Wearable device with detune-resilient antenna
11336975 · 2022-05-17
Assignee
Inventors
Cpc classification
H04R1/1091
ELECTRICITY
H01Q9/0407
ELECTRICITY
H04R1/1041
ELECTRICITY
H04R1/02
ELECTRICITY
H01Q9/42
ELECTRICITY
International classification
H04R1/02
ELECTRICITY
H04R1/10
ELECTRICITY
Abstract
A wearable device, such as an earphone, may include a conformal antenna that is resilient to performance degradation due to user-interactions and manufacturing process variances. The antenna may comprise one or more surfaces suitable for receiving and transmitting electromagnetic signals, wherein the one or more surfaces of the antenna may be non-parallel with a ground plane and a user-interactable surface, thereby minimizing image current cancellation and coupling between the antenna and a user finger during user interactions with the user-interactable surface.
Claims
1. A wireless earphone, comprising: a main body comprising an encasing, a battery, and a ground plane; an antenna comprising a plurality of surfaces conforming in shape with a semi-circular region of the encasing, wherein one or more surfaces of the plurality of surfaces is non-parallel with the ground plane, and wherein a surface of the plurality of surfaces is adjacent to and non-parallel with one or more other surfaces of the plurality of surfaces; a conducting structure situated between the ground plane and the antenna, wherein the conducting structure is electrically connected to the ground plane; and one or more conducting components affixed to the conducting structure.
2. The wireless earphone of claim 1, wherein the antenna further comprises a tapered end comprising a tapering corresponding to a slanted angle, and wherein the tapered end is configured to increase an operating bandwidth of the antenna.
3. The wireless earphone of claim 1, wherein the conducting structure is electrically connected to the ground plane via an impedance network comprising one of: an inductor or a ferrite bead with a maximum impedance at a resonance frequency of the antenna; or an inductor with a self-resonance frequency corresponding to a resonance frequency of the antenna.
4. The wireless earphone of claim 1, wherein the one or more conducting components comprise one or more of a micro-electromechanical-system (MEMS) microphone, surface-mount-device (SMD) components, or traces.
5. The wireless earphone of claim 1, wherein a cross-section of the antenna comprises one or more curves, wherein each of the one or more curves are connected with each other at right angles or obtuse angles.
6. The wireless earphone of claim 1, further comprising a feedline, wherein an end of the antenna is connected to the feedline via an impedance matching network and one of (1) a pogo pin or (2) a pin and a socket.
7. The wireless earphone of claim 1, wherein the conducting structure comprises one or more of a flexible printed-circuit-board (PCB), a rigid PCB, a flat ribbon wire, a conductive laser-direct-structuring structure, or an electrically conductive component constructed with 3D printing technology.
8. An antenna structure, comprising: a ground plane; a first conducting element comprising a plurality of surfaces conforming in shape with a semi-circular region, wherein one or more surfaces of the plurality of surfaces is non-parallel with the ground plane, and wherein a surface of the plurality of surfaces is adjacent to and non-parallel with one or more other surfaces of the plurality of surfaces; and a second conducting element, situated between the ground plane and at least one of the one or more surfaces of the first conducting element.
9. The antenna structure of claim 8, the second conducting element comprises traces electrically connected to the ground plane via an impedance network comprising: an inductor or a ferrite bead with a maximum impedance at a resonance frequency of the first conducting element; or an inductor with a self-resonance frequency corresponding to a resonance frequency of the first conducting element.
10. The antenna structure of claim 8, wherein a cross-section of the first conducting element comprises one or more curves, wherein each of the one or more curves are connected with each other at right angles or obtuse angles.
11. The antenna structure of claim 8, further comprising: a conducting structure situated between the ground plane and the first conducting element, wherein the conducting structure is electrically connected to the ground plane; and one or more conducting components affixed to the conducting structure.
12. The antenna structure of claim 11, wherein the one or more conducting components comprises one or more of a MEMS microphone, SMD components, or traces.
