layer (6) is arranged on the first surface (10), and wherein the first opening (9) is formed in the second surface (11) of the first layer (7; 7a 7b, 7c).

7. The implantable electrode device (1) of claim 3, wherein the at least one wire (14, 14′) is guided through the channel (12) and the first opening (9) into a cable (24) coupling the electrode (1) with an interface unit (21).

8. The implantable electrode device (1) of claim 7, wherein a strain relief means is arranged within the core (8) and guided through the channel (12) and the first opening (9) into the cable (24) and being fixed to the electrode (1) and to the interface unit (21).

9. The implantable electrode device (1) of claim 6, wherein the strain relief means (15) is one of a suture, a string, litz wires, or other elongated, flexible, high pull-strength element.

10. The implantable electrode device (1) of claim 1, wherein the core (8) comprises a filling material made from silicone.

11. The implantable electrode device (1) of claim 1, wherein the second layer (6) is made from a polymer, preferably from Parylene-C.

12. The implantable electrode device (1) of claim 1, wherein the core (8) comprises a neutral fiber (nf) of the electrode device.

13. The implantable electrode device (1) of claim 1, wherein the implantable electrode (1) is formed as a micro-electrode array.

14. The implantable electrode device (1) of claim 13, wherein the micro-array comprises a plurality of electrode contacts (4, 4′).

15. A method of forming an implantable electrode device (1) of claim 1, the method comprising the steps: an intermediate layer (17) is applied onto a carrier substrate (16); a first layer (7a) of medical silicone is applied by spin coating onto the intermediate layer (17); the first silicone layer (7a) is structured with a Laser to define a future first opening (9) around its center axis (ca), which center axis (ca) is perpendicular to the surface of the first layer (7a); a sacrificial layer (sl) is applied onto the structured first silicone layer (7a); the sacrificial layer (sl) is Laser-structured to define a future cavity for a core (8); parts of the sacrificial layer (sl) which do not define the future cavity for the core (8) are removed; the sacrificial layer (sl) and parts of the first silicone layer (7a) not-covered by the sacrificial layer (sl) are covered with a second silicone layer (7b), preferably by spin coating; the second silicone layer (7b) is pressed using, a foil (pf), preferably a PTFE foil, placed onto the second layer (7b), and cured in order to obtain a plane surface; after curing, the foil (pf) is removed; a third silicone layer (7c) is applied onto the second silicone layer (7b), to form a bond coat; the third silicone layer (7c) is Laser-structured to define a future second opening (13) and a future welding point above the second the opening (13); on the third silicone layer (7c), a metal layer (5), preferably a platinum90-iridium10 foil, is laminated, and cured under pressure in order to keep its surface plane; The cured metal layer (5) is Laser-structured to form at least one electrode contact (4, 4′); parts of the cured metal layer (5) not forming the at least one electrode contact (4, 4′) are removed; glue (sg), preferably silicone glue, is applied as an annular structure onto the at least one electrode contact (4, 4′) around a future welding point to be located underneath the at least one electrode contact (4, 4′); the annular structure on the at least one electrode contact (4, 4′) is covered by a foil (kf), in particular made from Kaptan; a second layer (6) is applied; the second layer (6) is Laser-structured to allow re-opening the at least one electrode contact (4, 4′); the at least one electrode contact (4, 4′) is re-opened by removing parts of the second layer (6) and the foil (kf) covering it; the substrate (16) and the intermediate layer (17) are removed, thus exposing the first opening (9) to the future cavity for the core (8); the sacrificial layer (sl) and residential silicone particles are removed from the lower side, thus forming the cavity (8) for the core (8); connecting means (14, 14′) are laid out within the cavity for the core (8) and welded to the at least one electrode contact (4, 4′); wires (14′) are welded to the pad contacts (5); a strain relief (15) is laid out within the cavity (8); a point on the at least one contact (4, 4′) opposite to the welding point is sealed with glue (sg); the cavity comprising the connecting wires (14, 14′) and the strain relief (15) is filled up and sealed with glue (sg), thus forming the core (8).

