PROXIMITY SENSOR

Abstract

A method of manufacturing a sensor device includes obtaining a semiconductor die structure comprising a transmitter and a receiver. Then, a first sacrificial stud is affixed to the transmitter and a second sacrificial stud is affixed to the receiver. The semiconductor die is affixed to a lead frame, and pads on the semiconductor die structure are wirebonded to the lead frame. The lead frame, the semiconductor die structure, and the wirebonds are encapsulated in a molding compound, while the tops of the first and second sacrificial studs are left exposed. The first and second sacrificial studs prevent the molding compound from encapsulating the transmitter and the receiver, and are removed to expose the transmitter in a first cavity and the receiver in a second cavity. In some examples, the semiconductor die structure includes a first semiconductor die comprising the transmitter and a second semiconductor die comprising the receiver.

Claims

1. A method, comprising: affixing a first sacrificial stud to a transmitter on a semiconductor die structure and a second sacrificial stud to a receiver on the semiconductor die structure; affixing the semiconductor die structure to a lead frame; wire bonding pads on the semiconductor die structure to the lead frame; encapsulating the lead frame, the semiconductor die structure, and the wire bonds in a molding compound, wherein a top of the first sacrificial stud and a top of the second sacrificial stud remain exposed, and wherein the first and second sacrificial studs prevent the molding compound from encapsulating the transmitter and the receiver; and removing the first and second sacrificial studs, such that the transmitter is exposed in a first cavity and the receiver is exposed in a second cavity.

2. The method of claim 1, wherein the semiconductor die structure comprises a first semiconductor die and a second semiconductor die, the first semiconductor die comprises the transmitter, and the second semiconductor die comprises the receiver.

3. The method of claim 1, further comprising filling at least one of the first and second cavities with a non-molding compound material.

4. The method of claim 3, wherein the transmitter comprises a light source, the receiver comprises a light detector, and the non-molding compound material comprises a transparent material.

5. The method of claim 1, wherein the molding compound comprises a barrier between the first and second cavities.

6. The method of claim 1, wherein affixing the first sacrificial stud to the transmitter and the second sacrificial stud to the receiver comprises affixing a first tapered sacrificial stud to the transmitter and a second tapered sacrificial stud to the receiver.

7. The method of claim 1, wherein the first and second sacrificial studs comprise tubes such that the transmitter and the receiver remain exposed in the first and second cavities while the lead frame, the semiconductor die structure, and the wire bonds are encapsulated in the molding compound.

8. The method of claim 1, wherein the first and second sacrificial studs comprise a metal, removing the first and second sacrificial studs comprises etching the metal with an etching chemical, and the etching chemical is chosen to etch the metal without damaging the transmitter, the receiver, and the molding compound.

9. The method of claim 1, wherein the first and second sacrificial studs comprise a plastic or photoresist, and removing the first and second sacrificial studs comprises removing the plastic or photoresist without damaging the transmitter, the receiver, and the molding compound.

10. The method of claim 1, wherein affixing the first and second sacrificial studs comprises gluing, with an adhesive, the first sacrificial stud to the transmitter and the second sacrificial stud to the receiver, removing the first and second sacrificial studs comprises using a solvent to remove the adhesive from the transmitter and the receiver, and the solvent is chosen to remove the adhesive without damaging the transmitter, the receiver, and the molding compound.

11. The method of claim 1, wherein the first sacrificial stud covers the transmitter such that no part of the transmitter is exposed, and the second sacrificial stud covers the receiver such that no part of the receiver is exposed.

12. A device, comprising: a semiconductor die structure comprising a transmitter and a receiver; a lead frame, wherein the semiconductor die structure is affixed to the lead frame, and pads on the semiconductor die structure are bonded by wire bonds to the lead frame; and a molding compound encapsulating the lead frame, the semiconductor die structure, and the wire bonds, wherein a first cavity in the molding compound exposes the transmitter, a second cavity in the molding compound exposes the receiver, and the molding compound forms a barrier between the transmitter and the receiver.

13. The device of claim 12, wherein the device comprises a proximity sensor, and the proximity sensor is calibrated once to determine a position of the transmitter relative to a position of the receiver.

14. The device of claim 12, wherein the semiconductor die structure comprises a first semiconductor die and a second semiconductor die, the first semiconductor die comprises the transmitter, and the second semiconductor die comprises the receiver.

15. The device of claim 14, wherein the first semiconductor die comprises a first substrate, and the second semiconductor die comprises a second substrate.

16. The device of claim 12, wherein at least one of the first and second cavities is filled with a non-molding compound material.

17. The device of claim 12, wherein the transmitter comprises a light source, the receiver comprises a light detector, and at least one of the first and second cavities are filled with a transparent material.

18. The device of claim 12, wherein the transmitter comprises a light source, the receiver comprises a light detector, and one or more optical components are aligned with the first and second cavities.