13. The antenna structure of claim 11, wherein the conducting structure comprises one or more of a flexible PCB, a rigid PCB, a flat ribbon wire, a conductive laser-direct-structuring structure, or an electrically conductive component constructed with 3D printing technology.
14. The antenna structure of claim 8, wherein the first conducting element is connected to a feedline via an impedance matching network and one of (1) a pogo pin or (2) a pin and a socket.
15. The antenna structure of claim 8, wherein the first conducting element is electrically connected, via an impedance matching network comprising at least one of an inductor or a capacitor, to a feedline.
16. A wearable device, comprising: a main body comprising an encasing with a top surface accessible to user interactions, a battery, and a ground plane; an antenna comprising a plurality of surfaces conforming in shape with a semi-circular region of the encasing, wherein an orthogonal projection of one or more surfaces of the plurality of surfaces onto a plane that is parallel with the top surface accessible to user interactions consists of an area that is less than a physical aperture of the one or more surfaces of the plurality of surfaces, and wherein a surface of the plurality of surfaces is adjacent to and non-parallel with one or more other surfaces of the plurality of surfaces; a conducting structure situated between the ground plane and the antenna; and one or more conducting components affixed to the conducting structure.
17. The wearable device of claim 16, wherein the conducting structure is electrically connected to the ground plane via an impedance network comprising one of: an inductor or a ferrite bead with a maximum impedance at a resonance frequency of the antenna; or an inductor with a self-resonance frequency corresponding to a resonance frequency of the antenna.
18. The wearable device of claim 16, wherein the conducting structure comprises one or more of a flexible PCB, a rigid PCB, a flat ribbon wire, a conductive laser-direct-structuring structure, or an electrically conductive component constructed with 3D printing technology.
19. The wearable device of claim 16, wherein the one or more conducting components comprises one or more of a MEMS microphone, SMD components, or traces.
20. The wearable device of claim 16, wherein the antenna further comprises a tapered end configured to increase an operating frequency bandwidth of the antenna.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) Some features are shown by way of example, and not by limitation, in the accompanying drawings. In the drawings, like numerals reference similar elements.
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DETAILED DESCRIPTION
(10) The accompanying drawings, which form a part hereof, show examples of the disclosure. It is to be understood that the examples shown in the drawings and/or discussed herein are non-exclusive and that there are other examples of how the disclosure may be practiced.
(11) It is desirable that some wearable devices, such as earphones, be kept small in size, in order to facilitate their intended use. Some currently available earphones may include, among other things, an antenna for Bluetooth communication, micro-electromechanical-system (MEMS) microphones, flexible PCB and SMD components, traces, and an internal battery. These components are fit into a compact housing or encasing of the wearable device, and may be located within the near-field region of the antenna. While it would be desirable to avoid parasitic coupling between the antenna and the other device components, this can be difficult to avoid due to the limited volume of the wearable device or earphones.
(12) Another issue to contend with is the necessary presence of a conducting surface such as a ground plane within the small wearable device. The total radiated field of the conformal antenna is a sum of the contribution from the antenna and its virtual image in the ground plane. The radiated field of an antenna oriented vertically with respect to the ground plane will add constructively with the radiated field from its virtual image, however this scenario is typically difficult to achieve in small wearable devices due to volume constraints. Thus, large portions of the antenna may necessarily be oriented horizontally with respect to the ground plane, which can result in cancellation of some of the radiated field and overall degradation of antenna performance. This problem may be exacerbated by grounded parasitic elements, contained within the wearable device, that effectively function as extensions of the ground plane. Thus, choking off these parasitic elements may aid in maximizing antenna performance.
(13) Furthermore, the antenna performance may be further improved by maximizing the antenna aperture, which is herein defined as the total antenna surface area capable of receiving or transmitting electromagnetic radiation for processing by the earphone. Each antenna surface referred to herein corresponds to a surface area, wherein the sum of the surface areas of all antenna surfaces of the antenna equals the antenna aperture. Although a large antenna aperture is generally desirable, an antenna structure with a large surface area may be vulnerable to capacitive coupling from user-interactions, which may detune the antenna. Such capacitive coupling is avoidable by conforming the antenna structure to portions of side-walls of the wearable device such that capacitive coupling does not occur or is minimized.