Description

BRIEF DESCRIPTION OF THE DRAWING

[0058] In the following, the invention is described by means of embodiments and the drawing in further detail. In the drawings:

[0059] FIG. 1 shows a schematic perspective view of an implantable electrode according to prior art;

[0060] FIGS. 2a-c show an implantable electrode according to a first embodiment of the invention;

[0061] FIGS. 3a and b show a second embodiment of the invention; and

[0062] FIGS. 4a-w illustrate the steps of an exemplary production process for the implantable electrode according to the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0063] FIG. 1 shows a schematic perspective view of an implantable electrode 1 according to prior art. The electrode 1 comprises an electrically insulating substrate 2, which here is medical silicone, in which conductor paths 3 are embedded so as to connect electrode contacts or contact pads 4 to bond pads or terminal contacts 3-1, which in turn are connected to an electrode cable (not shown) connected to a power supply (not shown). The conductor paths 3 as well as the electrode contacts 4 and terminal contacts 3-1 may be produced by laser structuring of a metal foil, which is well known in the prior art.

[0064] FIG. 2a is a cross-sectional view of an implantable electrode device 1 according to a first embodiment of the invention illustrating the sequence of layers of the implantable electrode device 1. As can be seen, the electrode device 1 basically is made up of a first layer 7; 7a 7b, 7c, and a second layer 6. The second layer 6 is arranged on a first surface 10 on top of the first layer 7, 7a 7b, 7c and includes at least one electrode contact 4, 4′. The at least one electrode contact 4, 4′ is exposable directly or indirectly to nervous tissue of a human or of an animal. However, other layers of biological tissues might be in between.

[0065] The implantable electrode device 1 further comprises a connecting means which electrically connects the at least one electrode contact 4, 4′ to the outside of the implantable electrode device 1. The connecting means is made up of at least one conducting wire 14, 14′. The at least one conducting wire 14, 14′ is arranged within the first layer 7; 7a, 7b, 7c and is fixed to the at least one electrode contact 4, 4′.

[0066] More specifically, the at least one conducting wire 14, 14′ is guided up to the at least one contact 4, 4′ and fixed directly to the at least one contact 4, 4′ of the electrode device 1 on the backside of the at least one contact 4, 4′. The backside of the at least one contact 4, 4′ is the side opposed to the side exposable to the nerve of the nervous tissue. There are no metal conductor portions on the electrode device 1 between the at least one contact 4, 4′ and the at least one conducting wire 14, 14′. As can be seen in FIG. 2b and in FIGS. 4t to 4w, the location where the conducting wires are fixed to the at least one contact 4, 4′ is at the (temporary) second opening 13 of the first silicon layer 7; 7b 7c. This is underneath the at least one electrode contact 4, 4′.

[0067] Fixation of the at least one conducting wire 14, 14′ to the at least one contact 4, 4′ is done e.g., by welding.

[0068] The electrode device 1 may further comprise a strain relief 15 for the at least one conducting wire 14, 14′, which will be further described below.

[0069] The first layer 7 is made up of medical silicone material. The second layer 6 is a Parylene-C layer applied by chemical vapor deposition (CVP) on top of the first layer 7, in particular, on the first surface 10 of the first layer 7.

[0070] FIG. 2b is a cross-section of the implantable electrode 1 in an intermediate stage of production, illustrating how the at least one conducting wire 14, 14′ is placed into the implantable electrode.

[0071] Hereto, the first layer 7 has a core 8 which is formed as a channel 12 extending from a first opening 9 formed in a second surface 11 of the first layer 7 to the location or locations of the at least one electrode contact 4, 4′ through the electrode device 1. The second surface 11 is opposite to the first surface 10.

[0072] During production, the at least one conducting wire 14, 14′ is placed in the core 8 within the implantable electrode 1. The core 8 is a zone in the interior of the first layer 7, i.e., the core 8 is enclosed by the first layer 7. Later during the production process, the core 8 (i.e., the hollow space) is filled up with silicon glue, thus fixing the wires 14, 14′.

