RESISISTIVE METAL OXIDE GAS SENSOR, MANUFACTURING METHOD THEREOF AND METHOD FOR OPERATING THE SENSOR
20220163473 · 2022-05-26
Inventors
Cpc classification
International classification
G01N27/12
PHYSICS
Abstract
A resistive metal oxide gas sensor comprises a support structure and a porous sensing layer (1) arranged on the support structure or partly housed therein. Electrodes (2) are in electrical communication with the porous sensing layer (1), and a heater (3) is in thermal communication with the porous sensing layer (1). The heater (3) can be operated to heat the porous sensing layer (1) to a target temperature for allowing a determination of the presence or the concentration of a target gas, i.e., ozone, based on a sensing signal supplied via the electrodes (2). The porous sensing layer (1) comprises a network of interconnected monocrystalline metal oxide nanoparticles (14) and a gas-selective coating (12) of the network. A thickness (t1) of the porous sensing layer (1) is at most 10 pm. The coating (12) comprises one or more of silicon oxide and silicon nitride, and is of a thickness (t12) of less than 5 nm.
Claims
1. A resistive metal oxide gas sensor, comprising a support structure; a porous sensing layer arranged on the support structure or partly housed therein; electrodes in electrical communication with the porous sensing layer; a heater in thermal communication with the porous sensing layer, the heater configured to heat the porous sensing layer to a target temperature so as to allow a determination of the presence or the concentration of a target gas based on a sensing signal supplied via the electrodes; wherein: the porous sensing layer comprises a network of interconnected monocrystalline metal oxide nanoparticles; and a gas-selective coating of the network; the coating comprises one or more of silicon oxide and silicon nitride; a thickness of the porous sensing layer is at most 10 μm; a thickness of the coating is less than 5 nm; and the target gas is ozone.
2. The resistive metal oxide gas sensor according to claim 1, wherein the porous sensing layer is configured to show a void fraction in a range between 30% and 60% denoting a porosity of the porous sensing layer.
3. The resistive metal oxide gas sensor according to claim 1, wherein the thickness of the coating is between 1 nm and 3 nm.
4. The resistive metal oxide gas sensor according to claim 1, wherein an average size of the monocrystalline metal oxide nanoparticles is at most 100 nm.
5. The resistive metal oxide gas sensor according to claim 1, wherein the thickness of the porous sensing layer is at most 5 μm; preferably wherein the thickness of the porous sensing layer is at most 1 μm.
6. The resistive metal oxide gas sensor according to claim 1, wherein: the sensor further comprises a controller configured to operate the heater for it to heat the porous sensing layer to said target temperature, the latter being in a temperature range between 400° C. and 600° C.; the sensor preferably comprises a temperature sensor integrated in the sensor and configured to provide a temperature feedback to the controller; and the controller is preferably integrated in the sensor.
7. The resistive metal oxide gas sensor according to claim 1, wherein the metal oxide material comprises one or more of SnO2, In2O3, WO3, TiO2, ZnO, Ga2O3, and Fe2O3.
8. The resistive metal oxide gas sensor according to claim 1, wherein the monocrystalline metal oxide nanoparticles comprise a noble metal doping of at most 10 wt %.
9. The resistive metal oxide gas sensor according to claim 1, wherein the electrodes are arranged on or in the support structure and are at least partly covered by the porous sensing layer.
10. The resistive metal oxide gas sensor according to claim 1, wherein the coating covers all surfaces of the network accessible by gaseous precursors of the coating material, preferably wherein the coating covers all surfaces of the network except for surfaces in direct contact with the support structure, the electrodes and the heater, if so, and except for surfaces facing voids in the porous sensing layer inaccessible to the gaseous precursors, preferably wherein the coating covers top surfaces of the network facing the environment prior to coating, and in addition covers buried surfaces within the porous sensing layer, preferably wherein the coating is uniform in its thickness including a tolerance of ±50%.
11. The resistive metal oxide gas sensor according to claim 1, wherein the target gas includes hydrogen in addition to ozone.