(14) Accordingly, aspects of the disclosure are directed to a wearable device, such as an earphone, which employs a conformal antenna structure that is resistant to performance degradation due to parasitic coupling with nearby device components and detuning from user interactions occurring within its near-field region. According to particular embodiments, one or more surfaces of the antenna may be non-parallel with a user-interactable surface, thus minimizing capacitive coupling with portions of a user fingertip during a user interaction. According to some embodiments, a first surface of the antenna may extend parallel with a ground plane, a second surface of the antenna may extend away from and non-parallel to the ground plane, and a third surface of the antenna may extend towards and non-parallel to the ground plane. The antenna may comprise any number of surfaces. Furthermore, the user-interactable surface may comprise a surface that is non-parallel with some or all surfaces of the conformal antenna structure.
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(16) In some embodiments, the surface of the first conducting element 100a may comprise a single elongated conducting element that conforms in shape with a semi-circular region of a top region 130 of the earphone. The first conducting element 100a may form a semi-circle with a feedline end and tapered end, and may wrap around a portion of a circular region of the top region 130, which may be plastic top region with a surface 150 accessible to user interactions. The diameter of the semi-circle formed by the first conducting element 100a may be less than or equal to the size of a wearable device such as an earphone. Thus, the first conducting element 100a may be integrated within the earphone device while maintaining an antenna length that enables optimal device performance.
(17) Furthermore, the first conducting element 100a may conform to the shape of the top region 130 such that a surface of the first conducting element 100a lies perpendicular to both the ground plane 120 and the user-accessible surface 150. In this manner, the antenna aperture of the antenna structure can be made larger while minimizing performance degradation from image currents in the ground plane 120 and capacitive coupling with a user finger at the user-accessible surface 150, thus making efficient use of the available space.
(18) In some embodiments, an orthogonal projection of the first conducting element 100a onto a plane that is parallel with the ground plane 120 may correspond to a projected area comprising none or some of the surface area of the first conducting element 100a. An orthogonal projection of the first conducting element 100a onto a plane that is parallel with the ground plane 120 or onto a plane that is parallel with the user-accessible surface 150 may produce a projected shape with an area that is less than the physical aperture of the first conducting element 100a.
(19) The second conducting element 110 may operate as an undriven secondary antenna at the resonance frequency of the first conducting element 100a. In some embodiments, the second conducting element 110 may be located within component region 140 and may be further situated between the first conducting element 100a and the ground plane 120. The second conducting element 110 may lie on a plane that is parallel with the ground plane 120. Alternatively, the second conducting element 110 may lie on a plane that is not parallel with the ground plane 120. According to other aspects, the second conducting element 110 may be oriented such that it does not lie on a plane.
(20) In some embodiments, an orthogonal projection of the second conducting element 110 onto a plane that is parallel with the ground plane 120 may overlap with an orthogonal projection of the first conducting element 100a onto the plane. Alternatively, an orthogonal projection of the second conducting element 110 onto a plane that is parallel with the ground plane 120 may not overlap with an orthogonal projection of the first conducting element 100a onto the plane.
(21) In some embodiments, the second conducting element 110 may be located in top region 130. Alternatively, a portion of the second conducting element 110 may be located in the top region 130 and another portion of the second conducting element 110 may be located in the component region 140.
(22) The component region 140 may further contain parasitic elements such as flexible PCB and SMD components. The PCB or SMD components may be located entirely within the component region 140. Alternatively, the PCB or SMD components may be located entirely within the top region 130. According to other aspects, the PCB or SMD components may be located partially in the top region 130 and partially in the component region 140.
(23) In some embodiments, the second conducting element 110 may comprise one or more traces. For example,
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(25) In some embodiments, a cross-section of the first conducting element 100b comprises a “Z” shape with three portions corresponding to surfaces 100b-1, 100b-2, and 100b-3. A portion of the “Z” shape (e.g., 100b-1) may be oriented parallel with the ground plane 120 and the other portions of the “Z” shape (e.g., 100b-2, 100b-3) may be oriented non-parallel with the ground plane 120. Surfaces 100b-1, 100b-2, and 100b-3 may each conform in shape with a semi-circular region of the top region 130.