[0073] The optional strain relief 15 (described below) is also placed in the channel 12 through the opening 9.

[0074] FIG. 2c illustrates the implantable electrode device 1 of the first embodiment of the present invention being electrically coupled with an interface unit 21 through the at least one conducting wire 14, 14′. The at least one conducting wire 14, 14′ is guided within a cable 24. The cable 24 is flexible and comprises a tube made from e.g., silicone.

[0075] The interface unit 21 may be, or comprise, a plug and/or an electronic unit which processes signals from and/or to the electrode device 1. It may relay the signals from/to a remote location. The interface unit 21 is of course a unit physically distinct and separate from the electrode device 1.

[0076] The electrode device 1 may further comprise a strain relief 15 for the at least one conducting wire 14, 14′, which is fixed to the electrode device 1 and guided within the cable 24 to the interface unit 21 and fixed there. Within the electrode device 1, the strain relief 15 is guided through the channel 12 comprised in the core 8. The strain relief 15 extends through the entire channel 12 and thus, basically through the entire electrode device 1 and serves as a strain relief means, as described above.

[0077] The strain relief 15 is guided through the core 8 in a way that ensures it is straight and under slight tension. Tensile stresses applied in axial direction of the electrode array will distribute between the wires and the suture with the suture taking more tensile load compared to the wires.

[0078] The strain relief 15 may be a suture. Instead of a suture 15, other flexible material that can withstand high pull forces (e.g., string, thread, litz wire, Kevlar filament, etc.) can be used as the strain relief means 15.

[0079] The strain relief 15 is placed into the electrode device 1 at the same time during production as the at least one conducting wire 14, 14′, refer to the description thereof above. Since the entire core 8 is filled with silicone, the inner space accommodating the at least one conducting wire 14, 14′ and the strain relief 15 is sealed.

[0080] FIG. 3a illustrates a second embodiment of the invention. While the at least one conducting wire 14, 14′ is guided in meander form within the electrode device 1, the strain relief 15, i.e., the suture 15 is guided straight within the electrode device 1. This provides for the strain relief of the conducting wires 14, 14′ within the electrode device 1.

[0081] FIG. 3b illustrates a cross-section of the implantable electrode of FIG. 3a along a cut line A-A′. Preferably the core 8 is located around (i.e, comprises) the “neutral fiber” nf in the electrode device. The neutral fiber is a straight line which keeps its length constant when the device is bent along (i.e., in direction of) that line. On other words, the neutral fiber nf or neutral plane is the one plane within the electrode device 1, along which there are no longitudinal stresses or strains when the electrode device 1 is bent. That is, the fiber nf keeps its length constant when the electrode device 1 is bent. If the core 8 is around the neutral fiber nf, the conducting wires 14, 14′ placed therein keep their lengths always constant.

[0082] By the configuration described above, a space saving arrangement is achieved which moreover provides for strain relief over the entire length of the implantable electrode device 1.

[0083] With reference to FIGS. 4a to 4w, a production process for the implantable electrode device 1 of the present invention is described step by step.

[0084] In a first step, refer to FIG. 4a, an intermediate polymeric release layer 17 is applied onto a carrier substrate 16 made e.g., from ceramics. The intermediate layer 17 separates the carrier substrate 16 from the layer 7a, and allows to remove the ceramic carrier substrate 16 along with itself later.

[0085] A first layer 7a of medical silicone is applied by spin coating onto the intermediate layer 17, refer to FIG. 4b.

[0086] Then, the first layer 7a is structured with a Laser to define a (future) first opening 9 around its center axis ca, which center axis ca is perpendicular to the surface of the first layer 7a, refer to FIG. 4c.

[0087] A (future) cavity for a core 8 will be prepared by applying sacrificial layer process making use of polyimide material, e.g., of a laser structured Kapton® band.

[0088] That is, the Kapton band as sacrificial layer sl is applied onto the structured first silicone layer 7a, refer to FIG. 4d.

[0089] The sacrificial layer sl is Laser-structured to define the geometry of the (future) cavity for the core 8, refer to FIG. 4e.