12. A method for manufacturing a resistive metal oxide gas sensor sensitive to ozone, the method comprising the following sequence of steps: manufacturing a support structure including electrodes and a heater; depositing monocrystalline metal oxide nanoparticles on the support structure; annealing or sintering the deposited monocrystalline metal oxide nanoparticles, thereby forming a network of interconnected monocrystalline metal oxide nanoparticles, applying a gas-selective coating of a thickness of less than 5 nm onto the network of interconnected monocrystalline metal oxide nanoparticles, the coating comprising one or more of silicon oxide and silicon nitride; the coated network of interconnected monocrystalline metal oxide nanoparticles contributing to a porous sensing layer of a thickness of at most 10 μm, which porous sensing layer is arranged on the support structure or partly housed therein such that the electrodes are in electrical communication with the porous sensing layer and such that the heater is in thermal communication with the porous sensing layer.
13. The method of claim 12, comprising providing noble metal particles and doping the monocrystalline metal oxide nanoparticles with the noble metal particles, the noble metal particles serving as nuclei for growing the coating on the network of interconnected monocrystalline metal oxide nanoparticles.
14. The method of claim 12, comprising applying the coating by means of a CVD process at a coating temperature in a coating temperature range between 400° C. and 700° C.
15. The method of claim 14, comprising generating the coating temperature by operating the heater.
16. The method of claim 14, applying the coating by means of the CVD process by using a gaseous oxygen and/or nitrogen species and a gaseous silicon species as gaseous precursors, preferably wherein the CVD process is applied at ambient pressure, in particular at a pressure of 1 atm, preferably wherein the gaseous oxygen species comprises one or more of O2 and O3 and/or the gaseous nitrogen species comprises ammonia, and preferably wherein the gaseous silicon species is one or more of: silane, dichlorosilane, tetraethylorthosilicate, or TEOS, hexamethyldisiloxane, or HMDSO, hexamethylcyclotrisiloxan, or D3, octamethylcyclotetrasiloxan, or D4, and decamethylcyclopentasiloxane, or D5.
17. A method for operating a resistive metal oxide gas sensor according to claim 1, the method comprising: taking a measurement including: operating the heater to heat the porous sensing layer to the target temperature; and determining a presence or a concentration of the target gas based on the sensing signal received from the electrodes, preferably while heating the porous sensing layer.
18. The method of claim 17, further comprising, prior to taking the measurement: placing the gas sensor in a gas mixture including hydrogen and calibrating the gas sensor by taking into account a hydrogen background concentration as expected in the measurement environment.
19. A method for operating a resistive metal oxide gas sensor as obtained in accordance with the method of claim 12, the method comprising: taking a measurement including: operating the heater to heat the porous sensing layer to the target temperature; and determining a presence or a concentration of the target gas based on the sensing signal received from the electrodes, preferably while heating the porous sensing layer.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0050] Devices, apparatuses and methods embodying the present invention will now be described, by way of non-limiting examples, and in reference to the accompanying drawings, wherein:
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[0060] The accompanying drawings show simplified representations of devices or parts thereof, as involved in embodiments. Technical features depicted in the drawings are not necessarily to scale. Similar or functionally similar elements in the figures have been allocated the same numeral references, unless otherwise indicated.
MODES FOR CARRYING OUT THE INVENTION
[0061] Embodiments of the metal oxide (MOX) gas sensor according to the present invention are attractive because of their small footprint, fast response, and high sensitivity to the desired target gas/es. In addition, previous drawbacks of conventional MOX gas sensors are overcome by the present embodiments: The selectivity achieved for the target gas/es is raised, and long-term drift due to poisoning by silicone compounds is significantly reduced such that no or almost no deactivation of the catalytic activity occurs over time.
[0062] The gas sensor according to embodiments comprises a porous sensing layer of a semiconducting metal oxide, such as SnO2, including monocrystalline metal oxide nanoparticles, in following monocrystalline MOX NPs, with an average size typically in the tens of nm. The monocrystalline MOX NPs are assembled in network of interconnected monocrystalline MOX NPs, such that electrical conductivity is provided between the electrodes through the network of interconnected monocrystalline MOX NPs. The interconnectivity may be achieve in an annealing or sintering step applied after having deposited the monocrystalline MOX NPs on the support structure.
[0063]
[0064] A couple of elements are integrated in the substrate 5, which elements comprise one or more resistive heaters 3, and one or more temperature sensors 4. The various elements referencing a heating structure in one embodiment can represent a single heater 3 with multiple arms electrically interconnected, and hence controllable by a single controlling signal, or, in a different embodiment can represent multiple heaters individually controllable. Preferably, the heater 3 is made from tungsten. The temperature sensor 4 is preferably also made from tungsten and is provided for monitoring the temperature of the substrate 5 which may at the same time represent the temperature of a porous sensing layer 1 deposited on the substrate.