(26) Although not depicted in
(27) In some embodiments, an orthogonal projection of the first conducting element 100b onto a plane that is parallel with the ground plane 120 may correspond to a projected area comprising some or all of the area of the first surface 100b-1 and some or none of the area of the second and third surfaces 100b-2 and 100b-3. The projected area may be less than the physical aperture of the first conducting element 100b. Furthermore, an orthogonal projection of the first surface 100b-1 onto a plane that is parallel with the ground plane 120 may produce a projected shape with an area comprising most or all of the area of the first surface 100b-1. An orthogonal projection of either the second or third surfaces 100b-2 and 100b-3 onto a plane that is parallel with the ground plane 120 may produce a projected shape with an area comprising none or some of the area of the second or third surfaces.
(28) In some embodiments, an orthogonal projection of the first conducting element 100b onto a plane that is parallel with the user-accessible surface 150 may correspond to a projected area comprising some or all of the area of the first surface 100b-1 and some or none of the area of the second and third surfaces 100b-2 and 100b-3. The projected area may be less than the physical aperture of the first conducting element 100b. An orthogonal projection of the first surface 100b-1 onto a plane that is parallel with the user-accessible surface 150 may produce a projected shape with an area comprising most or all of the area of the first surface 100b-1. An orthogonal projection of either the second or third surfaces 100b-2 and 100b-3 onto a plane that is parallel with the user-accessible surface 150 may produce a projected shape with an area comprising none or only a partial area of the second or third surfaces.
(29) The second conducting element 110 may operate as an undriven secondary antenna at the resonance frequency of the first conducting element 100b. In some embodiments, the second conducting element 110 may be located within component region 140 and may be further situated between the first conducting element 100b and the ground plane 120.
(30) In some embodiments, an orthogonal projection of the second conducting element 110 onto a plane that is parallel with the ground plane 120 may overlap with an orthogonal projection of the first conducting element 100b onto the plane. Alternatively, an orthogonal projection of the second conducting element 110 onto a plane that is parallel with the ground plane 120 may not overlap with an orthogonal projection of the first conducting element 100b onto the plane.
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(32) Neither the second surface 100c-2 nor the third surface 100c-3 lie on a plane that is parallel with the ground plane 120. In some embodiments, a cross-section of the first conducting element 100c may comprise a z-shaped cross-section or an s-shaped cross section. The first surface 100c-1, second surface 100c-2, and third surface 100c-3 may each conform in shape with a semi-circular region of the top region 130.
(33) In some embodiments, an orthogonal projection of the first conducting element 100c onto a plane that is parallel with the ground plane 120 may correspond to a projected area comprising some or all of the area of the first surface 100c-1 and some or none of the area of the second and third surfaces 100c-2 and 100c-3. The projected area may be less than the physical aperture of the first conducting element 100c. An orthogonal projection of the first surface 100c-1 onto a plane that is parallel with the ground plane 120 may produce a projected shape with an area comprising most or all of the area of the first surface 100c-1. An orthogonal projection of either the second or third surfaces 100c-2 and 100c-3 onto a plane that is parallel with the ground plane 120 may produce a projected shape with an area comprising none or some of the area of the second or third surfaces.
(34) Furthermore, an orthogonal projection of the first conducting element 100c onto a plane that is parallel with the user-accessible surface 150 may correspond to a projected area comprising some or all of the area of the first surface 100c-1 and some or none of the area of the second and third surfaces 100c-2 and 100c-3. An orthogonal projection of the first surface 100c-1 onto a plane that is parallel with the user-accessible surface 150 may produce a projected shape with an area comprising most or all of the area of the first surface 100c-1. An orthogonal projection of either the second or third surfaces 100c-2 and 100c-3 onto a plane that is parallel with the user-accessible surface 150 may produce a projected shape with an area comprising none or only a partial area of the second or third surfaces.