19. A method, comprising: affixing a semiconductor die structure to a lead frame, wherein the semiconductor die structure comprises a light source and a light detector in a particular configuration, wherein the particular configuration comprises a known spatial relationship between the light source and the light detector; wire bonding pads on the semiconductor die structure to the lead frame; affixing a first sacrificial stud to the light source and a second sacrificial stud to the light detector; encapsulating the lead frame, the semiconductor die structure, and the wire bonds in a molding compound, wherein the first and second sacrificial studs prevent the molding compound from covering the light source and the light detector; and removing the first and second sacrificial studs, such that the light source is exposed in a first cavity and the light detector is exposed in a second cavity, wherein the molding compound forms a barrier between the light source and the light detector.

20. The method of claim 19, further comprising filling the first and second cavities with a transparent material.

21. The method of claim 19, further comprising aligning one or more optical components with the first and second cavities.

22. The method of claim 19, wherein the known spatial relationship between the light source and the light detector simplifies a calibration process for the light source and the light detector.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] FIG. 1 illustrates an example light detection and ranging (LIDAR) system.

[0007] FIG. 2 illustrates an example overview of a sensor package molding process.

[0008] FIGS. 3A-H illustrate an example fabrication process for a sensor package molding.

[0009] FIG. 4 illustrates an example sensor package molding with a multi-chip module.

[0010] FIG. 5 illustrates example shapes of sacrificial studs used in fabricating a sensor package molding.

DETAILED DESCRIPTION

[0011] The sensor package manufacturing processes described herein include placing sacrificial studs to prevent flow of the molding compound over the transmitter and receiver and to create a local cavity for the transmitter and receiver channels. The sacrificial studs enable massively parallel creation of cavities, as an entire lead frame with a very large number of semiconductor dies can be processed at once. The molding compound forms a barrier between the transmitter and receiver channels, improving channel isolation. The sacrificial studs are then removed to expose the transmitter and the receiver. Thus, the resulting sensor package can be made with standard equipment and manufacturing reliability. Also, a wide variety of sizes and shapes of the cavities for the transmitter and receiver channels can be made with only minor adjustment to the manufacturing process.

[0012] FIG. 1 illustrates an example light detection and ranging (LIDAR) system 100, which includes a light source 110, a sensor 120, and an integrated circuit (IC) 130 including a detector. The light source 110 emits light rays 140 that reflect off an object 180 and are collected by sensor 120. The distance between the LIDAR system 100 and the object 180 can be determined based on the data provided to IC detector 130 from sensor 120. Without a barrier between sensor 120 and light source 110, light rays 150 travel directly from light source 110 to sensor 120 and introduce crosstalk into the sensor data, introducing error into the distance determination. To reduce crosstalk and isolate the light transmitter and light receiver channels, a barrier is often placed between the light source 110 and sensor 120.

[0013] However to accurately determine distances, the light source 110 and the sensor 120 must be precisely located relative to each other and remain fixed, so the LIDAR system 100 does not need to perform extensive calibration more than once. To combine the light source 110 and sensor 120 into a single package, two hollow chambers are molded. A semiconductor die with the light source 110 is placed into one chamber, and a semiconductor die with the sensor 120 is placed into the other chamber. Both are wire bonded to the substrates within the chambers. Then the hollow chambers are filled with a transparent mold compound, which covers both semiconductor dies and protects the wire bonding while still allowing light to be emitted and received by the light source 110 and the sensor 120.

[0014] The combination of two different mold compounds and substrates with different properties causes manufacture of the two hollow chambers in a single package to be unreliable. To improve the manufacturability, the dies are placed farther apart, and the overall package size increases. While a LIDAR system 100 with a light source 110 and a sensor 120 is described in FIG. 1, any system with a transmitter channel and a receiver channel, such as radar systems and ultrasonic sensing systems, balances similar challenges with channel isolation, calibration, and manufacturing.

[0015] FIG. 2 illustrates an example overview of a sensor package molding process 200. Rather than separating the transmitter and the receiver onto different semiconductor dies, they are placed together on the same semiconductor die structure 210 in the desired configuration and proximity to each other. Sacrificial studs are placed over the transmitter and receiver to protect them during the next step of the molding process 200 and to create clear transmitter and receiver channels. The semiconductor die structure 210 is then encapsulated in a single standard molding compound but the sacrificial studs are left exposed, as shown in semiconductor 220. The sacrificial studs can be removed to expose the transmitter and receiver while maintaining a barrier of the molding compound between the two and ensuring channel isolation, resulting in the semiconductor die 230.

[0016] FIGS. 3A-H illustrate an example fabrication process for a sensor package molding. FIG. 3A illustrates an example semiconductor die 300 including a transmitter 305 and a receiver 310 affixed on a die 320. The transmitter 305 and receiver 310 are arranged on a die 320 in a desired configuration based on the intended implementation for the sensor package. The desired configuration can be chosen to simplify calibration procedures, increase the number of channels in an area on the die 320, or the like. FIG. 3B illustrates an example wafer 330 with multiple dies 320 fabricated together. Next, sacrificial studs 335 and 340 are placed over transmitter 305 and receiver 310, as illustrated in the angled view of semiconductor die 300 shown in FIG. 3C.