[0065] The porous sensing layer 1 is to be heated to a target temperature within a target temperature range. Accordingly, a controller (not shown, e.g., provided as part of the sensor or on a separate chip) controls the heater 3 to heat the porous sensing layer 1 to the target temperature while the temperature sensor 4 monitors the heating efforts. Subject to the temperature sensed by the temperature sensor 4, the heater is controlled e.g., to continue heating, or, e.g., to stop heating, in a feedback loop in which the target temperature is the set value to be compared to the actual value supplied by the temperature sensor 4.
[0066] Electrodes 2 are arranged on top of the substrate 5. Preferably, the electrodes 2 are made from platinum. Electrodes 2, heater 3, and temperature sensor 4, if any, may be manufactured within a conventional CMOS process for processing a CMOS layer stack on top of a Si wafer. In the present example, the heater 3 and the temperature sensor 4 may be manufactured from one or more conducting layers within a CMOS layer stack of conducting and insulating layers. The electrodes may also be made from one of the conducting layers of the layer stack, or may be made from a conducting material, such as Pt, applied on top of the CMOS layer stack. The electrodes 2, the heater 3 and/or the temperature sensor 4 may be shaped by lithography steps, for example. The porous sensing layer 1 is arranged on top of the support 5 and covers at least part of the electrodes 2. The porous sensing layer 1 shows an extension in x- and y-direction and has a thickness in z-direction referred to by t1. The thickness t1 of the porous sensing layer 1 is less than 10 μm, and in the present example e.g., is 5 μm.
[0067] The controller is configured to operate the heater 3, and to specifically heat the layer 1 to a target temperature in a temperature range between 450° C. and 550° C. In response to such heating, the electrodes supply an electrical sensing signal to the controller for further processing and/or evaluation. The sensing signal is representative of the electrical conductivity or the resistance of the porous sensing layer 1 in between the electrodes 2. In view of the heating of the porous sensing layer 1, ozone as a target gas may reach metal oxide material contributing to the porous sensing layer 1, interact there and lead to a change in the electrical conductivity thereof.
[0068] Reference sign 1z denotes an arbitrary region in the porous sensing layer 1, a zoomed view of which arbitrary region is illustrated in
[0069] Adjacent monocrystalline MOX NPs 14 are electrically connected to each other, i.e., they may contact each other, but are not necessarily mechanically linked to each other. The monocrystalline MOX NPs 14 thus form a network of interconnected monocrystalline MOX NPs 14. A coating 12 coats the network without coating the contacts between adjacent monocrystalline MOX NPs. The coating 12 is a gas-selective coating and presently is selective for ozone.
[0070] In the present example, the coating 12 is considered a uniform coating, i.e., a coating of rather uniform thickness including a tolerance of ±50%, and a conformal coating that follows the contour of the coated material by not changing its thickness within the tolerances. The coating of the present example may also be essentially continuous, i.e., free of holes or gaps other than the pores for the target gas. As can be derived from
[0071] A thickness t12 of the coating 12 preferably is less than 5 nm, and in the present example is 3 nm. A size of individual monocrystalline MOX NPs is referred to by s14. An average monocrystalline MOX NP size is determined by the arithmetic mean of the various monocrystalline MOX NP sizes s14. In the present example, the average monocrystalline MOX NP size is, for example, 13 nm. A fraction of the voids 11 relative to the total volume of the layer preferably is between 30% and 60% (±10%, e.g., between 30% and 40%). In the present example, the porosity is 35%.
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[0074] The gas sensor comprises a support structure which presently includes a structured substrate 5, e.g., of silicon. The substrate 5 has a membrane configuration, i.e., the substrate 5 includes a recess 51 for providing a thinned portion of the substrate 5, on which electrodes 2 are arranged. In the thinned portion 51, a heater 3 is provided for heating a porous sensing layer 1 arranged on top of the thinned portion 51 of the substrate 5. The electrodes 2 are arranged on or in the gas sensor, so as to be in electrical communication with a porous sensing layer 1. They may be formed out of a platinum or gold layer, which metals are well suited for forming stable electrodes. The electrodes 2 may for instance be in an interdigitated configuration containing interdigitated fingers 21. Thus, the porous sensing layer 1 may advantageously have shape that spans a region that covers or includes the interdigitated fingers 21 of the electrodes 2 to ensure proper electrical communication therewith.