(35) The second conducting element 110 may operate as an undriven secondary antenna at the resonance frequency of the first conducting element 100c. In some embodiments, the second conducting element 110 may be located within component region 140 and may be further situated between the first conducting element 100c and the ground plane 120.
(36) In some embodiments, an orthogonal projection of the second conducting element 110 onto a plane that is parallel with the ground plane 120 may overlap with an orthogonal projection of the first conducting element 100c onto the plane. Alternatively, an orthogonal projection of the second conducting element 110 onto a plane that is parallel with the ground plane 120 may not overlap with an orthogonal projection of the first conducting element 100c onto the plane.
(37) According to further aspects, a diameter of the semi-circular region of the first conducting element may be between 5 mm and 15 mm. In some aspects, the first conducting element may further conform to a spiral shape. For example, the diameter of the semi-circular region may vary with azimuth along the length of the first conducting element. Furthermore, a distance between a location of the first conducting element and the ground plane may be different than another distance between another location of the first conducting element and the ground plane.
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(39) Parasitic elements may comprise flexible PCB and SMD components. Acoustic sealing elements 230a and 230b may be situated near the first conducting element 100c. For the purposes of this disclosure, “near” refers to the near-field of the antenna. Acoustic sealing elements 230a and 230b may each comprise closed cell urethane foam, pressure sensitive adhesive, and a layer of hydrophobic cloth to reduce the likelihood of moisture ingress. The acoustic sealing elements 230a and 230b may each cover, and thus may be located adjacent to, a MEMS microphone (depicted in
(40) The characteristics of the first conducting element 100c may be chosen such that the placement of the MEMS microphones within the antenna near-field has minimal effect on loading and detuning the first conducting element 100c. In other aspects, the acoustic sealing elements and MEMS microphones may be located within the component region 140 or may alternatively be located within the top region 130. In yet other aspects, the acoustic sealing elements and MEMS microphones may be partially located within the top region 130 and partially located within the component region 140. The MEMS microphones may be situated near the first conducting element 100c.
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(42) In some embodiments, a cross-section of the antenna, which comprises the four surfaces, comprises one or more curves connected at either right angles or obtuse angles. The four surfaces 300-1, 300-2, 300-3, and 300-4 may each conform in shape with a semi-circular region.
(43) In some embodiments, an orthogonal projection of the antenna structure onto a plane that is parallel with the ground plane 320 may correspond to a projected area comprising none, some, or all of the combined surface area of the surfaces 300-1, 300-2, 300-3, and 300-4.
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(45) In still other embodiments, the traces may not be choked off by the decoupling network 400. The decoupling network may comprise an inductor with an inductance selected so that the traces function as an undriven secondary antenna at the resonance frequency of the first conducting element 420. An impedance of the decoupling network 400 may be chosen such that a resonance frequency associated with the parasitic elements (i.e., traces, PCB components, MEMS microphone) corresponds to a resonance frequency of the antenna (i.e., first conducting element 420). In this manner, performance degradation of the first conducting element 420 due to the virtual image of the ground may be minimized.
(46) Further depicted in
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(50) Microphones, such as MEMS microphone 720a and 720b may be positioned to capture audio. In some embodiments, MEMS microphones 720a and 720b may capture the voice of the wearer, for example, when the wearer is speaking during a phone call or when the wearer is providing voice commands to interact with an audio source, such as a music player. The MEMS microphones 720a and 720b may be used in beam forming to better capture the wearer's voice. In addition, the MEMS microphones 720a and 720b may capture external noise, such as wind noise or interfering speech, and the signal from the MEMS microphones 720a and 720b may be used in noise suppression processing. In some embodiments, MEMS microphones 720a and 720b are affixed to conductive component 410.
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(52) Although examples are described above, features and/or steps of those examples may be combined, divided, omitted, rearranged, revised, and/or augmented in any desired manner. Various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this description, though not expressly stated herein, and are intended to be within the spirit and scope of the disclosure. Accordingly, the foregoing description is by way of example only, and is not limiting.