[0090] The parts of the sacrificial layer sl which do not define the geometry of the (future) cavity for the core 8 are removed, refer to FIG. 4f.

[0091] The sacrificial layer sl as well as the parts of the first silicone layer 7a not-covered by the sacrificial layer sl are covered with a second silicone layer 7b by spin coating, refer to FIG. 4g.

[0092] In order to obtain a plane surface, the second silicone layer 7b is pressed using a PTFE foil pf placed onto the second layer 7b during curing the silicone, refer to FIG. 4h. The PTFE foil is removed after curing.

[0093] As a bond coat, a third silicone layer 7c is applied onto the second silicone layer 7b, refer to FIG. 4i, and Laser-structured to define a (future) second opening 13 and a (future) welding point above the second opening 13, refer to FIG. 4j.

[0094] On the third silicone layer 7c, a metal layer 5, e.g., a platinum90-iridium10 foil, is laminated, and cured under pressure, refer to FIG. 4k, in order to keep its surface plane.

[0095] The cured metal layer 5 is then Laser-structured to form electrode contacts 4. Outer parts thereof not forming electrode contacts are removed, refer to FIG. 4l.

[0096] Silicone glue sg is applied in an annular shape around a (future) opening 13 for a future welding point, the opening 13 and welding point being underneath electrode contact 4, refer to FIG. 4m and FIG. 4t.

[0097] The location above the welding point is temporarily covered by a Kapton® foil kf, refer to FIG. 4n.

[0098] The metal layer 5 in turn is covered by the second layer 6 which is e.g., a Parylene-C layer 6 applied by chemical vapor deposition (CVD), refer to FIG. 4o.

[0099] The Parylene-C-layer 6 is Laser-structured to allow re-opening the welding point 4, refer to FIG. 4p.

[0100] The welding point 4 is opened by removing the parts of the Parylene layer 6 and Kapton foil kf covering it, refer to FIG. 4q.

[0101] Then, the carrier substrate 17 along with the intermediate polymeric release layer 16 is removed, thus exposing the first opening 9 to the sacrificial layer (sl) from the lower side, refer to FIG. 4r.

[0102] Then, the sacrificial layer sl and residential silicone particles are removed from the lower side, refer to FIG. 4s, thus forming the cavity (8) which corresponds to the future core 8.

[0103] Then, conducting wires i.e., the connecting means 14, 14′ are laid out within the cavity (corresponding to core 8) and welded directly to the at least one electrode contact 4, 4′, refer to FIG. 4t. The connecting means 14, 14′ (e.g., a conducting wire) are welded to the rearward surface of the at least one electrode contact 4, 4′, that is the side opposite to the side exposable to the nervous tissue, and at the location of the at least one electrode contact exposable to the nervous tissue.

[0104] Yet further, the strain relief, that is, the suture 15 is laid out within the cavity for the core 8, refer to FIG. 4u.

[0105] The point on the metal contact 4 opposite to the welding point is sealed with silicone glue sg, refer to FIG. 4v.

[0106] Finally, the cavity comprising the connecting wires 14, 14′ and the strain relief suture 15 is filled up and sealed with silicone glue sg, thus forming the core 8, refer to FIG. 4w.

REFERENCE NUMERALS

[0107] 1 implantable electrode [0108] 2 substrate [0109] 3 conductor path [0110] 3-1 terminal contact [0111] 4, 4′ electrode contact [0112] 5 metal layer [0113] 6 second layer [0114] 7; 7a, 7b, 7c first layer [0115] 8 core, cavity [0116] 9 first opening [0117] 10 first surface of first layer [0118] 11 second surface of first layer [0119] 12 channel [0120] 13 second opening for (future) welding location [0121] 14, 14′ connection means, conducting wire [0122] 15 strain relief means, suture [0123] 16 carrier substrate [0124] 17 intermediate layer [0125] 21 interface unit [0126] 24 cable [0127] ca central axis [0128] kf Kapton foil [0129] of neutral fiber [0130] pf PTFE foil [0131] sg silicone glue [0132] sl sacrificial layer