[0075] The heater 3 is in thermal communication with the porous sensing layer 1, to operate the metal oxide material at a target temperature. The heater 3 is a resistive heating element. For example, one may use a heater 3 of tungsten, i.e., a heater 3 comprising at least 50% (±1%), in particular at least 90% (±1%), of tungsten, to best withstand high temperatures. Several heaters may be provided, to heat the membrane, or a bridge, see
[0076] The porous sensing layer 1 extends on an exposed surface of the thinned portion 51 of the substrate 2, i.e., the membrane, thereby covering the electrodes 2 to a large part. The porous sensing layer 2 may for instance have a disk, ovoid or, still, a rectangular shape. All other properties of the porous sensing layer 1 can be taken from the description of
[0077] The gas sensor preferably includes circuitry (integrated therewith), which is electrically connected to the heater 3 and to the electrodes 2. The circuitry preferably forms a controller 6 to heat the heater 3 and perform resistive measurements, i.e., to measure an electrical conductivity and/or resistivity of the porous sensing layer 1 by means of the electrodes 2 that are electrically connected to the controller 6.
[0078] In
[0079] A recess or opening 55 is arranged in the substrate 5, preferably silicon substrate. A bridge structure 56 extends over the recess or opening 55 and is anchored in the substrate 5. The bridge structure 56 includes individual bridges 52, 53, 54 spanning this opening or recess 55. Each bridge 52, 53, 54 comprises a central region 57 forming a hotplate 58 and two arms 59 extending between the central region 57 and the substrate 5, thereby suspending the hotplate 58 over the recess or opening 55.
[0080] Each of the bridge structures 56 forms a thin structure with a hotplate. By spanning the recess or opening 55 by means of a bridge and not a continuous thin film cover, the thermal conductance between the hotplate and the substrate 5 is reduced, thus allowing high temperatures to be achieved at low operating power. Further, the thermal mass is reduced, which allows to vary the temperature of the hotplate quickly.
[0081] The gas sensor comprises a set of sensing layers 1, 1a and 1b electrically separated from each other. Each sensing layer 1, 1a, 1b is arranged on a dedicated hotplate 58. Each of the sensing layers 1, 1a and 1b comprises a MOX material. The MOX material changes at least one electrical property as a function of the composition of the gas reaching it. The change of the property can be measured in order to obtain information on said composition.
[0082] Preferably, at least one of the sensing layers, e.g., the sensing layer 1, is the porous sensing layer 1 as introduced in the previous embodiments, while the other sensing layers 1a, 1b may, for instance, also show different properties as to the presence, the absence, the property of a coating, the porosity, a thickness, the material etc. Thus, several configurations can be contemplated, which enable selectivity of the sensed molecules.
[0083] The MOX material of each of the sensing layers 1, 1a, 1b is in electrical communication with a subset of electrodes, which are not visible in
[0084] The present approach makes it possible to clearly distinguish concentrations of the target gas/es from other, non-target gases to which the gas sensor according to the present invention may be exposed. For the following plots in
[0085] In detail,
[0086] In terms of quantitatively describing the effect, the selectivity of hydrogen versus the other gases is more than 100:1, meaning that when exposed to a given concentration, hydrogen effects a bigger change in the resistance of the porous sensing layer represented by the sensing signal than when exposed to a hundredfold increased concentration of any of the other gases listed. For instance, the dashed line shows that 0.3 ppm of hydrogen effect a larger signal (more resistance drop) than 30 ppm of any of the other gases. A cross-sensitivity to the other reducing gases is thus designed to be very low.
[0087] In the upper chart of
[0088] Presently, the resistance measured in the upper chart of roughly 700 kOhm rather stems from the continuous background concentration of H2 in the gas mixing system, i.e., 0.5 ppm (see
[0089] The upper chart of
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[0091] According to another aspect, the invention can further be embodied as a method of operating a resistive MOX gas sensor. Main aspects are briefly discussed in reference to
[0092] As discussed earlier, the porous sensing layer is preferably heated to a temperature that is between 400° C. and 600° C. In particular, one may, while heating the coated patch, want to maintain a temperature of the coated patch at a desired value. This can notably be achieved thanks to a feedback loop mechanism. This, of course, does not preclude the possibility to occasionally heat the sensor for shorter periods to the target temperature, i.e., intermittent heating.
[0093] The above embodiments have been succinctly described in reference to the accompanying drawings and may accommodate a number of variants. Several combinations of the above features may be contemplated.