[0017] Sacrificial studs 335 and 340 are cylindrical shaped in this example, but may be hollow rings encircling transmitter 305 and receiver 310, or other shapes as shown in FIG. 5. Sacrificial studs 335 and 340 can be made of metal, plastic, photoresist, or other appropriate materials and fastened to semiconductor die 300 by an adhesive material, surface mount technology, or the like. The sacrificial studs can be fabricated using standard mold tooling, equipment, materials, and processes without resorting to special mold tooling or inserts. Also, the sacrificial studs can be created in parallel for each semiconductor die on wafer 330 such that the manufacturing process is not unduly slowed by the step of creating the sacrificial studs.

[0018] The semiconductor die 300 is separated from the larger wafer 330 by a diamond saw, a laser, or other process, and attached to a lead frame 350 and wire bonded 355, as shown in the closeup in FIG. 3D. FIG. 3E illustrates the larger array 360 of multiple semiconductor dies 300 attached to the lead frame 350. In some manufacturing processes, the sacrificial studs 335 and 340 can be placed after semiconductor die 300 is attached to the lead frame 350 and wire bonded 355. In some implementations, stress buffers and coatings such as polyimide, polybenzoxazole, and silicone coatings can be applied.

[0019] FIG. 3F shows an x-ray view of the single semiconductor 300 after it has been encapsulated in a molding compound 370 such as plastic or epoxy. The sacrificial studs 335 and 340 act as barriers for mold flow and create a local cavity without the molding compound 370. The sacrificial studs 335 and 340 are removed next, such as by chemical etching for metallic studs or light exposure for photoresist studs. A solvent can remove any remaining adhesive as needed. The material of sacrificial studs 335 and 340, molding compound 370, transmitter 305 and receiver 310, and the removal materials are chosen to ensure that the sacrificial studs 335 and 340 can be removed without damaging transmitter 305 and receiver 310 and leaving the molding compound intact.

[0020] FIG. 3G shows an x-ray view of the semiconductor die 300 with sacrificial studs 335 and 340 removed, leaving behind cavities 375 and 380, respectively, and exposing transmitter 305 and receiver 310. The cavities 375 and 380 allow transmitter 305 and receiver 310 to transmit and receive signals while a barrier of the molding compound 370 between transmitter 305 and receiver 310 ensures channel isolation between the two. The cavities 375 and 380 can be left empty or filled with a transparent plastic or other material that allows signals to be emitted and received unimpaired. In some implementations, lenses or other optical components can be aligned with the cavities 375 and 380.

[0021] The individual packages can be separated from the lead frame 350 and calibrated for use, such as for use in a proximity sensor. Because the transmitter 305 and receiver 310 are fixed relative to each other, calibration can be performed less frequently and more simply than in other systems in which the transmitter 305 and receiver 310 are on separate semiconductor die and can move relative to each other. The semiconductor die 300 as packaged is attached to a printed circuit board 390 and integrated into a larger system, as shown in FIG. 3H. For example, the semiconductor die 300 is incorporated into a proximity sensor or a LIDAR system 100, shown in FIG. 1.

[0022] FIG. 4 illustrates an example sensor package 400 with a multi-chip module. In some implementations, the desired substrate characteristics for the transmitter and the desired substrate characteristics for the receiver are incompatible, such that the transmitter and the receiver are placed on separate semiconductor die with different characteristics. The separate semiconductor die are included in a single semiconductor die structure. The transmitter die 405 and the receiver die 410 can be packaged as a multi-chip module according to the process outlined in FIGS. 3A-H. Transmitter die 405 and receiver die 410 are fastened to a lead frame 450 by an adhesive 495 and wire bonded 455 together and to the lead frame 450.

[0023] The semiconductor die structure including the two dies 405 and 410 and the wire bonds 455 are encapsulated in molding compound 470, although cavities 475 and 480 remain open and create isolated channels for transmitter die 405 and receiver die 410. Although the relative positions of transmitter die 405 and receiver die 410 will not be as precise as the transmitter 305 and receiver 310 on a single semiconductor die 300, calibration of sensor package 400 can be done easily and once after manufacturing and performed rarely after that initial calibration.

[0024] FIG. 5 illustrates example shapes of sacrificial studs 500-560 used in fabricating a sensor package molding. The sacrificial studs can be square-shaped, as illustrated by stud 500 with pointed corners and stud 510 with rounded corners. Studs 520 and 540 are circular-shaped with tapered sides, such that the top surface of the studs is larger than the bottom surface. Similarly, studs 530 and 550 are cylindrical, with flat sides and substantially equal-sized top and bottom surfaces. Studs 520 and 540 and studs 530 and 550 are similarly shaped but made of different materials, such as metal and photoresist, respectively. While these example studs are solid, the sacrificial studs 500-550 can also be hollow rings, such as stud 560.

[0025] Modifications are possible in the described embodiments, and other embodiments are possible, within the scope of the claims.